CDMOS200

DMOS200

VMOS200

CVMOS200

6. Re-install choke cover to door panel by pushing.

Note: After any service to the door;

(A)Make sure that door sensing switch and secondary interlock switch are operating properly. (Refer to chapter “Test Procedures”.).

(B)An approved microwave survey meter should be used to assure compliance with proper microwave radiation emission limitation standards.

After any service, make sure of the following :

1.Door latch heads smoothly catch latch hook through latch holes and that latch head goes through center of latch hole.

2.Deviation of door alignment from horizontal line of cavity face plate is to be less than 1.0mm.

3.Door is positioned with its face pressed toward cavity face plate.

4.Check for microwave leakage around door with an approved microwave survey meter. (Refer to Microwave Measurement Procedure.)

Note: The door on a microwave oven is designed to act as an electronic seal preventing the leakage of microwave energy from oven cavity during cook cycle. This function does not require that door be air- tight, moisture (condensation)-tight or light-tight. Therefore, occasional appearance of moisture, light or sensing of gentle warm air movement around oven door is not abnormal and do not of themselves indicate a leakage of microwave energy from oven cavity.

Figure C-5. Door Replacement

SEALER FILM

Installation

1.Put the adhesive tape on the backing film of the sealer film as shown in Fig. C-6.

2.Tear the backing film by pulling the adhesive tape.

3.Put the pasted side of the sealer film on the door panel

Figure C-6. Sealer film

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Viking CDMOS200, CVMOS200 service manual Sealer Film, After any service, make sure of the following, Installation
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CVMOS200, CDMOS200, DMOS200, VMOS200 specifications

The Viking VMOS200, DMOS200, CDMOS200, and CVMOS200 are advanced products designed for telecommunications and power management applications. Each model showcases unique features and technologies that make them stand out in their respective fields.

The VMOS200 is built on the vertical MOSFET technology, allowing for optimized performance in high-power applications. This device excels in switching capabilities and minimizing conduction losses, leading to improved efficiency. The VMOS200 is ideal for use in power amplifiers and high-frequency applications, where reliable performance and thermal stability are crucial. Its rugged design ensures that it can withstand harsh environments, making it a preferred choice for industrial and aerospace applications.

Next, the DMOS200 employs a double-diffused MOSFET technology, which enhances its thermal performance and power handling capabilities. This model is particularly effective in low-voltage applications where efficiency is paramount. The DMOS200 features a low on-resistance characteristic, allowing for reduced energy loss during operation. Its fast switching speed enables high-frequency operation, making it suitable for RF amplifiers and motor drives.

The CDMOS200 introduces a charge-balanced design, optimizing the allocation of charge carriers within the device to minimize heat generation and improve efficiency. This model is tailored for demanding applications in communications where signal integrity and power efficiency are critical. With its high breakdown voltage and robust construction, the CDMOS200 can handle more demanding operational conditions, making it popular in cellular and satellite communication systems.

Lastly, the CVMOS200 combines the advantages of vertical and charge-balanced technologies, offering a versatile solution for a broad range of applications. This hybrid design provides high efficiency, exceptional reliability, and enhanced thermal management. The CVMOS200 is particularly well-suited for switching power supplies and audio amplification. Its compact footprint allows for integration into space-constrained designs while maintaining high performance.

In summary, the Viking series of devices—VMOS200, DMOS200, CDMOS200, and CVMOS200—offer a range of features, technologies, and characteristics tailored to meet the demands of modern power electronics and telecommunications. With their robust designs, high efficiency, and adaptability to various applications, these devices are integral components for engineers and designers looking to create cutting-edge technological solutions.
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