MicroBlaze Development Kit Spartan-3E 1600 Edition User Guide 103
UG257 (v1.1) December 5, 2007 www.xilinx.com
Additional Design Details
R
xDensity migration between smaller- and larger-density SPI Flash PROMs. Not all
SPI Flash densities are available in all packages. The SPI Flash migration strategy
follows nicely with the pinout migration provided by Xilinx FPGAs.
xConsistent configuration PROM layout when migrating between FPGA densities.
The Spartan-3E FPGA’s FG320 package footprint supports the XC3S500E, the
XC3S1200E, and the XC3S1600E FPGA devices without modification. The SPI Flash
multi-package layout allows comparable flexibility in the associated configuration
PROM. Ship the optimally-sized SPI Flash memory for the FPGA mounted on the
board.
xSupply security. If a certain SPI Flash density is not available in the desired package,
switch to a different package style or to a different density to secure availability.
Figure 12-19: Multi-Package Layout for the STMicroelectronics M25Pxx Family
SQWGND
VCC
HOLD
C
D
VCC
C
D
HOLD
S
Q
GND
W
(Do not connect)
(Do not connect)
Pin 1:
8-pin SOIC
8-lead MLP
Pin 1:
16-pin SOIC
UG257_12_19_060806