142 MicroBlaze Development Kit Spartan-3E 1600 Edition User Guide
www.xilinx.com UG257 (v1.1) December 5, 2007
Appendix A: Schematics R
FPGA Configurations Settings, Platform Flash PROM, SPI Serial Flash, JTAG Connections
IC10MISC represents the various FPGA configuration connections.
IC11 is a 4Mbit XCF04S Platform Flash PROM. Landing pads for a second XCF04S PROM
is shown as IC13, although the second PROM is not mounted on the XC3S500E version of
the board. Resistor R100 jumpers over the JTAG chain, bypassing the second XCF04S
PROM.
Jumper header J30 selects the FPGA’s configuration mode. See Table 4-1, page 25 for
additional information.
Header J28 is an alternate JTAG header.
IC12 is a Maxim/Dallas Semiconductor DS2432 SHA-1 EEPROM. See Chapter 17, “DS2432
1-Wire SHA-1 EEPROM,” for more information.
IC14 and IC15 are alternate landing pads for the STMicro SPI serial Flash. IC14 accepts the
16-pin SOIC package option, while IC15 accepts either the 8-pin SOIC or MLP package
option. See Figure12-19, pag e 103 for additional informaton.