Dual Channel Interleaved Mode Configurations

Development Kit Hardware Features—Intel Core 2 Duo Processor and Intel Q35 Express Chipset

•Non-ECC DDR2 (667/800)

•512Mb, 1Gb and 2Gb technology

•4 DIMMs, 4GB maximum per channel, 8GB total memory

•Dual channel (Interleaved) mode. This mode offers the highest throughput for real world applications. Dual channel mode is enabled when the installed memory capacities of both DIMM channels are equal. Technology and device width can vary from one channel to the other but the installed memory capacity for each channel must be equal. If different speed DIMMs is used between channels, the slowest memory timing will be used.

•Single channel (Asymmetric) mode. This mode is equivalent to single channel bandwidth operation for real world applications. This mode is used when only a single DIMM is installed or the memory capacities are unequal. Technology and device width can vary from one channel to the other. If different speed DIMMs is used between channels, the slowest memory timing will be used.

Figure 3 illustrates the memory channel and DIMM configuration.

Figure 3. Memory Channel and DIMM Configuration

Channel A DIMM 0

Channel A DIMM 1

Channel B DIMM 0

Channel B DIMM 1

2.5.1Dual Channel (Interleaved) Mode Configurations

Figure 4 shows a dual channel configuration using two DIMMs. In this example, the DIMM 0 sockets of both channels are populated with identical DIMMs.

	Intel® CoreTM 2 Duo Processor and Intel ® Q35 Express Chipset Development Kit
October 2007	User’s Manual
Order Number: 318476001US	15

Q35 Express, Core 2 Duo specifications

The Intel Core 2 Duo is a line of dual-core processors that was introduced by Intel in 2006. It represented a significant advancement in semiconductor design, offering improved performance and efficiency over its predecessors. The Core 2 Duo processors were built on Intel's 65nm manufacturing process and later transitioned to a 45nm process, allowing for higher clock speeds and lower power consumption.

One of the main features of the Core 2 Duo is its dual-core architecture. This allows the processor to handle multiple tasks simultaneously, enhancing multitasking capabilities. It is equipped with features such as Intel's Smart Cache, which optimizes the efficiency of memory usage by allowing both cores to access the cache. The processors also support Intel's Enhanced SpeedStep technology, which dynamically adjusts voltage and frequency according to workload, contributing to energy savings.

In terms of performance, the Core 2 Duo is capable of delivering high processing power for a wide range of applications, from everyday computing tasks to more demanding workloads like multimedia editing. The architecture supports 64-bit processing, enabling the use of more than 4GB of RAM, a significant improvement for performance-intensive applications.

The Q35 Express chipset complemented the Core 2 Duo processors, offering enhanced graphics capabilities through Intel's GMA X3100 integrated graphics. This chipset supports various technologies, including Intel vPro, which provides manageability features for enterprise users and enhances security. The Q35 Express also facilitates support for Intel’s Active Management Technology, allowing IT departments to remotely manage computers, even when powered off.

Furthermore, the Q35 Express chipset supports numerous connectivity and expansion options. It includes support for Intel High Definition Audio, providing a high-quality audio experience, and offers multiple PCI Express lanes for graphics and other expansion cards. The chipset supports up to 8 USB ports and SATA interface for connecting storage devices, making it well-suited for both consumer and business applications.

Overall, the Intel Core 2 Duo processors, along with the Q35 Express chipset, provide a robust and reliable platform suitable for a variety of uses. Their combination of dual-core performance, energy efficiency, and enhanced graphics support ensures that they continue to be relevant for many users well beyond their initial launch.