Intel Core 2 Duo, Q35 Express user manual Content Overview, Text Conventions

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Intel Core 2 Duo Processor and Intel Q35 Express Chipset—About This Manual

1.0About This Manual

This user’s manual describes the use of the Intel® Q35 Express Chipset Development Kit. This manual has been written for OEMs, system evaluators, and embedded system developers. All jumpers, headers, LED functions, and their locations on the board, along with subsystem features and POST codes, are defined in this document.

For the latest information about the Intel® Q35 Express Chipset Development Kit reference platform, visit:

http://developer.intel.com/design/intarch/devkits/ index.htm?iid=embed_body+devkits

For design documents related to this platform, such as schematics and layout, please contact your Intel Representative.

1.1Content Overview

Chapter 1.0, “About This Manual”

This chapter contains a description of conventions used in this manual. The last few sections explain how to obtain literature and contact customer support.

Chapter 2.0, “Development Kit Hardware Features”

This chapter provides information on the development kit features and the board capability. This includes the information on board component features, jumper settings, pin-out information for connectors and overall development kit board capability.

Chapter 3.0, “Setting Up and Configuring the Development Kit”

This chapter provides instructions on how to configure the evaluation board and processor assembly by setting BTX heatsink, jumpers, connecting peripherals, providing power, and configuring the BIOS.

1.2Text Conventions

The following notations may be used throughout this manual.

#

The pound symbol (#) appended to a signal name indicates that

 

the signal is active low.

Variables

Variables are shown in italics. Variables must be replaced with

 

correct values.

Instructions

Instruction mnemonics are shown in uppercase. When you are

 

programming, instructions are not case-sensitive. You may use

 

either upper-case or lower-case.

Numbers

Hexadecimal numbers are represented by a string of

 

hexadecimal digits followed by the character H. A zero prefix is

 

added to numbers that begin with A through F. (For example, FF

Intel® CoreTM 2 Duo Processor and Intel ® Q35 Express Chipset Development Kit

User’s Manual

October 2007

6

Order Number: 318476001US

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Contents User’s Manual OctoberOrder Number 318476-001US Contents Tables Jumpers Description USB Front Panel 1394a HeaderDate Revision Description 001 Initial releaseContent Overview Text ConventionsGlossary of Terms and Acronyms Definition Sheet 1Term Description Electronic Support Systems Support OptionsProduct Literature Additional Technical SupportIntel Literature Centers Development Kit Hardware Features Intel Q35 Express Chipset Development Kit OverviewSystem Block Diagram Board FeaturesDevelopment Kit Inventory Checklists Development Kit Hardware ItemsInternal I/O headers Development Kit Board SpecificationTechnology Features/support Reference Documentation Supported Intel Technologies Sheet 1System Memory Additional FeaturesProcessor Support Supported Intel Technologies Sheet 2Dual Channel Interleaved Mode Configurations Illustrates the memory channel and Dimm configurationDual Channel Interleaved Mode Configuration with 2x DIMMs Single Channel Asymmetric Mode Configurations Dual Channel Interleaved Mode Configuration with 4x DIMMsBack-Panel Connectors Audio-ConnectorsThis audio jack is use for microphone input USB port supports the USB 1.1/2.0 specification 2 RJ-45 LAN Connector with Integrated LEDsCoaxial S/PDIF In/Out Connector USB PortExtended Debug Probe XDP Debug FeaturesPower LEDs Port 80 Post Code LEDsVoltage Reference detail Development Kit Major Connectors and JumpersVoltage Reference Voltage Rail Expected Voltage3 1394a Header Jumper FunctionsUSB 2.0 Front Panel USB Front PanelSPI Removal / Installation Technique HeaderSPI Device Installation SPI Device RemovalClose the cover Place the fresh IC intoInstalling Board Standoffs OverviewMounting Hole Locations BTX Heatsink Setup with SRM SRM Alignment on any BTX BoardBTX board alignment on SRM Board Setup and Configuration before Boot Tightening Heatsink on the SRM and BoardCPU Fan location Post Codes Definitions Normal Post CodesCopy main Bios into system memory Restore Cpuid value to register. Bootblock runtime moduleMain Bios runtime code is to be decompressed Disable Atapi hardware. Jump back to checkpoint E9Set up boot strap processor for Post Early CPU Init Start. Disable cache and init local ApicSet up boot strap processor information Enumerate and set up application processorsLog errors encountered during Post Initialize IPL devices controlled by Bios and option ROMsGenerate and write contents of Escd in Nvram Display errors and prompt for user responseOrder Number 318476001US

Q35 Express, Core 2 Duo specifications

The Intel Core 2 Duo is a line of dual-core processors that was introduced by Intel in 2006. It represented a significant advancement in semiconductor design, offering improved performance and efficiency over its predecessors. The Core 2 Duo processors were built on Intel's 65nm manufacturing process and later transitioned to a 45nm process, allowing for higher clock speeds and lower power consumption.

One of the main features of the Core 2 Duo is its dual-core architecture. This allows the processor to handle multiple tasks simultaneously, enhancing multitasking capabilities. It is equipped with features such as Intel's Smart Cache, which optimizes the efficiency of memory usage by allowing both cores to access the cache. The processors also support Intel's Enhanced SpeedStep technology, which dynamically adjusts voltage and frequency according to workload, contributing to energy savings.

In terms of performance, the Core 2 Duo is capable of delivering high processing power for a wide range of applications, from everyday computing tasks to more demanding workloads like multimedia editing. The architecture supports 64-bit processing, enabling the use of more than 4GB of RAM, a significant improvement for performance-intensive applications.

The Q35 Express chipset complemented the Core 2 Duo processors, offering enhanced graphics capabilities through Intel's GMA X3100 integrated graphics. This chipset supports various technologies, including Intel vPro, which provides manageability features for enterprise users and enhances security. The Q35 Express also facilitates support for Intel’s Active Management Technology, allowing IT departments to remotely manage computers, even when powered off.

Furthermore, the Q35 Express chipset supports numerous connectivity and expansion options. It includes support for Intel High Definition Audio, providing a high-quality audio experience, and offers multiple PCI Express lanes for graphics and other expansion cards. The chipset supports up to 8 USB ports and SATA interface for connecting storage devices, making it well-suited for both consumer and business applications.

Overall, the Intel Core 2 Duo processors, along with the Q35 Express chipset, provide a robust and reliable platform suitable for a variety of uses. Their combination of dual-core performance, energy efficiency, and enhanced graphics support ensures that they continue to be relevant for many users well beyond their initial launch.