Intel Q35 Express, Core 2 Duo user manual Contents

Page 3

Contents—Intel Core 2 Duo Processor and Intel Q35 Express Chipset

Contents

1.0 About This Manual

6

1.1

Content Overview

6

1.2

Text Conventions

6

1.3

Glossary of Terms and Acronyms

7

1.4

Support Options

8

 

1.4.1

Electronic Support Systems

8

 

1.4.2

Additional Technical Support

8

1.5

Product Literature

8

2.0 Development Kit Hardware Features

10

2.1

Intel® Q35 Express Chipset Development Kit Overview

10

2.2

System Block Diagram

11

2.3

Development Kit Inventory Checklists

12

2.4

Processor Support

14

2.5

System Memory

14

 

2.5.1 Dual Channel (Interleaved) Mode Configurations

15

 

2.5.2 Single Channel (Asymmetric) Mode Configurations

17

2.6

Back-Panel Connectors

18

 

2.6.1

Audio-Connectors

18

 

2.6.2 RJ-45 LAN Connector with Integrated LEDs

19

 

2.6.3

USB Port

19

 

2.6.4 Coaxial S/PDIF In/Out Connector

19

 

2.6.5

eSATA Port

19

2.7

Debug Features

20

 

2.7.1

Extended Debug Probe (XDP)

20

 

2.7.2

Power LEDs

20

 

2.7.3 Port 80 POST Code LEDs

20

 

2.7.4

Voltage Reference

21

2.8

Development Kit Major Connectors and Jumpers

21

 

2.8.1

Jumper Functions

22

 

2.8.2 USB 2.0 Front Panel

22

 

2.8.3

1394a Header

22

2.9

SPI Removal / Installation Technique

23

 

2.9.1

SPI Device Removal

24

 

2.9.2

SPI Device Installation

24

3.0 Setting Up and Configuring the Development Kit

26

3.1

Overview

26

3.2

Installing Board Standoffs

26

3.3

BTX Heatsink Setup with SRM

28

 

3.3.1 SRM Alignment on any BTX Board

28

3.4

Board Setup and Configuration before Boot

30

3.5

Post Codes Definitions

32

 

3.5.1

Normal Post Codes

32

Figures

1

Board Features

11

2

Intel® Q35 Express Chipset Development Kit block diagram

12

3

Memory Channel and DIMM Configuration

15

4

Dual Channel (Interleaved) Mode Configuration with 2x DIMMs

16

5

Dual Channel (Interleaved) Mode Configuration with 3x DIMMs

16

 

Intel® CoreTM 2 Duo Processor and Intel ® Q35 Express Chipset Development Kit

October 2007

User’s Manual

Order Number: 318476-001US

3

Image 3
Contents October User’s ManualOrder Number 318476-001US Contents Jumpers Description USB Front Panel 1394a Header Tables001 Initial release Date Revision DescriptionText Conventions Content OverviewGlossary of Terms and Acronyms Definition Sheet 1Term Description Additional Technical Support Support OptionsProduct Literature Electronic Support SystemsIntel Literature Centers Intel Q35 Express Chipset Development Kit Overview Development Kit Hardware FeaturesBoard Features System Block DiagramDevelopment Kit Hardware Items Development Kit Inventory ChecklistsSupported Intel Technologies Sheet 1 Development Kit Board SpecificationTechnology Features/support Reference Documentation Internal I/O headersSupported Intel Technologies Sheet 2 Additional FeaturesProcessor Support System MemoryIllustrates the memory channel and Dimm configuration Dual Channel Interleaved Mode ConfigurationsDual Channel Interleaved Mode Configuration with 2x DIMMs Dual Channel Interleaved Mode Configuration with 4x DIMMs Single Channel Asymmetric Mode ConfigurationsBack-Panel Connectors Audio-ConnectorsThis audio jack is use for microphone input USB Port 2 RJ-45 LAN Connector with Integrated LEDsCoaxial S/PDIF In/Out Connector USB port supports the USB 1.1/2.0 specificationPort 80 Post Code LEDs Debug FeaturesPower LEDs Extended Debug Probe XDPVoltage Rail Expected Voltage Development Kit Major Connectors and JumpersVoltage Reference Voltage Reference detailUSB Front Panel Jumper FunctionsUSB 2.0 Front Panel 3 1394a HeaderHeader SPI Removal / Installation TechniqueSPI Device Removal SPI Device InstallationPlace the fresh IC into Close the coverOverview Installing Board StandoffsMounting Hole Locations SRM Alignment on any BTX Board BTX Heatsink Setup with SRMBTX board alignment on SRM Tightening Heatsink on the SRM and Board Board Setup and Configuration before BootCPU Fan location Normal Post Codes Post Codes DefinitionsDisable Atapi hardware. Jump back to checkpoint E9 Restore Cpuid value to register. Bootblock runtime moduleMain Bios runtime code is to be decompressed Copy main Bios into system memoryEnumerate and set up application processors Early CPU Init Start. Disable cache and init local ApicSet up boot strap processor information Set up boot strap processor for PostDisplay errors and prompt for user response Initialize IPL devices controlled by Bios and option ROMsGenerate and write contents of Escd in Nvram Log errors encountered during PostOrder Number 318476001US

Q35 Express, Core 2 Duo specifications

The Intel Core 2 Duo is a line of dual-core processors that was introduced by Intel in 2006. It represented a significant advancement in semiconductor design, offering improved performance and efficiency over its predecessors. The Core 2 Duo processors were built on Intel's 65nm manufacturing process and later transitioned to a 45nm process, allowing for higher clock speeds and lower power consumption.

One of the main features of the Core 2 Duo is its dual-core architecture. This allows the processor to handle multiple tasks simultaneously, enhancing multitasking capabilities. It is equipped with features such as Intel's Smart Cache, which optimizes the efficiency of memory usage by allowing both cores to access the cache. The processors also support Intel's Enhanced SpeedStep technology, which dynamically adjusts voltage and frequency according to workload, contributing to energy savings.

In terms of performance, the Core 2 Duo is capable of delivering high processing power for a wide range of applications, from everyday computing tasks to more demanding workloads like multimedia editing. The architecture supports 64-bit processing, enabling the use of more than 4GB of RAM, a significant improvement for performance-intensive applications.

The Q35 Express chipset complemented the Core 2 Duo processors, offering enhanced graphics capabilities through Intel's GMA X3100 integrated graphics. This chipset supports various technologies, including Intel vPro, which provides manageability features for enterprise users and enhances security. The Q35 Express also facilitates support for Intel’s Active Management Technology, allowing IT departments to remotely manage computers, even when powered off.

Furthermore, the Q35 Express chipset supports numerous connectivity and expansion options. It includes support for Intel High Definition Audio, providing a high-quality audio experience, and offers multiple PCI Express lanes for graphics and other expansion cards. The chipset supports up to 8 USB ports and SATA interface for connecting storage devices, making it well-suited for both consumer and business applications.

Overall, the Intel Core 2 Duo processors, along with the Q35 Express chipset, provide a robust and reliable platform suitable for a variety of uses. Their combination of dual-core performance, energy efficiency, and enhanced graphics support ensures that they continue to be relevant for many users well beyond their initial launch.