Intel Core 2 Duo, Q35 Express BTX Heatsink Setup with SRM, SRM Alignment on any BTX Board

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Intel Core 2 Duo Processor and Intel Q35 Express Chipset—Setting Up and Configuring the Development Kit

Figure 18. Mounting the Standoff for BTX Heatsink

3.3BTX Heatsink Setup with SRM

This section describes BTX casing which uses “Support and Retention Module (SRM)” as shown in Figure 19.

Note: SRM is not included in this development kits.

Figure 19. Casing with “Support and Retention Module”

3.3.1SRM Alignment on any BTX Board

Attach the BTX Thermal Module Assembly (TMA) over the processor to the Support and Retention Module (SRM) by following procedures described below.

Intel® CoreTM 2 Duo Processor and Intel ® Q35 Express Chipset Development Kit
User’s Manual	October 2007
28	Order Number: 318476001US

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Contents User’s Manual OctoberOrder Number 318476-001US Contents Tables Jumpers Description USB Front Panel 1394a HeaderDate Revision Description 001 Initial releaseContent Overview Text ConventionsDefinition Sheet 1 Glossary of Terms and AcronymsTerm Description Support Options Product LiteratureElectronic Support Systems Additional Technical SupportIntel Literature Centers Development Kit Hardware Features Intel Q35 Express Chipset Development Kit OverviewSystem Block Diagram Board FeaturesDevelopment Kit Inventory Checklists Development Kit Hardware ItemsDevelopment Kit Board Specification Technology Features/support Reference DocumentationInternal I/O headers Supported Intel Technologies Sheet 1Additional Features Processor SupportSystem Memory Supported Intel Technologies Sheet 2Dual Channel Interleaved Mode Configurations Illustrates the memory channel and Dimm configurationDual Channel Interleaved Mode Configuration with 2x DIMMs Single Channel Asymmetric Mode Configurations Dual Channel Interleaved Mode Configuration with 4x DIMMsAudio-Connectors Back-Panel ConnectorsThis audio jack is use for microphone input 2 RJ-45 LAN Connector with Integrated LEDs Coaxial S/PDIF In/Out ConnectorUSB port supports the USB 1.1/2.0 specification USB PortDebug Features Power LEDsExtended Debug Probe XDP Port 80 Post Code LEDsDevelopment Kit Major Connectors and Jumpers Voltage ReferenceVoltage Reference detail Voltage Rail Expected VoltageJumper Functions USB 2.0 Front Panel3 1394a Header USB Front PanelSPI Removal / Installation Technique HeaderSPI Device Installation SPI Device RemovalClose the cover Place the fresh IC intoInstalling Board Standoffs OverviewMounting Hole Locations BTX Heatsink Setup with SRM SRM Alignment on any BTX BoardBTX board alignment on SRM Board Setup and Configuration before Boot Tightening Heatsink on the SRM and BoardCPU Fan location Post Codes Definitions Normal Post CodesRestore Cpuid value to register. Bootblock runtime module Main Bios runtime code is to be decompressedCopy main Bios into system memory Disable Atapi hardware. Jump back to checkpoint E9Early CPU Init Start. Disable cache and init local Apic Set up boot strap processor informationSet up boot strap processor for Post Enumerate and set up application processorsInitialize IPL devices controlled by Bios and option ROMs Generate and write contents of Escd in NvramLog errors encountered during Post Display errors and prompt for user responseOrder Number 318476001US

Q35 Express, Core 2 Duo specifications

The Intel Core 2 Duo is a line of dual-core processors that was introduced by Intel in 2006. It represented a significant advancement in semiconductor design, offering improved performance and efficiency over its predecessors. The Core 2 Duo processors were built on Intel's 65nm manufacturing process and later transitioned to a 45nm process, allowing for higher clock speeds and lower power consumption.

One of the main features of the Core 2 Duo is its dual-core architecture. This allows the processor to handle multiple tasks simultaneously, enhancing multitasking capabilities. It is equipped with features such as Intel's Smart Cache, which optimizes the efficiency of memory usage by allowing both cores to access the cache. The processors also support Intel's Enhanced SpeedStep technology, which dynamically adjusts voltage and frequency according to workload, contributing to energy savings.

In terms of performance, the Core 2 Duo is capable of delivering high processing power for a wide range of applications, from everyday computing tasks to more demanding workloads like multimedia editing. The architecture supports 64-bit processing, enabling the use of more than 4GB of RAM, a significant improvement for performance-intensive applications.

The Q35 Express chipset complemented the Core 2 Duo processors, offering enhanced graphics capabilities through Intel's GMA X3100 integrated graphics. This chipset supports various technologies, including Intel vPro, which provides manageability features for enterprise users and enhances security. The Q35 Express also facilitates support for Intel’s Active Management Technology, allowing IT departments to remotely manage computers, even when powered off.

Furthermore, the Q35 Express chipset supports numerous connectivity and expansion options. It includes support for Intel High Definition Audio, providing a high-quality audio experience, and offers multiple PCI Express lanes for graphics and other expansion cards. The chipset supports up to 8 USB ports and SATA interface for connecting storage devices, making it well-suited for both consumer and business applications.

Overall, the Intel Core 2 Duo processors, along with the Q35 Express chipset, provide a robust and reliable platform suitable for a variety of uses. Their combination of dual-core performance, energy efficiency, and enhanced graphics support ensures that they continue to be relevant for many users well beyond their initial launch.