IBM CMX58886CX Specifications, Physical Characteristics, Power Consumption, Operating Conditions

Specifications

Physical Characteristics

•Dimensions: 117mm L x 97mm W x 15mm H (4.6"L x 3.8"W x 0.6"H)

•Weight: Approximately 0.19 Kg (0.40 lbs.)

•PCB: 14-layer, mixed surface-mount and thru-hole

Power Consumption

Exact power consumption depends on the actual application. Table 2 lists power consumption for typical configurations and clock speeds.

Table 2 cpuModule Power Consumption

Module	Speed	RAM	Power, typ.	Power, Max.
CMX58886CX	1.0 GHz	256 or 512 MB	10.9 W	12.2 W

Operating Conditions

	Table 3	Operating Conditions
Symbol	Parameter	Test Condition	Min.	Max.
VCC5	5V Supply Voltage		4.75V	5.25V
VCC3	3.3V Supply Voltage		3.1V1	n/a
V	12V Supply Voltage		n/a2	n/a
CC12
VCC-12	-12V Supply Voltage		n/a2	n/a
VCCSTBY	5V Standby Voltage3		4.75V	5.25V
ICCSTBY	5V Standby Current3		-	500mA
Ta	Ambient Operating	Standard4	-40C	+75C
	Temperature
Ta	Ambient Operating	Extended4	-40C	+85C
	Temperature
Ts	Storage Temperature		-40C	+85C
Rh	Humidity	Non-Condensing	0	90%
MTBF	Mean Time Before	23 C	110,000
	Failure		hours

1.Because the cpuModule has an onboard +3.3V supply, an external +3.3V supply is not required. However, if a +3.3 V supply is installed in the system to power PC/104-Plusor PCI-104 expansion boards, it will be monitored by the CPU at power up.

2.The 12V and -12V rails are not used by the cpuModule. They are only connected between the bus connector and the power connector. Any requirements on these signals are driven by other components in the system.

3.5V Standby is used to power the board when the main supply is turned off (power down modes S3-S5). It is not required for board operation.

4.With proper cooling (See Thermal Management on page 65)

10 CMX58886CX cpuModule BDM-610000050 Rev A