Delta Electronics S48SP manual Leaded Sn/Pb Process Recommend TEMP. Profile

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LEADED (Sn/Pb) PROCESS RECOMMEND TEMP. PROFILE

Temperature (°C )

250

200

150

100

50

Ramp-up temp. 0.5~3.0°C /sec.

2nd Ramp-up temp. Peak temp. Pre-heat temp. 1.0~3.0°C /sec. 210~230°C 5sec.

140~180°C 60~120 sec.

Cooling down rate <3°C /sec.

Over 200°C 40~50sec.

0

60		120	180		240		300
60		120	180		240		300
		Time ( sec. )

Note: The temperature refers to the pin of S48SP, measured on the pin +Vout joint.

LEAD FREE (SAC) PROCESS RECOMMEND TEMP. PROFILE

.
Temp	Peak Temp. 240 ~ 245 ℃
	Peak Temp. 240 ~ 245 ℃
217℃		Ramp down
200℃		max. 4℃/sec.
200℃
150℃	Preheat time
	100~140 sec.	Time Limited 90 sec.
		Time Limited 90 sec.
	Ramp up	above 217℃
	Ramp up
25℃	max. 3℃/sec.
25℃		Time
		Time

Note: The temperature refers to the pin of S48SP, measured on the pin +Vout joint.

DS_S48SP05007_05222008

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Contents Features Technical Specifications ParameterElectrical Characteristics Curves Typical full load input characteristics at room temperatureFor Negative Remote On/Off Logic For Positive Remote On/Off LogicElectrical Characteristics Curves Output voltage noise and ripple measurement test setup Safety Considerations Soldering and Cleaning ConsiderationsDesign Considerations Input Source ImpedanceFeatures Descriptions Over-Temperature ProtectionOver-Current Protection Remote On/OffFeatures Descriptions CON Output Voltage AdjustmentThermal Considerations Thermal CurvesPick and Place Location Recommended PAD Layout SMDLeaded Sn/Pb Process Recommend TEMP. Profile Lead Free SAC Process Recommend TEMP. ProfileMechanical Drawing Surface-mount module Through-Hole modulePart Numbering System Model List