Compaq SMA200 user manual SmartCoreExpress Signal Groups, PCI-Express

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DIGITAL-LOGIC AG

SMA200 Manual V1.0

5.4.smartCoreExpress Signal Groups

5.4.1.PCI-Express

 

 

 

 

On Module

Ext. Ter-

Max.

 

Matched

Signal

BUS

Type

Description

Termination

mination

Length

Ohm

Length

 

 

 

 

 

Needed

in mm

 

in mm

PCIe_Tx [0-4] +/-

PCIe_Rx [0..4] +/-

PCIe_CLK[0..4] +/-

PCIe_REQ#[0..4]

PCIe

PCIe

PCIe

PCIe

Dif

Transmitter 2.5Gbit

100nF Series

Out

Connected to an Rx pin pair

Cap.

 

of the device.

 

Dif

Receiver 2.5Gbit

-

In

Connected to a Tx pin pair

 

 

of the device. The Tx output

 

 

of the device needs an AC

 

 

coupling capacitor.

 

Dif

Reference clock (100MHz)

-

Out

Connected to a Refclock pin

 

 

pair of the device.

 

3.3V

A low signal at this input will

PU

In

enable the PCI-Clk-Output

integrated in

 

of the corresponding PCI-

the CK540

 

Express lane.

 

-

Series

Cap.

100nF As 0402

-

-

200100

200100

200100

200Static

0.2

0.2

0.2

-

If the signals are not used:

All these PCI-Express signals may be left open.

Remarks:

 

Pair to Pair spacing:

35mil = 0.9mm

BUS to BUS spacing:

20mil = 0.5mm

The AC coupling capacitors must be placed near the device for the Tx signals only. The maximum number of vias per signal is less than 4.

EMV/EMI filters:

Are not needed.

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Contents SmartCore Express SMA200 SMA200 Manual About this Manual and How to Use ItInitial Version Table of Contents Trademarks PrefaceDisclaimer Environmental Protection StatementRecycling Information Limited Two Year WarrantyTechnical Support CE Conformity Explanation of SymbolsApplicable Documents and Standards RoHS Commitment For Your SafetyRoHS Compliant Production Process RoHS Compatible Product DesignWeee Application Swiss Association for Quality and Management Systems Swiss QualityOverview Standard FeaturesSpecification Technical SpecificationsIntel US15W Graphics Memory Controller Hub Specification Mathematics CoprocessorReset & Power Management Specification Intel US15W SpecificationPower Supply Specification Physical Characteristics SpecificationEMI / EMC IEC1131-2 refer MIL 461/462 Specification Operating Environment SpecificationOptions/Accessories Examples of Ordering CodesBlock Diagram Dimensions & DiagramsDesign in with the smartModule Dimensions of the smartCoreExpress ModuleConnector Placement & Pin Definition on the Carrier Board Photo of the Top Side of the PCB Component Heights between Module and Carrier Board Dimensions of the Carrier Board ConnectorSignal Terminology Descriptions COM-EXPRESS Connector DescriptionSignal Description BUS on the smartCoreExpress Connectors a / B Pins Signal SmartCoreExpress Connector PinoutType Remarks Pin Signal Type RemarksType Signal BUS TypeSignal Descriptions of the Smartcoreexpress Placing an AC Coupling Capacitor on each PCIe-TX PCI-Express SmartCoreExpress Signal GroupsSupported devices SdvoLvdsddcclk Lvdsddcdat LvdsLvdsclk + Lvdsvdden Lvdsbklctl Lvdsbklen Lvdsctlaclk On Module Ext. Ter Max Matched USBUSB Remarks EMV/EMI-filtersRemarks EMV/EMI filters Parallel ATALPCFRAME# LPC BUSLpcserirq SMBALERT# Cmos SMBusSmbdata Cmos Smbclock CmosHDA Audio Interface If the signals are not used RemarksSupported Codecs EMV/EMI filters SD / Sdio Interface If the signals are not used Remarks EMV/EMI filtersSpimiso Spimosi Spiclk SPICS# Cmos SPI BUSSata Interface Option Glantx + Glanrx + GLAN-CLK + GlanLCI Lcirst LCICantx Cmos Can / SerialCanrx Cmos 14. PM Vccrtc PWR PWR PWR SupplyParameter Condition Specification SMARTCORE-EXPRESS Connector SpecificationsSource on smartCore Part Name Part Number Tyco / AMPSMARTCORE-EXPRESS Versus Comexpress Index Coprocessor Design Dimensions