Compaq SMA200 user manual Applicable Documents and Standards

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DIGITAL-LOGIC AG

SMA200 Manual V1.0

1.9.Applicable Documents and Standards

The following publications are used in conjunction with this manual. When any of the referenced specifications are superseded by an approved revision, that revision shall apply. All documents may be obtained from their respective organizations.

￿Advanced Configuration and Power Interface Specification Revision 2.0c, August 25, 2003 Copyright © 1996-2003 Compaq Computer Corporation, Intel Corporation, Microsoft Corporation, Phoenix Technologies Ltd., Toshiba Corporation. All rights reserved. http://www.acpi.info/

￿ANSI/TIA/EIA-644-A-2001: Electrical Characteristics of Low Voltage Differential Signaling (LVDS) Interface Circuits, January 1, 2001. http://www.ansi.org/

￿ANSI INCITS 361-2002: AT Attachment with Packet Interface - 6 (ATA/ATAPI-6), November 1, 2002. http://www.ansi.org/

￿ANSI INCITS 376-2003: American National Standard for Information Technology – Serial Attached SCSI (SAS), October 30, 2003. http://www.ansi.org/

￿Audio Codec ’97 Revision 2.3 Revision 1.0, April 2002 Copyright © 2002 Intel Corporation. All rights reserved. http://www.intel.com/labs/media/audio/

￿Display Data Channel Command Interface (DDC/CI) Standard (formerly DDC2Bi) Version 1, August 14, 1998 Copyright © 1998 Video Electronics Standards Association. All rights reserved. http://www.vesa.org/summary/sumddcci.htm

￿ExpressCard Standard Release 1.0, December 2003 Copyright © 2003 PCMCIA. All rights reserved. http://www.expresscard.org/

￿IEEE 802.3-2002, IEEE Standard for Information technology, Telecommunications and information exchange between systems–Local and metropolitan area networks–Specific requirements – Part 3: Carrier Sense Multiple Access with Collision Detection (CSMA/CD) Access Method and Physical Layer Specifications. http://www.ieee.org

￿IEEE 802.3ae (Amendment to IEEE 802.3-2002), Part 3: Carrier Sense Multiple Access with Collision

Detection (CSMA/CD) Access Method and Physical Layer Specifications, Amendment: Media Access Control (MAC) Parameters, Physical Layers, and Management Parameters for 10 GB/s Operation. http://www.ieee.org

￿Intel Low Pin Count (LPC) Interface Specification Revision 1.1, August 2002 Copyright © 2002 Intel Corporation. All rights reserved. http://developer.intel.com/design/chipsets/industry/lpc.htm

￿PCI Express Base Specification Revision 1.1, March 28, 2005, Copyright © 2002-2005 PCI Special Interest Group. All rights reserved. http://www.pcisig.com/

￿PCI Express Card Electromechanical Specification Revision 1.1, March 28, 2005, Copyright © 2002- 2005 PCI Special Interest Group. All rights reserved. http://www.pcisig.com/

￿PCI Local Bus Specification Revision 2.3, March 29, 2002 Copyright © 1992, 1993, 1995, 1998, 2002 PCI Special Interest Group. All rights reserved. http://www.pcisig.com/

￿PCI-104 Specification, Version V1.0, November 2003. All rights reserved. http://www.pc104.org

￿PICMG® Policies and Procedures for Specification Development, Revision 2.0, September 14, 2004, PCI Industrial Computer Manufacturers Group (PICMG®), 401 Edgewater Place, Suite 500, Wakefield, MA 01880, USA, Tel: 781.224.1100, Fax: 781.224.1239. http://www.picmg.org/

￿Serial ATA: High Speed Serialized AT Attachment Revision 1.0a January 7, 2003 Copyright © 2000- 2003, APT Technologies, Inc, Dell Computer Corporation, Intel Corporation, Maxtor Corporation, Seagate Technology LLC. All rights reserved. http://www.sata-io.org/

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Contents SmartCore Express SMA200 SMA200 Manual About this Manual and How to Use ItInitial Version Table of Contents Environmental Protection Statement PrefaceTrademarks DisclaimerRecycling Information Limited Two Year WarrantyTechnical Support CE Conformity Explanation of SymbolsApplicable Documents and Standards RoHS Commitment For Your SafetyRoHS Compliant Production Process RoHS Compatible Product DesignWeee Application Swiss Association for Quality and Management Systems Swiss QualityOverview Standard FeaturesMathematics Coprocessor Technical SpecificationsSpecification Intel US15W Graphics Memory Controller Hub SpecificationPhysical Characteristics Specification Intel US15W SpecificationReset & Power Management Specification Power Supply SpecificationExamples of Ordering Codes Operating Environment SpecificationEMI / EMC IEC1131-2 refer MIL 461/462 Specification Options/AccessoriesBlock Diagram Dimensions & DiagramsDesign in with the smartModule Dimensions of the smartCoreExpress ModuleConnector Placement & Pin Definition on the Carrier Board Photo of the Top Side of the PCB Component Heights between Module and Carrier Board Dimensions of the Carrier Board ConnectorSignal Terminology Descriptions COM-EXPRESS Connector DescriptionSignal Description Type Remarks SmartCoreExpress Connector PinoutBUS on the smartCoreExpress Connectors a / B Pins Signal Type Remarks Pin SignalType Signal BUS TypeSignal Descriptions of the Smartcoreexpress Placing an AC Coupling Capacitor on each PCIe-TX PCI-Express SmartCoreExpress Signal GroupsSupported devices SdvoLvdsddcclk Lvdsddcdat LvdsLvdsclk + Lvdsvdden Lvdsbklctl Lvdsbklen Lvdsctlaclk Remarks EMV/EMI-filters USBOn Module Ext. Ter Max Matched USBRemarks EMV/EMI filters Parallel ATALPCFRAME# LPC BUSLpcserirq Smbclock Cmos SMBusSMBALERT# Cmos Smbdata CmosHDA Audio Interface If the signals are not used RemarksSupported Codecs EMV/EMI filters SD / Sdio Interface If the signals are not used Remarks EMV/EMI filtersSpimiso Spimosi Spiclk SPICS# Cmos SPI BUSSata Interface Option Lcirst LCI GlanGlantx + Glanrx + GLAN-CLK + LCICantx Cmos Can / SerialCanrx Cmos 14. PM Vccrtc PWR PWR PWR SupplyTyco / AMP SMARTCORE-EXPRESS Connector SpecificationsParameter Condition Specification Source on smartCore Part Name Part NumberSMARTCORE-EXPRESS Versus Comexpress Index Coprocessor Design Dimensions