Cypress CY7C1019D manual Capacitance, Thermal Resistance, AC Test Loads and Waveforms

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CY7C1019D

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Capacitance [3]

 

 

 

 

 

 

Parameter

Description

Test Conditions

Max

 

 

Unit

CIN

Input Capacitance

TA = 25°C, f = 1 MHz, VCC = 5.0V

6

 

 

 

pF

COUT

Output Capacitance

 

8

 

 

 

pF

Thermal Resistance [3]

 

 

 

 

 

 

Parameter

Description

Test Conditions

400-Mil

TSOP II

 

Unit

Wide SOJ

 

 

 

 

 

 

 

 

 

 

ΘJA

Thermal Resistance

Still Air, soldered on a 3 × 4.5 inch,

56.29

62.22

 

°C/W

 

(Junction to Ambient)

four-layer printed circuit board

 

 

 

 

 

ΘJC

Thermal Resistance

 

38.14

21.43

 

°C/W

 

(Junction to Case)

 

 

 

 

 

 

AC Test Loads and Waveforms [4]

Z = 50Ω

3.0V

OUTPUT

* CAPACITIVE LOAD CONSISTS

50 Ω

 

 

 

 

 

 

 

30 pF*

GND

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

1.5V

 

 

 

 

 

 

 

 

 

 

 

 

 

OF ALL COMPONENTS OF THE

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

TEST ENVIRONMENT

 

 

 

 

 

 

 

 

 

Rise Time: ≤ 3 ns

(a)

 

 

 

 

ALL INPUT PULSES

 

 

90%

 

 

90%

 

 

 

 

 

 

 

 

10%

 

10%

 

 

(b)Fall Time: ≤ 3 ns

High-Z characteristics:

R1 480Ω

5V

OUTPUT

 

5 pF

 

 

 

 

 

 

 

 

 

 

 

 

R2

 

 

 

 

 

INCLUDING

 

 

 

 

 

 

 

 

 

 

 

 

255Ω

 

 

 

 

 

 

 

 

 

 

 

 

 

 

JIG AND

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

SCOPE

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

(c)

Notes

3.Tested initially and after any design or process changes that may affect these parameters.

4.AC characteristics (except High-Z) are tested using the load conditions shown in Figure (a). High-Z characteristics are tested for all speeds using the test load shown in Figure (c).

Document #: 38-05464 Rev. *E

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Contents Features Logic Block DiagramFunctional Description Cypress Semiconductor CorporationPin Configuration Selection GuideTop View Industrial UnitElectrical Characteristics Over the Operating Range Maximum RatingsOperating Range Range AmbientThermal Resistance CapacitanceAC Test Loads and Waveforms Parameter Description Industrial Unit Min Max Read Cycle Data Retention Characteristics Over the Operating Range Switching WaveformsData Retention Waveform Parameter Description Conditions Min Max UnitWrite Cycle No CE Controlled 16 Write Cycle No WE Controlled, OE High During Write 16Data IO Data Valid Data IO Data in ValidTruth Table IO 0-IO Mode PowerOrdering Information Package Diagrams Pin 400-Mil Molded SOJPin Thin Small Outline Package Type II Issue Date Orig. Description of Change Document History

CY7C1019D specifications

The Cypress CY7C1019D is a high-performance static random-access memory (SRAM) chip designed for various applications requiring fast and reliable memory solutions. This RAM chip is particularly noted for its high-speed performance, low power consumption, and versatility, making it suitable for a wide range of electronic devices and systems.

One of the main features of the CY7C1019D is its fast access time, which typically ranges from 10 ns to 15 ns. This rapid access time allows for efficient data processing and fast response times in applications such as telecommunications, networking, and consumer electronics. The chip operates at standard voltages of 2.7V to 3.6V, ensuring compatibility with modern low-voltage systems while also reducing power consumption.

Another noteworthy characteristic of the CY7C1019D is its density of 1 Megabit, organized in a 128K x 8 architecture. This configuration provides ample memory space for various data storage needs, whether in embedded systems, automotive applications, or high-speed buffering. The SRAM's structure allows for simultaneous read and write operations, enhancing overall system performance.

The CY7C1019D employs advanced CMOS technology, which contributes to its low power operation. This feature is crucial for battery-powered devices and applications where energy efficiency is a priority. The chip supports a range of operating temperatures, making it suitable for both consumer and industrial applications.

Moreover, the CY7C1019D includes various useful features such as a fast burst mode for high-speed data transfer, and it supports asynchronous data rates, enhancing its adaptability across different platforms. Its simple interface allows for easy integration into existing system architectures.

The package options for the CY7C1019D include both 32-pin and 44-pin flat packages, making it accessible for different PCB layouts and design requirements. This flexibility further contributes to its wide usage in various industries, including automotive, telecommunications, and industrial control systems.

In conclusion, the Cypress CY7C1019D SRAM chip stands out as a reliable, high-speed memory component, ideal for applications demanding quick access and efficient data management. Its combination of speed, low power consumption, and versatility makes it a preferred choice for designers looking to enhance system performance and reliability.