Cypress CY62167E MoBL manual Package Diagram, Pin Tsop I 12 mm x 18.4 mm x 1.0 mm

CY62167E MoBL®

Package Diagram

Figure 7. 48-Pin TSOP I (12 mm x 18.4 mm x 1.0 mm), 51-85183

0.004[0.10]

0.008[0.21]

DIMENSIONS IN INCHES[MM] MIN.

MAX.

JEDEC # MO-142

1

0.724 [18.40]

0.787[20.00]

	0.020[0.50]
0° -5°	0.028[0.70]

N

0.472[12.00]

0.047[1.20]

MAX.

0.010[0.25]

GAUGE PLANE

0.037[0.95]

0.041[1.05]

0.020[0.50]

TYP.

0.007[0.17]

0.011[0.27]

0.002[0.05]

0.006[0.15]

SEATING PLANE 0.004[0.10]

51-85183-*A

Document #: 001-15607 Rev. *A Page 11 of 12

© Cypress Semiconductor Corporation, 2007. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.

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Use may be limited by and subject to the applicable Cypress software license agreement.

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