Cypress CY62148BN Package Diagrams, Lead 450-Mil Molded Soic, Dimensions in Inchesmm MIN, Max

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Package Diagrams

16

CY62148BN MoBL®

32-lead (450-Mil) Molded SOIC (51-85081)

1

0.546[13.868]

0.566[14.376]

0.440[11.176]

DIMENSIONS IN INCHES[MM]

MIN.

0.450[11.430]

MAX.

PACKAGE WEIGHT 1.42gms

17

0.101[2.565]

0.111[2.819]

0.050[1.270]

BSC.

 

32

0.793[20.142]

 

0.817[20.751]

0.006[0.152]

 

0.012[0.304]

0.118[2.997]

MAX.

0.004[0.102]

0.004[0.102]

MIN.

0.014[0.355]

0.020[0.508]

SEATING PLANE

PART #

S32.45 STANDARD PKG.

SZ32.45 LEAD FREE PKG.

0.047[1.193]

0.063[1.600]

0.023[0.584]

0.039[0.990]

51-85081-*B

32-Lead Thin Small Outline Package Type II (51-85095)

 

 

 

 

 

 

 

 

 

 

 

 

51-85095 **

Document #: 001-06517 Rev. *A

 

 

 

 

 

 

 

 

 

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Contents Features Logic Block DiagramFunctional Description Cypress Semiconductor CorporationPin Configuration Product PortfolioTsop CY62148BNLLElectrical Characteristics Over the Operating Range Maximum RatingsOperating Range Capacitance4Switching Characteristics5 Over the Operating Range 62148BNLL-70 Parameter Description Unit MinRead Cycle Write CycleData Retention Waveform Data Retention Characteristics Over the Operating RangeSwitching Waveforms Write Cycle No CE Controlled13 Write Cycle No WE Controlled, OE High During Write13Data I/O Data Valid Data I/O Data in Valid0-I/O Mode Power Truth TableOrdering Information Write Cycle No.3 WE Controlled, OE LOW13Package Diagrams Dimensions in Inchesmm MINLead 450-Mil Molded Soic Lead Thin Small Outline Package Type IILead Reverse Thin Small Outline Package Type II Document History REV ECN noNXR VKN