Cypress CY62148BN manual Lead Reverse Thin Small Outline Package Type II

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CY62148BN MoBL®

Package Diagrams (continued)

32-lead Reverse Thin Small Outline Package Type II (51-85138)

51-85138-**

More Battery Life is a trademark, and MoBL is a registered trademark, of Cypress Semiconductor. All products and company names mentioned in this document may be the trademarks of their respective holders.

Document #: 001-06517 Rev. *A

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© Cypress Semiconductor Corporation, 2006. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.

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Contents Logic Block Diagram FeaturesFunctional Description Cypress Semiconductor CorporationProduct Portfolio Pin ConfigurationTsop CY62148BNLLMaximum Ratings Electrical Characteristics Over the Operating RangeOperating Range Capacitance462148BNLL-70 Parameter Description Unit Min Switching Characteristics5 Over the Operating RangeRead Cycle Write CycleData Retention Characteristics Over the Operating Range Switching WaveformsData Retention Waveform Write Cycle No WE Controlled, OE High During Write13 Write Cycle No CE Controlled13Data I/O Data Valid Data I/O Data in ValidTruth Table 0-I/O Mode PowerOrdering Information Write Cycle No.3 WE Controlled, OE LOW13Dimensions in Inchesmm MIN Package DiagramsLead 450-Mil Molded Soic Lead Thin Small Outline Package Type IILead Reverse Thin Small Outline Package Type II REV ECN no Document HistoryNXR VKN
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