Cypress CY62157EV18 manual Parameter Description 55 ns Unit Min, Read Cycle, Write Cycle

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CY62157EV18 MoBL®

Switching Characteristics (Over the Operating Range) [11, 12]

 

Parameter

 

 

 

 

 

 

 

 

Description

 

55 ns

Unit

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Min

 

Max

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Read Cycle

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tRC

 

Read Cycle Time

 

55

 

 

ns

tAA

 

Address to Data Valid

 

 

55

ns

tOHA

 

Data Hold from Address Change

10

 

 

ns

tACE

 

 

1 LOW and CE2 HIGH to Data Valid

 

 

55

ns

CE

 

tDOE

 

 

 

 

LOW to Data Valid

 

 

25

ns

OE

 

tLZOE

 

 

 

 

LOW to Low-Z [13]

5

 

 

ns

OE

 

 

tHZOE

 

 

 

 

HIGH to High-Z [13, 14]

 

 

18

ns

OE

 

t

 

 

 

 

 

 

LOW and CE

HIGH to Low-Z [13]

10

 

 

ns

LZCE

 

CE

1

 

 

 

 

 

2

 

 

 

 

 

t

 

 

 

 

 

 

HIGH and CE

LOW to High-Z [13, 14]

 

 

18

ns

HZCE

 

CE

1

 

 

 

 

2

 

 

 

 

 

tPU

 

 

1 LOW and CE2 HIGH to Power Up

0

 

 

ns

CE

 

 

tPD

 

 

1 HIGH and CE2 LOW to Power Down

 

 

55

ns

CE

 

tDBE

 

 

 

 

 

 

 

 

 

 

 

55

ns

BLE/BHE LOW to Data Valid

 

tLZBE [15]

 

 

 

 

 

 

 

 

 

10

 

 

ns

BLE/BHE LOW to Low-Z [13]

 

 

tHZBE

 

 

 

 

 

 

 

 

 

 

 

18

ns

BLE/BHE HIGH to High-Z [13, 14]

 

Write Cycle [16]

 

 

 

 

 

 

 

 

 

 

 

 

 

tWC

 

Write Cycle Time

 

45

 

 

ns

tSCE

 

 

1 LOW and CE2 HIGH to Write End

35

 

 

ns

CE

 

 

tAW

 

Address Setup to Write End

35

 

 

ns

tHA

 

Address Hold from Write End

0

 

 

ns

tSA

 

Address Setup to Write Start

0

 

 

ns

tPWE

 

 

 

 

Pulse Width

 

35

 

 

ns

WE

 

 

 

tBW

 

 

 

 

 

 

 

 

 

35

 

 

ns

BLE/BHE LOW to Write End

 

 

tSD

 

Data Setup to Write End

25

 

 

ns

tHD

 

Data Hold from Write End

0

 

 

ns

tHZWE

 

 

 

 

LOW to High-Z [13, 14]

 

 

18

ns

WE

 

tLZWE

 

 

 

 

HIGH to Low-Z [13]

10

 

 

ns

WE

 

 

Notes

11.Test conditions for all parameters other than tri-state parameters assume signal transition time of 1V/ns or less, timing reference levels of VCC(typ)/2, input pulse levels of 0 to VCC(typ), and output loading of the specified IOL/IOH as shown in the “AC Test Loads and Waveforms” on page 4.

12.AC timing parameters are subject to byte enable signals (BHE or BLE) not switching when chip is disabled. Please see application note AN13842 for further clarification.

13.At any given temperature and voltage condition, tHZCE is less than tLZCE, tHZBE is less than tLZBE, tHZOE is less than tLZOE, and tHZWE is less than tLZWE for any given device.

14.tHZOE, tHZCE, tHZBE, and tHZWE transitions are measured when the output enters a high impedance state.

15.If both byte enables are toggled together, this value is 10 ns.

16.The internal write time of the memory is defined by the overlap of WE, CE = VIL, BHE and/or BLE = VIL, and CE2 = VIH. All signals must be ACTIVE to initiate a write and any of these signals can terminate a write by going INACTIVE. The data input setup and hold timing must be referenced to the edge of the signal that terminates the write.

Document #: 38-05490 Rev. *D

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Contents Product Portfolio FeaturesFunctional Description Ball Vfbga Top View Logic Block DiagramPin Configuration Maximum Ratings Electrical Characteristics Over the Operating RangeOperating Range CapacitanceThermal Resistance Data Retention Characteristics Over the Operating RangeAC Test Loads and Waveforms Data Retention WaveformWrite Cycle Parameter Description 55 ns Unit MinRead Cycle Read Cycle 1 Address Transition Controlled 17 Switching WaveformsWrite Cycle 2 CE 1 or CE 2 Controlled 16, 20 Write Cycle 1 WE Controlled 16, 20Write Cycle 4 BHE/BLE Controlled, OE LOW Write Cycle 3 WE Controlled, OE LOWTruth Table Inputs/Outputs Mode PowerOrdering Information CE1 CE2 BHE BLEBall Vfbga 6 x 8 x 1 mm Package DiagramsDocument History Issue Date Orig. Description of ChangeDocument Title CY62157EV18 MoBL 8-Mbit 512K x 16 Static RAM Document Number38-05490VKN Issue Date Orig. Description of Change 908120Added footnote #7 related to ISB2 Added footnote #12 related AC timing parameters

CY62157EV18 specifications

The Cypress CY62157EV18 is a highly advanced static random-access memory (SRAM) chip that has garnered significant attention in the embedded systems and high-speed applications space due to its innovative features and reliable performance. This memory device is designed to meet the rigorous demands of modern electronics by providing fast access speeds and low power consumption.

One of the main features of the CY62157EV18 is its high-density configuration, which offers a substantial memory capacity of 1 megabit (Mb). This capacity is often ideal for applications that require significant data storage without occupying too much physical space on the printed circuit board. The chip uses a 3.3V memory architecture, which enables compatibility with various voltage levels, making it versatile across different systems.

The device's access time is another standout characteristic, boasting a read access time of 10 to 15 nanoseconds. This incredibly fast access time allows for quicker data retrieval, which is crucial for real-time applications such as telecommunications, automotive electronics, and consumer devices. The design incorporates an improved write cycle time of 15 nanoseconds, ensuring that data can be written with minimal delay, further enhancing system performance.

Incorporating advanced CMOS technology, the CY62157EV18 achieves low power consumption while maintaining high-speed performance. It features a standby current of only 0.5 µA under a full ambient temperature range, which is particularly beneficial for battery-powered devices that demand energy efficiency. Additionally, with a wide operating temperature range from -40°C to 125°C, this memory chip is well-suited for industrial and automotive environments, where extreme temperatures can be a concern.

The device also includes full support for asynchronous SRAM operation, allowing for flexible interfacing with various microcontrollers and digital signal processors. With a simple interface that facilitates easy integration into existing designs, the CY62157EV18 offers designers the flexibility they need.

In conclusion, the Cypress CY62157EV18 is characterized by its high density, fast access speeds, low power consumption, and compatibility with a wide range of applications. Its array of features makes it an ideal choice for engineers looking to enhance performance in systems requiring reliable and efficient memory solutions. Whether in consumer electronics, automotive applications, or industrial controls, this SRAM chip continues to be a preferred option among developers seeking both performance and efficiency.