Toshiba AR-B1375 CPU Base Clock Select JP1, Dram Configuration, External Battery Connector J11

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AR-B1375/AR-B1376 User s Guide

(2) External Battery Connector (J11)

J11 allows users to connector an external 4.5 to 6 VDC battery to the AR-B1375 and AR-B1376 if the on-board battery is fully discharged. The SRAM disk will draw the battery current. The battery charger on AR-B1375 and AR-B1376 doesn’t source charge current to the external battery, which connects to J11.

1 2

1Battery+

2Battery-

Figure 3-23 J11: External Battery Connector

3.2.12 CPU Base Clock Select (JP1)

The CPU base clock (Input clock) is twice of its operation clock.

2

1

4

2

4

2

4

3

1

3

1

3

50MHz 80MHz 66.67MHz

Factory Preset

Figure 3-24 JP1: CPU Base Clock Select

3.2.13 DRAM Configuration

There is two 32-bit memory banks on the AR-B1375/AR-B1376 board. It can only put one-side DRAM SIMM to SIMM Socket (Single-Line Memory Modules), which is designed to accommodate 256KX36 bit to 4MX36-SIMMs. This provides the user with up to 32MB of main memory. The 32-bit SIMM (without parity bit) also can be used on AR-B1375/AR-B1376 board. There are six on-board memory configurations available. Please refer to the following table for details:

SIMM1

SIMM2

Total Memory

256KX32 (X36)

None

1MB

256KX32 (X36)

256KX32 (X36)

2MB

256KX32 (X36)

1MX32 (X36)

5MB

256KX32 (X36)

4MX32 (X36)

17MB

1MX32 (X36)

None

4MB

1MX32 (X36)

256KX32 (X36)

5MB

1MX32 (X36)

1MX32 (X36)

8MB

1MX32 (X36)

4MX32 (X36)

20MB

4MX32 (X36)

None

16MB

4MX32 (X36)

256KX32 (X36)

17MB

4MX32 (X36)

1MX32 (X36)

20MB

4MX32 (X36)

4MX32 (X36)

32MB

Table 3-3 DRAM Configuration

3-10

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Contents 386SX CPU Card Page Table of Contents Bios Console Specifications & SSD Types SupportedUsing Memory Banks Placement & Dimensions Programming RS-485 & IndexPreface Static Electricity Precautions OrganizationIntroduction OverviewPacking List Features System Controller MicroprocessorDMA Controller DMA ControllerKeyboard Controller Interrupt Controller1 I/O Port Address Map 2 I/O Channel Pin Assignment BusHex Range Device I/O Port Address MapI/O Channel Pin Assignments Timer REAL-TIME Clock and NON-VOLATILE RAMAddress Description Real-Time Clock & Non-Volatile RAMInterrupt Enable Register IER Serial PortReceiver Buffer Register RBR Transmitter Holding Register THRLine Control Register LCR Modem Control Register MCRLine Status Register LSR Modem Status Register MSRParallel Port Divisor Latch LS, MSRegister Address Printer Interface LogicPrinter Status Buffer Error Slct PE -ACK -BUSYPrinter Control Latch & Printer Control Swapper Page Setting UP the System OverviewSystem Setting Keyboard ConnectorPin Mini DIN Keyboard Connector CN3 AUX. Keyboard Connector J4Pin PC/104 Connector Bus C & D CN1 2 PC/104 ConnectorPin PC/104 Connector Bus a & B CN2 O Channel Signal Description Name DescriptionHard Disk IDE Connector CN4 I/O Channel Signal’s DescriptionPin Signal HDD Pin AssignmentParallel Port Connector CN6 FDD Port Connector CN5CN6 Serial Port RS-232/RS-485 Select for COM-B JP2RS-485 Terminator JP7 External RS-485 Adapter Select J6 & J7Reset Header J1 RS-232 Connector CN7 & DB2External Power LED Header J2 LED HeaderPower Connector J3 External BatteryBattery Charger Select JP3 External Speaker Header J5Dram Configuration External Battery Connector J11CPU Base Clock Select JP1 SIMM1 SIMM2Connecting the CRT Monitor VGA Setting JP5CRT/LCD Flat Panel Display IRQ 9 Used SelectCRT Connector DB1 LCD Flat Panel DisplayLCD Connector DE/E Signal from M or LP Select JP6 JP6LCD Control Connector CN9 Inverter Board DescriptionLCD Panel Display Connector CN8 Supported LCD PanelLCD Display Assignment Manufacture Model No DescriptionInstallation Utility DisketteVGA Driver WIN 3.1 DriverWIN 95 Driver StepSSD Utility RFG.EXE Write Protect Function RFGDEMO.PGFEnable the Software Write Protect Disable the Software Write ProtectHardware Write Protect Software Write ProtectWatchdog Timer Watchdog Timer SettingTime-Out Setting LEDWatchdog Timer Trigger Watchdog Timer EnabledWatchdog Timer Disabled Switch Setting Solid State DiskOverview 2 I/O Port Address Select SW1-1SSD Firmware Address Select SW1-2 DEVICE=C\DOS\EMM386.EXE X=C800-C9FFSimulate 2 Disk Drive SSD Drive Number SW1-3 & SW1-4Flash Eprom Sram ROM Type Select SW1-5 & SW1-6 Disk Drive Name ArrangementJumper Setting M1~M3 & JP4 Memory Type SettingSwitch and Jumper Setting ROM Disk InstallationUV Eprom 27Cxxx Software Programming Large Page 5V Flash DiskJP4 \PGM137X ROM pattern file name Using Tool Program Small Page 5V Flash ROM DiskTyping DOS Command RAM DiskCombination of ROM and RAM Disk \FORMAT RAM disk letter /UPage Bios Console Bios Setup OverviewStandard Cmos Setup Date & Time SetupFloppy Setup Hard Disk SetupAdvanced Cmos Setup Password Check Wait for ‘F1’ If ErrorHard Disk Delay System KeyboardAdvanced Chipset Setup Password Setting Setting PasswordPassword Checking Load Default SettingAuto Configuration with Fail Safe Setting Bios ExitSave Settings and Exit Bios UpdateFile of AMIFLASH.EXE had to Version Specifications Specifications & SSD Types SupportedSSD Types Supported Atmel SSTWinbond FujitshuUsing Memory Banks Register PortCS1 CS0 SocketPage Placement & Dimensions PlacementDimensions Programming RS-485 & Index Programming RS-485Initialize COM port Send out one character TransmitOUT &H3FC, INP%H3FC and &HFA Return Print #1, OUTCHR$OUT &H3FC, INP&H3FC and &HEF Return INPSTR$ ReturnName Function

386SX, AR-B1376, AR-B1375 specifications

The Toshiba AR-B1375 and AR-B1376 are notable embedded computing solutions that incorporate the 386SX microprocessor architecture. Designed for various applications, these models focus on reliability, performance, and versatility, making them appealing choices for system integrators and developers.

At the core of the AR-B1375 and AR-B1376 is the Intel 386SX microprocessor. This landmark processor marked a significant advancement in computing technology, introducing a 32-bit architecture while maintaining compatibility with 16-bit applications. The 386SX is known for its efficient processing capabilities, offering both multitasking support and enhanced memory management. It operates at clock speeds ranging typically from 16 MHz to 25 MHz, contributing to its effectiveness in running industrial applications.

One of the key features of the AR-B1375 and AR-B1376 systems is their modular architecture, which allows for easy customization and expansion. This modularity means users can tailor the hardware according to specific requirements, making it suitable for a wide range of applications such as automation, telecommunications, and embedded systems.

Both models support various I/O options, ensuring seamless integration with peripherals and external devices. They typically come equipped with serial and parallel ports, as well as support for modern interfaces like USB. The systems also feature onboard expansion slots, enabling the addition of further functionality, such as additional memory or specialized processing units.

In terms of memory, the AR-B1375 and AR-B1376 support a range of RAM configurations, allowing users to scale their systems based on the application demands. The inclusion of EPROM and EEPROM options also facilitates easy updates and programmability, which is crucial for embedded systems that often require firmware adjustments over time.

Moreover, these models are known for their robust thermal management features, which are essential in industrial environments where conditions can be harsh. This capability ensures stable performance and longevity, reducing the risk of system failures due to overheating or environmental factors.

To summarize, the Toshiba AR-B1375 and AR-B1376, coupled with the 386SX microprocessor, offer a blend of performance, flexibility, and reliability. Their modular design, extensive I/O support, and memory scalability make them ideal for a variety of embedded computing applications, placing them as commendable options in the world of industrial computing solutions. These systems not only exemplify Toshiba's commitment to innovation but also contribute significantly to the functionality of embedded technologies in a rapidly evolving industry.