SECTION 6
DIAGRAMS
• Circuit Boards Location
Note on Printed Wiring Board:
•X: parts extracted from the component side.
•Y: parts extracted from the conductor side.
•
: Pattern from the side which enables seeing. (The other layers' patterns are not indicated.)
Caution: |
|
Pattern face side: | Parts on the pattern face side seen from |
(Conductor Side) | the pattern face are indicated. |
Parts face side: | Parts on the parts face side seen from |
(Component Side) | the parts face are indicated. |
|
|
• Indication of transistor
Q
B C E
These are omitted.
Q
B C E
These are omitted.
Note on Schematic Diagram:
•All capacitors are in µF unless otherwise noted. pF: µµF 50 WV or less are not indicated except for electrolytics and tantalums.
•All resistors are in Ω and 1/4 W or less unless otherwise specified.
•f : internal component.
•C: panel designation.
Note: | Note: |
The components identi- | Les composants identifiés par |
fied by mark 0or dotted | une marque 0sont critiques |
line with mark 0are criti- | pour la sécurité. |
cal for safety. | Ne les remplacer que par une |
Replace only with part | pièce portant le numéro |
number specified. | spécifié. |
|
|
•Voltages and waveforms are dc with respect to ground under
no mark : CD PLAY
•Voltages are taken with a VOM (Input impedance 10 MΩ ). Voltage variations may be noted due to normal produc- tion tolerances.
•Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc- tion tolerances.
•Circled numbers refer to waveforms.
•Signal path.
J : CD PLAY
c : DIGITAL OUT
•A: B+ Line
•B: B– Line
SENSOR board
LOADING MOTOR board
BD board
POWER SW board | JUNCTION board |
KEY board
MAIN board
DISPLAY board
HEADPHONE board
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