Sanyo EP92H manual IntegratedISystem inin Board, ISB-Solo, ISB-Duo, ISB-Quad

SANYO Original technology Module technologies that achieve high-density and thinner form factors

IntegratedISystem inin Board

Integrated System in Board Process Lineup

ISB-Solo

●Thickness of only 0.45 mm (0.65 mm if resistors are included) realizes excellent thermal radiation and short development TAT

●Optimal for SiP implementation of small-scale block that includes semi-power semiconductors.

■ Assembly structure examples ■ Application example (Cell phone charger circuit block)

Integrated System in Board is a type of SiP (system in package) technology, and is a module technology that achieves high densities and thinner form factors by using SANYO's unique substrate and mounting technologies. The Integrated System in Board lineup consists of three types of process: ISB-Solo, ISB-Duo, and ISB-Quad. Which process is used is selected based on the application.

In addition to standard products, customer specified circuit blocks can also be converted to Integrated System in Board using an optimal process, thus creating a new module device in a short time.

Noise suppression effect (measured)

Reasons noise can be reduced by Integrated Sysytem in Board

●Reduced wiring area due to implementation as miniature modules

●Integration of noise reducing components

●Supply voltage stabilization by using dedicated layers for power supply and ground

Earlier mounting Integrated System in Board

			Integration of noise
			reducing components
			LSI
Integrated System in Board	Top surface	Back surface
			Dedicated power
	4.45 ⋅ 4.45 ⋅ 0.65 mm3		supply/ground layer
	Mounting area	reduced by 80%

Wiring on board Integration of noise reducing components

Microcontroller

SRAM

ISB-Duo

●Adopts unique SANYO-developed 0.2 mm thickness high-density substrate (2 layers) Line 40 ∝m / Space 40 ∝m at 25 ∝m thickness copper foil,

Via diameter 100 ∝m / Via land diameter 150 ∝m

●Thickness of only 0.53 mm (0.73 mm if resistors are included) realizes high-density mounting

●Optimal for SiP implementation of high-frequency (up to 10 GHz) blocks, blocks that require performance or EMC workarounds based on component placement/wiring pattern, and blocks that require partial high-density mounting.

■ Assembly structure examples	■ Application example (Clock detector block)
	Earlier mounting	Integrated System in Board

Surface scan using a field probe

ISB-Duo (2-layer ISB)	Separate microcontroller
	and SRAM

Noise is reduced significantly

Integrated System in Board stack structure (high-density mounting) Integration of noise reducing components

10 mm ⋅ 10 mm

Microcontroller

SRAM

■Evaluation results using a microcontroller and SRAM (Surface probe method - 30 MHz to 1 GHz)

Integrated System in Board

Top surface Back surface

4.3 ⋅ 4.3 ⋅ 0.73 mm3

Heat dissipation effect (simulation)

Mounting area reduced by 58% 97 Typical BGA

ISB-Quad

●Adopts unique SANYO-developed 0.24 mm thickness high-density substrate (4 layers)

●Thickness of only 0.6 mm realizes high-density mounting

●Optimal for SiP implementation of high-frequency (up to 10 GHz) blocks, blocks that require performance or EMC workarounds based on component placement /wiring pattern, and subsystems that require high- density mounting.

●Chip-on-Board type

■Assembly structure examples

ISB-Duo	Passive components	WS-CSP	Flip Chip
	(resistors and capacitors)

	MK
89
	Z
81	Y	X
73
65
57	Integrated System Board package
	MK
49	Z
	Y	X

41Integrated System Board that dissipates heat

MK

33

YX

Maximum temperature

92.7 [°C]

Temperature

difference

38.4°C

Temperature

difference

52.3°C

Maximum

temperature

54.3 [°C]

Maximum

temperature

40.4 [°C]

Analysis conditions

Chip heat generation	3 [W]
Chip size	4✕4✕0.3 [mm3]
Land size	5✕5✕0.03 [mm3]
Atmospheric temperature	25 [°C]
Cooling conditions	Ideal cooling of the solder lower
	surface; 25 [°C]
Analysis model	1/4 model (since symmetrical)

25

ISB-Quad

0.24 mm

6 7