Section Diagrams, Waveforms | Sony MX-E501 instruction

SECTION 6 DIAGRAMS

Note on Printed Wiring Boards: MAIN SECTION

•X : parts extracted from the component side.

• : Pattern from the side which enables seeing. (The other layers' patterns are not indicated.)

Caution:
Pattern face side:	Parts on the pattern face side seen from the
(Side B)	pattern face are indicated.
Parts face side:	Parts on the parts face side seen from the
(Side A)	parts face are indicated.

•Main boards is four-layer pritnted board.

However, the patterns of layer 2 and 3 have not been included in this diagrams.

*Replacement of IC601 used in this set requires a special tool.

•Lead Layouts

surface

Lead layout of	CSP (chip size package)
conventional IC

Note on Schematic Diagram: MAIN SECTION

•All capacitors are in ∝F unless otherwise noted. pF: ∝∝F 50 WV or less are not indicated except for electrolytics and tantalums.

•All resistors are in Ω and 1/4 W or less unless otherwise specified.

•f : internal component.

Note: The components identified by mark 0or dotted line with mark 0are critical for safety.

Replace only with part number specified.

• : B+ Line.

•Power voltage is dc 1.5V and fed with regulated dc power supply from battery terminal.

•Voltages and waveforms are dc with respect to ground under no-signal conditions.

no mark : PLAY

•Voltages are taken with a VOM (Input impedance 10 MΩ). Voltage variations may be noted due to normal produc- tion tolerances.

•Waveforms are taken with a oscilloscope.

Voltage variations may be noted due to normal produc- tion tolerances.

•Circled numbers refer to waveforms.

•Signal path.

*Replacement of IC601 used in this set requires a special tool.

•The voltage and waveform of CSP (chip size package) cannot be measured, because its lead layout is different from that of conventional IC.

1 IC501 1 TE

Approx.

12 mVp-p

2 IC501 ed (RF OUT)

Approx.

1.2 Vp-p

3 IC501 rs (FE)

Approx.

10 mVp-p

4 X601 (OSCO)

2.7 V

22.1 ns