HTC SM-TP001-0704 Board Level 2.5 Repairs, „ Basic Repair Instructions for Component Replacement

HTC Corporation

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Doc. Title Blackstone Service Manual

Doc. No.

Issued Date

Revised Date

Page

DOC-00045694 REV.

2008/8/21

A01

2008/11/6

92 of 96

9.2 Board Level 2.5 Repairs

„Basic Repair Instructions for Component Replacement:

Step 1 Place the solder-proof tape to cover the surrounding area of the components which being replaced.

Warning：DO NOT overheat the tape and components to avoid the tape melted and the components damaged

Step 2 Use Heater Gun (HAKO850B, set the temperature between 350°C, Air Speed 3~5) to remove the components.

Step 3 Wait till the temperature cool down before removing the solder-proof tape to avoid other components being removed

Step 4 After the damaged or defective components have been replaced; clear the surroundings for solder and flux residues.

Notice:

A.Check the polarity and the position of the components, it can't be shifted, reversed or lifted.

B.All the parts of the PCB should be checked if it is missing or not.

C.The OP must to wear antistatic wrist strap .Don't put boards together and avoid hitting them.

D.When you solder and repair that the soldering iron temperature must be setup 415℃. (The temperature range is 415℃±5℃),and the solder wire's diameter is 0.4/0.5/0.6mm(SAC 305 (1.1%)

E.Please be noticed to follow below steps for main board repair which is equipped with Golden Capacitor:

1. When replacing level 2.5 components located around the golden capacitor:

I.The temperature of the hot air blower must be under 400°c

II.When apply the hot air to the part / component, the heating time must be under 20

seconds (including the time of removing and soldering)

III.The temperature of the soldering iron must be under 350°c

IV. When apply the solder tip to the part / component, the heating time must be under 5 seconds

V. The solder tip must not contact with the golden capacitor

2.For BGA replacement: The golden capacitor must be removed before perform pre-heating, heating, soldering and de-soldering process, and then it must be replaced with a new one (please refer to 1.c. and 1.d. steps)

3.For main board which failed to pass the function test, the golden capacitor must be replaced with a new one and must follow below soldering criteria: The temperature of the soldering iron must be under 350°c When apply the solder tip to the part / component, the heating time must be under 5 seconds The solder tip must not have a contact with the body of golden capacitor

HTC CONFIDENTIAL

SM-TP001-0704