Dell R210 manual Environmental Specifications, Temperature, Relative Humidity, Maximum Vibration

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Dell

5.3 Environmental Specifications

5.3.1Temperature

Operating: 10° to 35°C (50° to 95°F) with a maximum temperature gradation of 10°C

per hour (NOTE: For altitudes above 2950 feet, the maximum operating temperature is de-rated 1ºF/550 ft.)

Storage: –40° to 65°C (–40° to 149°F) with a maximum temperature gradation of 20°C per hour

5.3.2Relative Humidity

Operating: 20% to 80% (non-condensing) with a maximum humidity gradation of 10% per hour

Storage: 5% to 95% (non-condensing)

5.3.3Maximum Vibration

Operating : 0.26 Grms at 5–350 Hz for 15 min

Storage: 1.54 Grms at 10–250 Hz for 15 min

5.3.4Maximum Shock

Operating: One shock pulse in the positive z axis (one pulse on each side of the system) of 31 G for 2.6 ms in the operational orientation

Storage: Six consecutively executed shock pulses in the positive and negative x, y, and z axes (one pulse on each side of the system) of 71 G for up to 2 ms

Six consecutively executed shock pulses in the positive and negative x, y, and z axes (one pulse on each side of the system) of 32 G faired square wave pulse with velocity change at 270 inches/second (686 centimeters/second)

5.3.5Altitude

Operating: 16 to 3048 m (–50 to 10,000 ft) (Note: For altitudes above 2950 feet, the maximum operating temperature is de-rated 1ºF/550 ft.)

Storage: 16 to 10,600 m (–50 to 35,000 ft)

5.3.6Airborne Contaminant Level

Class: G2 or lower as defined by ISA-S71.04-1985

PowerEdge R210 Technical Guide

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Contents Technical Guide Dell PowerEdge R210April PowerEdge R210 Technical GuideDell Initial ReleaseTable of Contents Dell Tables Figures 1 Product Comparison Comparison of PowerEdge Server Features Dell PowerEdge R210 Technical GuideDell 2.2.1 System Management 2 New Technologies2.1 Overview 2.2 Detailed InformationS300 Feature/SpecComparison Overview PERC S100 and S300 S100Table 3. eSATA Modes 2.2.3 eSATATable 4. Product Feature Summary 3 System OverviewFactory Installed Linux OS Options Power SupplyMicrosoft Factory Installed OS Options Microsoft Non- Factory Installed OS Option4.2 Dimensions and Weight 4 Mechanical4.1 Chassis Description 4.3 Front Panel View and Features Figure 1. Server DimensionsFigure 2. Front Panel View 4.5.1 Power Button LED 4.4 Back Panel View and Features4.5 Power Supply Indicators 4.6 NIC IndicatorsFigure 5. Side View 4.7 Side ViewFigure 6. Internal Chassis View 4.8 Internal Chassis View4.9 Rails Figure 7. R210 Static RailsFigure 8. R210 Mounted In Four-Post Square-Hole Rack 4.12.1 Top Cover Lock Mechanism 4.10 Fans4.11 Control Panel LED 4.12 SecurityFigure 10. Intrusion Switch 4.12.4 Power Switch Security4.12.5 Intrusion Alert TPM Pin Signals4.14 Battery 4.13 USB Ports4.12.6 Secure Mode Figure 12. Battery on Motherboard 4.16 User Accessible Jumpers, Sockets, and Connectors4.15 Field Replaceable Units FRU See the Hardware Owner’s Manual5 Power, Thermal, Acoustic 5.1 Power Supplies5.2 Power Supply Connectors on the Planar 5.3.3 Maximum Vibration 5.3 Environmental Specifications5.3.1 Temperature 5.3.2 Relative HumiditySee the ENERGY STAR Compliance results on Dell.com 5.4 Power Supply Unit PSU Specifications5.5 ENERGY STAR Compliance 5.6 ThermalDefinitions 5.7 AcousticsDell 6.2 Supported Processors 6.3 Processor Configurations6 Processors 6.1 Overview7 Memory 7.1 Overview7.2 DIMMs Supported 7.6 Mirroring 7.3 Slots/Risers7.4 Speed 7.5 Sparing8.3 PCI Express Interface 8 Chipset8.1 Overview 8.2 Direct Media Interface8.10 Advanced Programmable Interrupt Controller APIC 8.7 Low Pin Count LPC Interface8.8 Serial Peripheral Interface SPI 8.9 Compatibility Module8.15.2 Processor Present Indicator 8.14 Enhanced Power Management8.15 System Management Features 8.15.1 TCO Timer8.18 Intel Virtualization Technology for Directed I/O 8.15.4 Function Disable8.16 System Management Bus SMBus 8.17 Intel Anti-Theft Technology8.19 JTAG Boundary-Scan 9.1 Overview 9 BIOS9.3 Power Management Modes 9.3.1 Dell Active Power Controller9.2 ACPI 9.3.2 Power Saving BIOS Setting OS Control 9.3.3 Maximum PerformanceTable 15. Summary of R210 Power Management Features Memory Power and Performance Management Table 16. Power Profiles that R210 BIOS will Expose in BIOS SetupActive Power Controller CPU Power and Performance Management10.1 Overview 10 I/O SlotsPCI Express Root Port 10.2 PCI DevicesTable 17. I/O Slot Information Matrox G200eW w/ 8MB memoryTable 18. PCI Card Dimensions Table 19. Bandwidth, Quantities, and PrioritiesPCIe 10.4 NICs 10.3 Boot Order11 Storage 11.1 Overview11.2 Drives 11.3 RAID Configurations 11.4 Optical Disk Drive ODDTable 21. RAID Configurations Table 22. Supported Tape Drives 11.5 Tape Drives12 Video and Audio 12.1 Video12.2 Audio 13.3 Cable Management Arm CMA 13 Rack Information13.1 Overview 13.2 RailsOperating 14 Operating SystemsInstallation InstallOperating InstallationInstall Table 25. Supported Linux Operating SystemsTable 26. Supported Virtualization OS 15 Virtualization16 Systems Management 16.1 Overview16.2 Server Management 16.3 Embedded Server Management 16.4 Lifecycle Controller and Unified Server Configurator16.5 iDRAC6 Express 16.6 iDRAC6 EnterpriseTable 27. Unified Server Configurator Features and Description Features List for BMC, iDRAC6, and vFlash Page 17 Peripherals 17.1 USB17.2 USB Device Table 30. External Storage 17.3 External Storage18 Packaging Options Table 31. AMF Single Pack Dimensions and WeightsTable 32. EMF Single Pack Dimensions and Weights Figure 16. Packaging Appendix A. Regulatory Certifications Table 33. PowerEdge R210 Volatility Appendix B. R210 Volatility TablesDell Table 34. Volatility Data Writing and Purpose Table 35. Methodology for Data Input to Memory Control Panel Table 36. Methodology for Memory Protection and Clearing iDRAC6 Enterprise DellChipset Control Panel
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