Dell R210 manual Dell, Chipset, Control Panel, iDRAC6 Enterprise

Page 72

Dell

TPM Binding

 

Locked by

 

EEPROM (on

 

BIOS from

 

China planar

 

physical

Not applicable, BIOS control only

only)

 

access by

 

 

 

 

anyone after

 

 

 

boot

 

 

 

 

 

iDRAC6 SDRAM

 

n/a

AC cycle for BMC OS and reset/power off server for VGA

 

 

frame buffer

 

 

 

 

 

 

 

iDRAC6 FRU

 

writes

 

 

 

controlled by

EPPID is not clearable

 

 

iDRAC

 

 

 

 

 

embedded OS

 

 

 

 

 

iDRAC6 Boot

 

iDRAC

Not possible with any utilities or applications and iDRAC

Block Flash

 

embedded OS

 

does not function as expected if corrupted/removed.

 

 

control of the

 

 

Lifecycle log is clearable only in a factory environment;

 

 

write

 

 

System Event Log is user clearable

 

 

protection

 

 

 

 

 

 

 

Trusted

 

SW write

F2 Setup option

Platform Module

 

protected

 

 

 

 

 

 

Chipset

 

 

 

 

 

 

CMOS

 

 

Planar NVRAM_CLR jumper or by removal of AC cord,

 

 

N/A, BIOS

cover, and coin cell battery, then waiting 30 seconds prior

 

 

only control

to replacement of battery, cover and AC cord.; F2 system

 

 

 

setup option is used to restore defaults

 

 

 

 

Control Panel

 

 

 

 

 

Internal USB

 

OS control

OS control format

 

 

 

 

iDRAC6 Enterprise

 

 

 

 

 

vFlash

 

Media write

 

 

 

protection

iDRAC-based format, local OS format, deleted, or card

 

 

switch or OS

removed and formatted on a client

 

 

control

 

 

 

 

 

72

PowerEdge R210 Technical Guide

Page 71 Page 72
Image 72
Page 71 Page 72
Contents Dell PowerEdge R210 Technical GuidePowerEdge R210 Technical Guide DellInitial Release AprilTable of Contents Dell Tables Figures 1 Product Comparison Comparison of PowerEdge Server Features PowerEdge R210 Technical Guide DellPowerEdge R210 Technical Guide 2 New Technologies 2.1 Overview2.2 Detailed Information 2.2.1 System ManagementFeature/Spec Comparison Overview PERC S100 and S300S100 S3002.2.3 eSATA Table 3. eSATA Modes3 System Overview Table 4. Product Feature SummaryPower Supply Microsoft Factory Installed OS OptionsMicrosoft Non- Factory Installed OS Option Factory Installed Linux OS Options4.2 Dimensions and Weight 4 Mechanical4.1 Chassis Description 4.3 Front Panel View and Features Figure 1. Server DimensionsFigure 2. Front Panel View 4.4 Back Panel View and Features 4.5 Power Supply Indicators4.6 NIC Indicators 4.5.1 Power Button LED4.7 Side View Figure 5. Side View4.8 Internal Chassis View Figure 6. Internal Chassis View4.9 Rails Figure 7. R210 Static RailsFigure 8. R210 Mounted In Four-Post Square-Hole Rack 4.10 Fans 4.11 Control Panel LED4.12 Security 4.12.1 Top Cover Lock Mechanism4.12.4 Power Switch Security 4.12.5 Intrusion AlertTPM Pin Signals Figure 10. Intrusion Switch4.14 Battery 4.13 USB Ports4.12.6 Secure Mode 4.16 User Accessible Jumpers, Sockets, and Connectors 4.15 Field Replaceable Units FRUSee the Hardware Owner’s Manual Figure 12. Battery on Motherboard5 Power, Thermal, Acoustic 5.1 Power Supplies5.2 Power Supply Connectors on the Planar 5.3 Environmental Specifications 5.3.1 Temperature5.3.2 Relative Humidity 5.3.3 Maximum Vibration5.4 Power Supply Unit PSU Specifications 5.5 ENERGY STAR Compliance5.6 Thermal See the ENERGY STAR Compliance results on Dell.com5.7 Acoustics DefinitionsPowerEdge R210 Technical Guide 6.3 Processor Configurations 6 Processors6.1 Overview 6.2 Supported Processors7 Memory 7.1 Overview7.2 DIMMs Supported 7.3 Slots/Risers 7.4 Speed7.5 Sparing 7.6 Mirroring8 Chipset 8.1 Overview8.2 Direct Media Interface 8.3 PCI Express Interface8.7 Low Pin Count LPC Interface 8.8 Serial Peripheral Interface SPI8.9 Compatibility Module 8.10 Advanced Programmable Interrupt Controller APIC8.14 Enhanced Power Management 8.15 System Management Features8.15.1 TCO Timer 8.15.2 Processor Present Indicator8.15.4 Function Disable 8.16 System Management Bus SMBus8.17 Intel Anti-Theft Technology 8.18 Intel Virtualization Technology for Directed I/O8.19 JTAG Boundary-Scan 9 BIOS 9.1 Overview9.3 Power Management Modes 9.3.1 Dell Active Power Controller9.2 ACPI 9.3.2 Power Saving BIOS Setting OS Control 9.3.3 Maximum PerformanceTable 15. Summary of R210 Power Management Features Table 16. Power Profiles that R210 BIOS will Expose in BIOS Setup Active Power ControllerCPU Power and Performance Management Memory Power and Performance Management10 I/O Slots 10.1 Overview10.2 PCI Devices PCI Express Root PortMatrox G200eW w/ 8MB memory Table 17. I/O Slot InformationTable 18. PCI Card Dimensions Table 19. Bandwidth, Quantities, and PrioritiesPCIe 10.3 Boot Order 10.4 NICs11 Storage 11.1 Overview11.2 Drives 11.3 RAID Configurations 11.4 Optical Disk Drive ODDTable 21. RAID Configurations 11.5 Tape Drives Table 22. Supported Tape Drives12 Video and Audio 12.1 Video12.2 Audio 13 Rack Information 13.1 Overview13.2 Rails 13.3 Cable Management Arm CMA14 Operating Systems InstallationInstall OperatingInstallation InstallTable 25. Supported Linux Operating Systems Operating15 Virtualization Table 26. Supported Virtualization OS16 Systems Management 16.1 Overview16.2 Server Management 16.4 Lifecycle Controller and Unified Server Configurator 16.3 Embedded Server Management16.5 iDRAC6 Express 16.6 iDRAC6 EnterpriseTable 27. Unified Server Configurator Features and Description Features List for BMC, iDRAC6, and vFlash Page 17 Peripherals 17.1 USB17.2 USB Device 17.3 External Storage Table 30. External Storage18 Packaging Options Table 31. AMF Single Pack Dimensions and WeightsTable 32. EMF Single Pack Dimensions and Weights Figure 16. Packaging Appendix A. Regulatory Certifications Appendix B. R210 Volatility Tables Table 33. PowerEdge R210 VolatilityDell Table 34. Volatility Data Writing and Purpose Table 35. Methodology for Data Input to Memory Dell Table 36. Methodology for Memory Protection and Clearing Dell ChipsetControl Panel iDRAC6 Enterprise
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