Dell manual Dell, PowerEdge R210 Technical Guide

Page 30

Dell

bottom at 75 cm from the floor. The acoustic transducer is at front bystander position, ref ISO7779 (1999) Section 8.6.2.

PowerEdge R210 Technical Guide

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Image 30
Contents Dell PowerEdge R210 Technical GuideInitial Release PowerEdge R210 Technical GuideDell AprilTable of Contents Dell Tables Figures 1 Product Comparison Comparison of PowerEdge Server Features PowerEdge R210 Technical Guide DellPowerEdge R210 Technical Guide 2.2 Detailed Information 2 New Technologies2.1 Overview 2.2.1 System ManagementS100 Feature/SpecComparison Overview PERC S100 and S300 S3002.2.3 eSATA Table 3. eSATA Modes3 System Overview Table 4. Product Feature SummaryMicrosoft Non- Factory Installed OS Option Power SupplyMicrosoft Factory Installed OS Options Factory Installed Linux OS Options4.2 Dimensions and Weight 4 Mechanical4.1 Chassis Description 4.3 Front Panel View and Features Figure 1. Server DimensionsFigure 2. Front Panel View 4.6 NIC Indicators 4.4 Back Panel View and Features4.5 Power Supply Indicators 4.5.1 Power Button LED4.7 Side View Figure 5. Side View4.8 Internal Chassis View Figure 6. Internal Chassis View4.9 Rails Figure 7. R210 Static RailsFigure 8. R210 Mounted In Four-Post Square-Hole Rack 4.12 Security 4.10 Fans4.11 Control Panel LED 4.12.1 Top Cover Lock MechanismTPM Pin Signals 4.12.4 Power Switch Security4.12.5 Intrusion Alert Figure 10. Intrusion Switch4.14 Battery 4.13 USB Ports4.12.6 Secure Mode See the Hardware Owner’s Manual 4.16 User Accessible Jumpers, Sockets, and Connectors4.15 Field Replaceable Units FRU Figure 12. Battery on Motherboard5 Power, Thermal, Acoustic 5.1 Power Supplies5.2 Power Supply Connectors on the Planar 5.3.2 Relative Humidity 5.3 Environmental Specifications5.3.1 Temperature 5.3.3 Maximum Vibration5.6 Thermal 5.4 Power Supply Unit PSU Specifications5.5 ENERGY STAR Compliance See the ENERGY STAR Compliance results on Dell.com5.7 Acoustics DefinitionsPowerEdge R210 Technical Guide 6.1 Overview 6.3 Processor Configurations6 Processors 6.2 Supported Processors7 Memory 7.1 Overview7.2 DIMMs Supported 7.5 Sparing 7.3 Slots/Risers7.4 Speed 7.6 Mirroring8.2 Direct Media Interface 8 Chipset8.1 Overview 8.3 PCI Express Interface8.9 Compatibility Module 8.7 Low Pin Count LPC Interface8.8 Serial Peripheral Interface SPI 8.10 Advanced Programmable Interrupt Controller APIC8.15.1 TCO Timer 8.14 Enhanced Power Management8.15 System Management Features 8.15.2 Processor Present Indicator8.17 Intel Anti-Theft Technology 8.15.4 Function Disable8.16 System Management Bus SMBus 8.18 Intel Virtualization Technology for Directed I/O8.19 JTAG Boundary-Scan 9 BIOS 9.1 Overview9.3 Power Management Modes 9.3.1 Dell Active Power Controller9.2 ACPI 9.3.2 Power Saving BIOS Setting OS Control 9.3.3 Maximum PerformanceTable 15. Summary of R210 Power Management Features CPU Power and Performance Management Table 16. Power Profiles that R210 BIOS will Expose in BIOS SetupActive Power Controller Memory Power and Performance Management10 I/O Slots 10.1 Overview10.2 PCI Devices PCI Express Root PortMatrox G200eW w/ 8MB memory Table 17. I/O Slot InformationTable 18. PCI Card Dimensions Table 19. Bandwidth, Quantities, and PrioritiesPCIe 10.3 Boot Order 10.4 NICs11 Storage 11.1 Overview11.2 Drives 11.3 RAID Configurations 11.4 Optical Disk Drive ODDTable 21. RAID Configurations 11.5 Tape Drives Table 22. Supported Tape Drives12 Video and Audio 12.1 Video12.2 Audio 13.2 Rails 13 Rack Information13.1 Overview 13.3 Cable Management Arm CMAInstall 14 Operating SystemsInstallation OperatingTable 25. Supported Linux Operating Systems InstallationInstall Operating15 Virtualization Table 26. Supported Virtualization OS16 Systems Management 16.1 Overview16.2 Server Management 16.4 Lifecycle Controller and Unified Server Configurator 16.3 Embedded Server Management16.5 iDRAC6 Express 16.6 iDRAC6 EnterpriseTable 27. Unified Server Configurator Features and Description Features List for BMC, iDRAC6, and vFlash Page 17 Peripherals 17.1 USB17.2 USB Device 17.3 External Storage Table 30. External Storage18 Packaging Options Table 31. AMF Single Pack Dimensions and WeightsTable 32. EMF Single Pack Dimensions and Weights Figure 16. Packaging Appendix A. Regulatory Certifications Appendix B. R210 Volatility Tables Table 33. PowerEdge R210 VolatilityDell Table 34. Volatility Data Writing and Purpose Table 35. Methodology for Data Input to Memory Chipset Table 36. Methodology for Memory Protection and Clearing Control Panel DellChipset iDRAC6 Enterprise
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