Texas Instruments BQ2461X, BQ2463X EVM manual Users Guide

Page 1

User's Guide

SLUU396A – January 2010 – Revised July 2010

bq2461x/bq2463x EVM (HPA422) Multi-Cell Synchronous Switch-Mode Charger

 

 

Contents

 

1

Introduction

2

 

1.1

EVM Features

2

 

1.2

General Description

2

 

1.3

I/O Description

2

 

1.4

1.4 Controls and Key Parameters Setting

3

 

1.5

Recommended Operating Conditions

3

2

Test Summary

4

 

2.1

Definitions

4

 

2.2

Equipment

4

 

2.3

Equipment Setup

5

 

2.4

Procedure

6

3

PCB Layout Guideline

7

4

Bill of Materials, Board Layout and Schematics

8

 

4.1

Bill of Materials

8

5

Board Layout

11

6

Schematics

19

 

List of Figures

 

1

Original Test Setup for HPA422 (bq2461x/bq2463x EVM)

5

2

Top Layer

11

3

2nd Layer

12

4

3rd Layer

13

5

Bottom Layer

14

6

Top Assembly

15

7

Bottom Assembly

16

8

Top Silkscreen

17

9

Bottom Silkscreen

18

10

bq2461x/bq2463x EVM Schematic

19

 

 

List of Tables

1

I/O Description

2

2

Controls and Key Parameters Setting

3

3

Recommended Operating Conditions

3

4

Bill of Materials

8

SLUU396A –January 2010 –Revised July 2010

bq2461x/bq2463x EVM (HPA422) Multi-Cell Synchronous Switch-Mode Charger

1

Copyright © 2010, Texas Instruments Incorporated

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Contents Users Guide General Description EVM FeaturesI/O Description O DescriptionControls and Key Parameters Setting 1.4 Controls and Key Parameters SettingRecommended Operating Conditions Recommended Operating ConditionsEquipment DefinitionsMeters Equipment SetupAC Adapter Detection Threshold ProcedureCharger Regulation Voltage Charge Current and AC Current Regultion DPMCharger Cut-Off by Thermistor Power Path SelectionBill of Materials Bill of MaterialsPEC03SAAN PEC03SAAN JP1,JP300FEA OSTACDRV,/BAT GNDDRV,/PG ACSET,CHGE ISET1,ISETBoard Layout Nd Layer Rd Layer Bottom Layer Top Assembly Bottom Assembly Top Silkscreen Bottom Silkscreen Schematics FCC Warning Evaluation Board/Kit Important NoticeEVM Warnings and Restrictions Rfid DSP