HP xw8600 manual Technical Specifications, FBD DDR2

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QuickSpecs

HP xw8600 Workstation

Technical Specifications

System Board

Chipset		Intel® 5400
Super I/O Controller		SMSC SCH5327
System Board Form Factor		SSI-EEB (E-ATX 12" x 13")
Processor Socket		Dual LGA 771
DIMM Connectors		8 (16 with Risers)
(FBD DDR2)
PCI Connectors (5.0V)		1 full length 33 MHz 32-Bit
PCI-X Connectors		1 full length 133 MHz 64-Bit
PCI Express Connectors		1 PCI Express x16 Gen2 graphics slot 75W+75W
		1 PCI Express x16 Gen2 (x16 or x8 selectable) 75W+75W
		1 PCI Express x8 (x8 or x1 selectable)
		2 PCI Express x8 (x4 electrically)
PCI Card Guide		Optional, tool-free support for all full-length cards with PCI extender
Flash ROM		Yes
Integrated Audio		High Definition Integrated Realtek ALC262 Audio with Line in, Line Out, Microphone, Headphone
CD-ROM IN (audio)		No
AUX IN (audio)		Yes
Clear CMOS Button		Yes
CPU Fan Headers		2
Chassis Fan Headers		2
Chassis Speaker Header		Yes
CMOS Battery Holder -		Yes
Lithium
Hood Lock Header		Yes
Hood Sensor Header		Yes, as part of the front control panel header, connected by cable-to-switch. Cable/Switch assembly is a
		configure-to-order option.
Multibay Header		No
Integrated Gigabit		2 Broadcom BCM5755 A2
Ethernet
Wake on LAN		Yes
Integrated Trusted		TPM 1.2
Platform Module
ASF 1.0 & 2.0 (Alert		Yes
Standard Format)
Integrated SATA RAID*		RAID 0, 1, 10, 5
		Supports one RAID array with 2-6 drives
		RAID 0 configuration - striped array
		RAID 0 configuration - data array
		RAID 1 configuration - mirrored array
		RAID 10 configuration - stripe of mirrors
		RAID 5 configuration - parity striping
		NOTE: Hardware RAID is not supported on Linux systems. The Linux kernel, with built-in software RAID,
		provides excellent functionality and performance. It is a good alternative to hardware-based RAID.

DA - 12849 North America — Version 9 — May 19, 2008

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Contents Overview QuickSpecsAt a Glance Operating System Standard Features Custom ComponentsQuad-Core Intel Xeon Processor with Intel 64 Architecture Dual-Core Intel Xeon Processors with Intel 64 ArchitectureSAS Hard Drive Can be Either Sata or SASDDR2-800 ECC Fully Buffered DIMMs ControllersHP Memory DDR2-667 ECC Fully Buffered DIMMs Mouse One of the following FDD Floppy driveOptical drives Input Devices Keyboard One of the followingPCI Express Graphics AudioOptional MiscellaneousSoftware StandardStandard Features Specs Standard Features Preconfigured Regional Models Nvidia Quadro FX1700 512MB PCIe Primary ProcessorSecondary Processor Intel Xeon 5440 2.83 12M/1333 QC 2ndHP USB Standard Keyboard US HP xw8600 1050W 80+ Efficient ChassisIntel Xeon 5460 3.16 12M/1333 QC 2nd 160GB WD Raptor Sata NCQ 10K 1stAfter-Market Options High-end 3D Mid-range 3DPCI Cards Hard Drives Sata Hard Drive if 1st drive isSAS Hard Drives SAS SFF Hard DrivesMemory modules PC2-5300F DDR2-667 ECC Input/Output Devices KeyboardsPointing Devices Networking NICsOther devices/kits Monitors TFT displayRemovable Storage Other optionsSecurity features Maximum Memory Possible Memory ConfigurationsMemory DDR2 ECC Registered FB-DIMM Memory128 GB 64 GBStorage Tower configurationHard drive 5 must be the same as hard drive FBD DDR2 Technical SpecificationsPower Supply Headers SAS/SATA ConnectorsIeee 1394 Connectors USB 2.0 ConnectorsROM Based F10 Setup Femp Standby PowerBios Features Description PCI 3.0 Support Bios Boot Spec 1.01+Atapi SmbiosAcpi ASFSwitch Insight Diagnostics Serviceability Features of System Access panelConnectors Memory Restore CDKensington Cable Lock Security Features Access Panel Key LockService and Support PSU Technical Specifications Environmental478.8W 474.5W 476.3W 8x2GB DR 667MHz2x73GB 15k SAS / 2 Optical / 1 Floppy 280.2W 279.8W 281.7WStandby Off S5 Energy StarStandby Off S5 Heat Dissipation 115 VAC 230 VAC 100 VAC 205W 199.4W 206.2W 4x2GB 667MHzFFX4600 1x250GB SATA/ 1x DVD-ROMISO 7779 and ISO System Configuration Processor InfoEntry-level Accordance withMaterial Usage BatteriesAdditional Information Packaging MaterialsInformation PackagingHewlett-Packard Spdif Technical Specifications AudioTechnical Specifications Controllers Boot ROM support ConnectorData transfer mode Hardware certifications Power requirementAlerting Intel Pro/1000 GT ConnectorEnvironmental Operating temperature Kit contentsExternal Connectors LSI MegaRAID SAS 8888ELP Host Bus Adapter HBA ConnectorPCI Power Internal ConnectorsCompliances Devices LED IndicatorsRAID Levels EnvironmentsTechnical Specifications Storage 160 GB Capacity 250 GB Capacity80 GB Capacity Buffer Serial Attached Scsi SAS 300 GB Hard Drives146 GB 73 GB 73 GB CapacitySerial Attached Scsi SAS 146 GB SFF Hard Drives Rotational Speed 10,000 rpm Logical Blocks Technical Specifications Input/Output Devices EMI RFI ESDHP PS/2 Optical Scroll Dimensions H x L x W HP USB Laser Mouse Dimensions HxLxWTracking Laser optics resolution Power Rating Supply VoltageEMI-RFI Mouse USB Length HP Optical 3-Button Dimensions/Weight HeightPhysical characteristics Dimensions H x W x D USB Specifications ConnectorFCC, CE X, Y, Z axis pitch, roll, yawSupported Supported in Linux Regulatory Approvals Technical Specifications Optical Devices HP 48X Max Sata CD- Form Factor Total Drive PowerEnvironmental all conditions non-condensing Maximum Wet BulbDVD+R DL, DVD-R DL DVD-ROM, DVD+R SATA/ATAPIUp to DVD+RW, DVD-RWTechnical Specifications Optical Devices Ramdac Technical Specifications GraphicsShading Architecture Architecture FeaturesDVI Support 60 W North America Version 9 May 19 PCA with ATX bracket, DVI to VGA converters, CD and manual ATI FireGL V5600 PCI- Express graphics controllerPCI-Express 2.0 Graphics Controller Available GraphicsDrivers Nvidia Quadro FX 3700 Form Factor3D volumetric textures Single-system powerwall Antialiasing High-ResolutionDisplay Resolution High Level ShaderOpenGL 2.1 and DirectX 10 support 3rd-generation occlusion cullingFully programmable GPU OpenGL 2.1/DirectX 10 class High-level ShaderTechnical Specifications Monitors Buttons or Switches Preset SUN ModeFail Safe Mode Default ColorUnpacked without Height AdjustableTemperature Non Panel only withoutProduct are marked per ISO 11469 Refer to the HP General Specification forWaste Electrical and Electronic Equipment Weee Directive, 2002/96/ECRecycling User Guide Languages Other Accessories IncludedWarranty Languages Service and WarrantyMac Mode On Screen Display Buttons or SwitchesSignal Interface Horizontal Frequency Text ModeWeight Unpacked Temperature Video Input Plug and PlayPower Input Power Mechanical Dimensions H x W x D Unpacked with stand46 to 95 F 10 to 35 C HP LP2465 24-inch Panel Type Mechanical Dimensions H x W x D Unpacked w/ stand Temperature Video/Other Inputs Plug and PlayNon-operating Altitude Operating Environmental TemperatureNon-operating Other Accessories Included Non-operating Humidity OperatingHP LP3065 30-inch Panel Type Pixel Clock Speed Color GamutPerformance Vertical Frequency Normal Operation Sleep1 Off Heat Dissipation2 Environmental Temperature Operating Non-operatingRoHS Compliance Products subject to the RoHS Directive, except Where it is widely recognized that there is noHP General Specification for To levels below legal limits for all HP electronicCord Will be recycled, recovered or disposed of in aSuch as paper and corrugated materials Responsible mannerErgo, UL Listed, Vcci Approvals OptionsBar Part number EE418AA