HP xw8600 manual Acpi, Smbios, Asf, Atapi, Bbs, Edd, Pci, Pmm, Sata, Sas, Spd

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QuickSpecs

HP xw8600 Workstation

Technical Specifications

 

ALERTED - excessive temperatures are detected. Raises a flag so action can be taken to avoid

 

shutdown or provide for a smoother system shutdown

 

SHUTDOWN - excessive temperatures are encountered. Automatically shuts down the computer

 

without warning before hardware component damage occurs

Remote ROM Flash

Provides secure, fail-safe ROM image management from a central network console

Remote

System administrators can power on, restart, and power off a client computer from a remote

Wakeup/Shutdown

location.

 

Enables cost-effective power consumption when the administrator needs to distribute software,

 

perform security management, or update the ROM

ACPI

Allows the system to enter and wake from a low power mode

(Advanced Configuration

Controls system power consumption, making it possible to place individual cards and peripherals

and Power Interface)

in a low-power or powered-off state without affecting other elements of the system

 

Supports ACPI 2.0 for full compatibility with 64-Bit operating system

Keyboard-less Operation

The system can be operated without a keyboard

SMBIOS

System Management BIOS 2.5, previously known as DMI BIOS, for system management information

Localized ROM Setup

Common BIOS image supports configuration (Setup) in 12 languages, with local keyboard mappings

Asset Tag

Allows user or MIS to set unique tag string in ROM

Ownership Tag

Allows user or MIS to set unique tag string in ROM

Memory Scrubbing

Allows memory controller to transparently correct transient ECC errors in the background

Memory Remapping

Allows system memory lost to PCI devices to be reclaimed above 4 GB, for use with operating systems

 

that support more than 4 GB (Microsoft Windows XP 64-Bit edition, Linux)

Per-slot Control

Allows individual slot configuration (option ROM., latency)

Adaptive Cooling

Fan control parameters are set according to detected hardware configuration for optimal acoustics

Pre-boot Diagnostics

Early (pre-video) critical errors are reported via beeps and blinks on the power LED

 

 

Industry Standard

Revision Supported by the BIOS

ACPI

Advanced Configuration and Power Management Interface, Version 2.0c

ASF

Alert Standard Format Specification, Version 2.0

ATA (IDE)

AT Attachment 6 with Packet Interface (ATA/ATAPI-6), Revision 3b

ATAPI

ATAPI Removable Media Device BIOS Specification Version 1.0

BBS

BIOS Boot Specification v1.01

BIOS 32-Bit Services

Standard BIOS 32-Bit Service Directory Proposal v0.4

CD Boot

"El Torito" Bootable CD-ROM Format Specification Version 1.0

EDD

Enhanced Disk Drive Specification Version 1.1

 

BIOS Enhanced Disk Drive Specification Version 3.0

PCI

PCI Local Bus Specification, Revision 2.3

 

PCI Power Management Specification, Revision 1.1

PCI Express

PCI Express Base Specification, Revision 1.1

PMM

POST Memory Manager Specification, Version 1.01

SATA

Serial ATA Specification, Revision 1.0a

 

Serial ATA 3.0Gb/s: Extensions to Serial ATA 1.5Gb/s, Revision 1.0

SAS

SAS specification 1.1

SMBIOS

System Management BIOS Reference Specification, Version 2.5

SPD

PC SDRAM Serial Presence Detect (SPD) Specification, Revision 1.2B

USB 1.1

Universal Serial Bus Revision 1.1 Specification

USB 2.0

Universal Serial Bus Revision 2.0 Specification

DA - 12849 North America — Version 9 — May 19, 2008

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Contents QuickSpecs OverviewAt a Glance Dual-Core Intel Xeon Processors with Intel 64 Architecture Standard Features Custom ComponentsQuad-Core Intel Xeon Processor with Intel 64 Architecture Operating SystemCan be Either Sata or SAS SAS Hard DriveDDR2-800 ECC Fully Buffered DIMMs ControllersHP Memory DDR2-667 ECC Fully Buffered DIMMs Input Devices Keyboard One of the following FDD Floppy driveOptical drives Mouse One of the followingAudio PCI Express GraphicsStandard MiscellaneousSoftware OptionalStandard Features Specs Standard Features Preconfigured Regional Models Intel Xeon 5440 2.83 12M/1333 QC 2nd Primary ProcessorSecondary Processor Nvidia Quadro FX1700 512MB PCIe160GB WD Raptor Sata NCQ 10K 1st HP xw8600 1050W 80+ Efficient ChassisIntel Xeon 5460 3.16 12M/1333 QC 2nd HP USB Standard Keyboard USAfter-Market Options Mid-range 3D High-end 3DSAS SFF Hard Drives Hard Drives Sata Hard Drive if 1st drive isSAS Hard Drives PCI CardsNetworking NICs Input/Output Devices KeyboardsPointing Devices Memory modules PC2-5300F DDR2-667 ECCOther options Monitors TFT displayRemovable Storage Other devices/kitsSecurity features DDR2 ECC Registered FB-DIMM Memory Possible Memory ConfigurationsMemory Maximum Memory64 GB 128 GBTower configuration StorageHard drive 5 must be the same as hard drive Technical Specifications FBD DDR2USB 2.0 Connectors SAS/SATA ConnectorsIeee 1394 Connectors Power Supply HeadersBios Boot Spec 1.01+ Femp Standby PowerBios Features Description PCI 3.0 Support ROM Based F10 SetupASF SmbiosAcpi AtapiRestore CD Serviceability Features of System Access panelConnectors Memory Switch Insight DiagnosticsKensington Cable Lock Security Features Access Panel Key LockService and Support Technical Specifications Environmental PSU280.2W 279.8W 281.7W 8x2GB DR 667MHz2x73GB 15k SAS / 2 Optical / 1 Floppy 478.8W 474.5W 476.3WStandby Off S5 Energy StarStandby Off S5 Heat Dissipation 115 VAC 230 VAC 100 VAC 1x250GB SATA/ 1x DVD-ROM 4x2GB 667MHzFFX4600 205W 199.4W 206.2WAccordance with System Configuration Processor InfoEntry-level ISO 7779 and ISOPackaging Materials BatteriesAdditional Information Material UsageInformation PackagingHewlett-Packard Technical Specifications Audio SpdifTechnical Specifications Controllers Hardware certifications Power requirement ConnectorData transfer mode Boot ROM supportKit contents Intel Pro/1000 GT ConnectorEnvironmental Operating temperature AlertingInternal Connectors LSI MegaRAID SAS 8888ELP Host Bus Adapter HBA ConnectorPCI Power External ConnectorsEnvironments Devices LED IndicatorsRAID Levels CompliancesTechnical Specifications Storage 250 GB Capacity 160 GB Capacity80 GB Capacity Buffer Serial Attached Scsi SAS 300 GB Hard Drives146 GB 73 GB 73 GB CapacitySerial Attached Scsi SAS 146 GB SFF Hard Drives Rotational Speed 10,000 rpm Logical Blocks Technical Specifications Input/Output Devices ESD EMI RFIPower Rating Supply Voltage HP USB Laser Mouse Dimensions HxLxWTracking Laser optics resolution HP PS/2 Optical Scroll Dimensions H x L x WEMI-RFI USB Specifications Connector HP Optical 3-Button Dimensions/Weight HeightPhysical characteristics Dimensions H x W x D Mouse USB LengthFCC, CE X, Y, Z axis pitch, roll, yawSupported Supported in Linux Regulatory Approvals Technical Specifications Optical Devices Maximum Wet Bulb Total Drive PowerEnvironmental all conditions non-condensing HP 48X Max Sata CD- Form FactorDVD+RW, DVD-RW SATA/ATAPIUp to DVD+R DL, DVD-R DL DVD-ROM, DVD+RTechnical Specifications Optical Devices Technical Specifications Graphics RamdacShading Architecture Architecture FeaturesDVI Support 60 W North America Version 9 May 19 ATI FireGL V5600 PCI- Express graphics controller PCA with ATX bracket, DVI to VGA converters, CD and manualNvidia Quadro FX 3700 Form Factor Available GraphicsDrivers PCI-Express 2.0 Graphics Controller3D volumetric textures Single-system powerwall High Level Shader High-ResolutionDisplay Resolution AntialiasingHigh-level Shader 3rd-generation occlusion cullingFully programmable GPU OpenGL 2.1/DirectX 10 class OpenGL 2.1 and DirectX 10 supportTechnical Specifications Monitors Default Color Preset SUN ModeFail Safe Mode Buttons or SwitchesPanel only without Height AdjustableTemperature Non Unpacked withoutWeee Directive, 2002/96/EC Refer to the HP General Specification forWaste Electrical and Electronic Equipment Product are marked per ISO 11469Recycling Service and Warranty Other Accessories IncludedWarranty Languages User Guide LanguagesText Mode On Screen Display Buttons or SwitchesSignal Interface Horizontal Frequency Mac ModeMechanical Dimensions H x W x D Unpacked with stand Temperature Video Input Plug and PlayPower Input Power Weight Unpacked46 to 95 F 10 to 35 C HP LP2465 24-inch Panel Type Temperature Video/Other Inputs Plug and Play Mechanical Dimensions H x W x D Unpacked w/ standNon-operating Humidity Operating Environmental TemperatureNon-operating Other Accessories Included Non-operating Altitude OperatingHP LP3065 30-inch Panel Type Pixel Clock Speed Color GamutPerformance Vertical Frequency Environmental Temperature Operating Non-operating Normal Operation Sleep1 Off Heat Dissipation2RoHS Compliance To levels below legal limits for all HP electronic Where it is widely recognized that there is noHP General Specification for Products subject to the RoHS Directive, exceptResponsible manner Will be recycled, recovered or disposed of in aSuch as paper and corrugated materials CordEE418AA OptionsBar Part number Ergo, UL Listed, Vcci Approvals