HP xw8600 manual Batteries, Additional Information, Packaging Materials, Material Usage

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QuickSpecs

HP xw8600 Workstation

Technical Specifications - Environmental

Batteries

This product complies with ISO standards:

EU Directive 91/ 157/ EEC

EU Directive 93/ 86/ EEC

EU Directive 98/ 101/ EEC

Batteries used in the product do not contain:

Mercury greater than 5ppm by weight Cadmium greater than 10ppm by weight Lead greater than 4000ppm by weight.

Battery size: CR2032 (coin cell)

Battery type: Lithium

Additional Information

This product is in compliance with the Restrictions of Hazardous Substances (RoHS) directive - 2002/95/EC.

This HP product is designed to comply with the Waste Electrical and Electronic Equipment (WEEE) Directive - 2002/96/EC.

Plastics parts weighing over 25 grams used in the product are marked per ISO 11469 and ISO1043.

This product contains 0% recycled materials (by wt.)

This product is >90% recycle-able when properly disposed of at end of life.

Packaging Materials

External

Cardboard carton and insert

2.70 kg

Internal

LDPE Foam

0.35 kg

Material Usage

This product does not contain any of the following substances in excess of regulatory limits (refer to the HP General Specification for the

Environment at:

http://www.hp.com/hpinfo/globalcitizenship/environment/supplychain/gen_specifications.html):

Asbestos

Certain Azo Colorants

Certain Brominated Flame Retardants - may not be used as flame retardants in plastics Cadmium

Chlorinated Hydrocarbons Chlorinated Paraffins Formaldehyde

Halogenated Diphenyl Methanes Lead carbonates and sulfates Lead and Lead compounds Mercuric Oxide Batteries

Nickel - finishes must not be used on the external surface designed to be frequently handled or carried by the user.

Ozone Depleting Substances

Polybrominated Biphenyls (PBBs)

Polybrominated Diphenyl Ethers (PBBEs)

Polybrominated Biphenyl Oxides (PBBOs)

Polychlorinated Biphenyl (PCB)

Polychlorinated Terphenyls (PCT)

DA - 12849 North America — Version 9 — May 19, 2008

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Contents QuickSpecs OverviewAt a Glance Dual-Core Intel Xeon Processors with Intel 64 Architecture Standard Features Custom ComponentsQuad-Core Intel Xeon Processor with Intel 64 Architecture Operating SystemCan be Either Sata or SAS SAS Hard DriveHP Memory DDR2-667 ECC Fully Buffered DIMMs ControllersDDR2-800 ECC Fully Buffered DIMMs Input Devices Keyboard One of the following FDD Floppy driveOptical drives Mouse One of the followingAudio PCI Express GraphicsStandard MiscellaneousSoftware OptionalStandard Features Specs Standard Features Preconfigured Regional Models Intel Xeon 5440 2.83 12M/1333 QC 2nd Primary ProcessorSecondary Processor Nvidia Quadro FX1700 512MB PCIe160GB WD Raptor Sata NCQ 10K 1st HP xw8600 1050W 80+ Efficient ChassisIntel Xeon 5460 3.16 12M/1333 QC 2nd HP USB Standard Keyboard USAfter-Market Options Mid-range 3D High-end 3DSAS SFF Hard Drives Hard Drives Sata Hard Drive if 1st drive isSAS Hard Drives PCI CardsNetworking NICs Input/Output Devices KeyboardsPointing Devices Memory modules PC2-5300F DDR2-667 ECCOther options Monitors TFT displayRemovable Storage Other devices/kitsSecurity features DDR2 ECC Registered FB-DIMM Memory Possible Memory ConfigurationsMemory Maximum Memory64 GB 128 GBTower configuration StorageHard drive 5 must be the same as hard drive Technical Specifications FBD DDR2USB 2.0 Connectors SAS/SATA ConnectorsIeee 1394 Connectors Power Supply HeadersBios Boot Spec 1.01+ Femp Standby PowerBios Features Description PCI 3.0 Support ROM Based F10 SetupASF SmbiosAcpi AtapiRestore CD Serviceability Features of System Access panelConnectors Memory Switch Insight DiagnosticsService and Support Security Features Access Panel Key LockKensington Cable Lock Technical Specifications Environmental PSU280.2W 279.8W 281.7W 8x2GB DR 667MHz2x73GB 15k SAS / 2 Optical / 1 Floppy 478.8W 474.5W 476.3W Standby Off S5 Heat Dissipation 115 VAC 230 VAC 100 VAC Energy Star Standby Off S5 1x250GB SATA/ 1x DVD-ROM 4x2GB 667MHzFFX4600 205W 199.4W 206.2WAccordance with System Configuration Processor InfoEntry-level ISO 7779 and ISOPackaging Materials BatteriesAdditional Information Material UsageHewlett-Packard PackagingInformation Technical Specifications Audio SpdifTechnical Specifications Controllers Hardware certifications Power requirement ConnectorData transfer mode Boot ROM supportKit contents Intel Pro/1000 GT ConnectorEnvironmental Operating temperature AlertingInternal Connectors LSI MegaRAID SAS 8888ELP Host Bus Adapter HBA ConnectorPCI Power External ConnectorsEnvironments Devices LED IndicatorsRAID Levels CompliancesTechnical Specifications Storage 250 GB Capacity 160 GB Capacity80 GB Capacity 146 GB Serial Attached Scsi SAS 300 GB Hard DrivesBuffer Serial Attached Scsi SAS 146 GB SFF Hard Drives 73 GB Capacity73 GB Rotational Speed 10,000 rpm Logical Blocks Technical Specifications Input/Output Devices ESD EMI RFIPower Rating Supply Voltage HP USB Laser Mouse Dimensions HxLxWTracking Laser optics resolution HP PS/2 Optical Scroll Dimensions H x L x WEMI-RFI USB Specifications Connector HP Optical 3-Button Dimensions/Weight HeightPhysical characteristics Dimensions H x W x D Mouse USB LengthSupported Supported in Linux Regulatory Approvals X, Y, Z axis pitch, roll, yawFCC, CE Technical Specifications Optical Devices Maximum Wet Bulb Total Drive PowerEnvironmental all conditions non-condensing HP 48X Max Sata CD- Form FactorDVD+RW, DVD-RW SATA/ATAPIUp to DVD+R DL, DVD-R DL DVD-ROM, DVD+RTechnical Specifications Optical Devices Technical Specifications Graphics RamdacDVI Support Architecture FeaturesShading Architecture 60 W North America Version 9 May 19 ATI FireGL V5600 PCI- Express graphics controller PCA with ATX bracket, DVI to VGA converters, CD and manualNvidia Quadro FX 3700 Form Factor Available GraphicsDrivers PCI-Express 2.0 Graphics Controller3D volumetric textures Single-system powerwall High Level Shader High-ResolutionDisplay Resolution AntialiasingHigh-level Shader 3rd-generation occlusion cullingFully programmable GPU OpenGL 2.1/DirectX 10 class OpenGL 2.1 and DirectX 10 supportTechnical Specifications Monitors Default Color Preset SUN ModeFail Safe Mode Buttons or SwitchesPanel only without Height AdjustableTemperature Non Unpacked withoutWeee Directive, 2002/96/EC Refer to the HP General Specification forWaste Electrical and Electronic Equipment Product are marked per ISO 11469Recycling Service and Warranty Other Accessories IncludedWarranty Languages User Guide LanguagesText Mode On Screen Display Buttons or SwitchesSignal Interface Horizontal Frequency Mac ModeMechanical Dimensions H x W x D Unpacked with stand Temperature Video Input Plug and PlayPower Input Power Weight Unpacked46 to 95 F 10 to 35 C HP LP2465 24-inch Panel Type Temperature Video/Other Inputs Plug and Play Mechanical Dimensions H x W x D Unpacked w/ standNon-operating Humidity Operating Environmental TemperatureNon-operating Other Accessories Included Non-operating Altitude OperatingHP LP3065 30-inch Panel Type Performance Vertical Frequency Color GamutPixel Clock Speed Environmental Temperature Operating Non-operating Normal Operation Sleep1 Off Heat Dissipation2RoHS Compliance To levels below legal limits for all HP electronic Where it is widely recognized that there is noHP General Specification for Products subject to the RoHS Directive, exceptResponsible manner Will be recycled, recovered or disposed of in aSuch as paper and corrugated materials CordEE418AA OptionsBar Part number Ergo, UL Listed, Vcci Approvals