HP xw8600 manual Packaging, Hewlett-Packard, Information

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QuickSpecs

HP xw8600 Workstation

Technical Specifications - Environmental

Polyvinyl Chloride (PVC) - except for wires and cables, and certain retail packaging has been voluntarily removed from most applications.

Radioactive Substances

Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl Tin Oxide (TBTO)

Packaging

HP follows these guidelines to decrease the environmental impact of product packaging:

Eliminate the use of heavy metals such as lead, chromium, mercury and cadmium in packaging materials.

Eliminate the use of ozone-depleting substances (ODS) in packaging materials. Design packaging materials for ease of disassembly.

Maximize the use of post-consumer recycled content materials in packaging materials. Use readily recyclable packaging materials such as paper and corrugated materials. Reduce size and weight of packages to improve transportation fuel efficiency.

Plastic packaging materials are marked according to ISO 11469 and DIN 6120 standards.

End-Of-Life Management and Recycling

Hewlett-Packard offers end-of-life HP product return and recycling programs in many geographic areas. To recycle your product, please go to: http://www.hp.com/recycle or contact your nearest HP sales office. Products returned to HP will be recycled, recovered or disposed of in a responsible manner.

Hewlett-Packard

Corporate Environmental

Information

For more information about HP's commitment to the environment: [link to new HP white paper now in progress]

Global Citizenship Report: http://www.hp.com/hpinfo/globalcitizenship/gcreport/index.html Eco-label certifications: http://www.hp.com/hpinfo/globalcitizenship/environment/productdesign/ecolabels.html ISO 14001 certificates: http://www.hp.com/hpinfo/globalcitizenship/environment/operations/envmanagement.html

DA - 12849 North America — Version 9 — May 19, 2008

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Contents Overview QuickSpecsAt a Glance Operating System Standard Features Custom ComponentsQuad-Core Intel Xeon Processor with Intel 64 Architecture Dual-Core Intel Xeon Processors with Intel 64 ArchitectureSAS Hard Drive Can be Either Sata or SASDDR2-800 ECC Fully Buffered DIMMs ControllersHP Memory DDR2-667 ECC Fully Buffered DIMMs Mouse One of the following FDD Floppy driveOptical drives Input Devices Keyboard One of the followingPCI Express Graphics AudioOptional MiscellaneousSoftware StandardStandard Features Specs Standard Features Preconfigured Regional Models Nvidia Quadro FX1700 512MB PCIe Primary ProcessorSecondary Processor Intel Xeon 5440 2.83 12M/1333 QC 2ndHP USB Standard Keyboard US HP xw8600 1050W 80+ Efficient ChassisIntel Xeon 5460 3.16 12M/1333 QC 2nd 160GB WD Raptor Sata NCQ 10K 1stAfter-Market Options High-end 3D Mid-range 3DPCI Cards Hard Drives Sata Hard Drive if 1st drive isSAS Hard Drives SAS SFF Hard DrivesMemory modules PC2-5300F DDR2-667 ECC Input/Output Devices KeyboardsPointing Devices Networking NICsOther devices/kits Monitors TFT displayRemovable Storage Other optionsSecurity features Maximum Memory Possible Memory ConfigurationsMemory DDR2 ECC Registered FB-DIMM Memory128 GB 64 GBStorage Tower configurationHard drive 5 must be the same as hard drive FBD DDR2 Technical SpecificationsPower Supply Headers SAS/SATA ConnectorsIeee 1394 Connectors USB 2.0 ConnectorsROM Based F10 Setup Femp Standby PowerBios Features Description PCI 3.0 Support Bios Boot Spec 1.01+Atapi SmbiosAcpi ASFSwitch Insight Diagnostics Serviceability Features of System Access panelConnectors Memory Restore CDKensington Cable Lock Security Features Access Panel Key LockService and Support PSU Technical Specifications Environmental478.8W 474.5W 476.3W 8x2GB DR 667MHz2x73GB 15k SAS / 2 Optical / 1 Floppy 280.2W 279.8W 281.7WStandby Off S5 Energy StarStandby Off S5 Heat Dissipation 115 VAC 230 VAC 100 VAC 205W 199.4W 206.2W 4x2GB 667MHzFFX4600 1x250GB SATA/ 1x DVD-ROMISO 7779 and ISO System Configuration Processor InfoEntry-level Accordance withMaterial Usage BatteriesAdditional Information Packaging MaterialsInformation PackagingHewlett-Packard Spdif Technical Specifications AudioTechnical Specifications Controllers Boot ROM support ConnectorData transfer mode Hardware certifications Power requirementAlerting Intel Pro/1000 GT ConnectorEnvironmental Operating temperature Kit contentsExternal Connectors LSI MegaRAID SAS 8888ELP Host Bus Adapter HBA ConnectorPCI Power Internal ConnectorsCompliances Devices LED IndicatorsRAID Levels EnvironmentsTechnical Specifications Storage 160 GB Capacity 250 GB Capacity80 GB Capacity Buffer Serial Attached Scsi SAS 300 GB Hard Drives146 GB 73 GB 73 GB CapacitySerial Attached Scsi SAS 146 GB SFF Hard Drives Rotational Speed 10,000 rpm Logical Blocks Technical Specifications Input/Output Devices EMI RFI ESDHP PS/2 Optical Scroll Dimensions H x L x W HP USB Laser Mouse Dimensions HxLxWTracking Laser optics resolution Power Rating Supply VoltageEMI-RFI Mouse USB Length HP Optical 3-Button Dimensions/Weight HeightPhysical characteristics Dimensions H x W x D USB Specifications ConnectorFCC, CE X, Y, Z axis pitch, roll, yawSupported Supported in Linux Regulatory Approvals Technical Specifications Optical Devices HP 48X Max Sata CD- Form Factor Total Drive PowerEnvironmental all conditions non-condensing Maximum Wet BulbDVD+R DL, DVD-R DL DVD-ROM, DVD+R SATA/ATAPIUp to DVD+RW, DVD-RWTechnical Specifications Optical Devices Ramdac Technical Specifications GraphicsShading Architecture Architecture FeaturesDVI Support 60 W North America Version 9 May 19 PCA with ATX bracket, DVI to VGA converters, CD and manual ATI FireGL V5600 PCI- Express graphics controllerPCI-Express 2.0 Graphics Controller Available GraphicsDrivers Nvidia Quadro FX 3700 Form Factor3D volumetric textures Single-system powerwall Antialiasing High-ResolutionDisplay Resolution High Level ShaderOpenGL 2.1 and DirectX 10 support 3rd-generation occlusion cullingFully programmable GPU OpenGL 2.1/DirectX 10 class High-level ShaderTechnical Specifications Monitors Buttons or Switches Preset SUN ModeFail Safe Mode Default ColorUnpacked without Height AdjustableTemperature Non Panel only withoutProduct are marked per ISO 11469 Refer to the HP General Specification forWaste Electrical and Electronic Equipment Weee Directive, 2002/96/ECRecycling User Guide Languages Other Accessories IncludedWarranty Languages Service and WarrantyMac Mode On Screen Display Buttons or SwitchesSignal Interface Horizontal Frequency Text ModeWeight Unpacked Temperature Video Input Plug and PlayPower Input Power Mechanical Dimensions H x W x D Unpacked with stand46 to 95 F 10 to 35 C HP LP2465 24-inch Panel Type Mechanical Dimensions H x W x D Unpacked w/ stand Temperature Video/Other Inputs Plug and PlayNon-operating Altitude Operating Environmental TemperatureNon-operating Other Accessories Included Non-operating Humidity OperatingHP LP3065 30-inch Panel Type Pixel Clock Speed Color GamutPerformance Vertical Frequency Normal Operation Sleep1 Off Heat Dissipation2 Environmental Temperature Operating Non-operatingRoHS Compliance Products subject to the RoHS Directive, except Where it is widely recognized that there is noHP General Specification for To levels below legal limits for all HP electronicCord Will be recycled, recovered or disposed of in aSuch as paper and corrugated materials Responsible mannerErgo, UL Listed, Vcci Approvals OptionsBar Part number EE418AA