HP Z400 manual Asbestos, Batteries Mercury, Batteries Cadmium, Batteries Lead non-rechargeable

Page 25

QuickSpecs

HP Z400 Workstation

System Technical Specifications

 

http://www.hp.com/hpinfo/globalcitizenship/environment/supplychain/gen_specifications.html):

 

Asbestos

 

Batteries - Mercury

 

Batteries - Cadmium

 

Batteries - Lead (non-rechargeable)

 

Batteries - Non-rechargeable Alkaline and Carbon-Zinc Batteries

 

Batteries - Classification as "Not Restricted" for Transport

 

Brominated Flame Retardants (PBBs, PBDEs, including DecaBDE)

 

Brominated Flame Retardants (all BFRs in external case plastic parts)

 

Cadmium and its compounds

 

Certain Azo Colorants

 

Chlorinated Hydrocarbons

 

Chlorinated Paraffins

 

Formaldehyde

 

Formaldehyde - emissions

 

Hexavalent Chromium and its compounds in metallic applications

 

Hexavalent Chromium and its compounds in non-metallic applications

 

Lead and its compounds

 

Lead in paint

 

Lead in Polyvinyl Chloride (PVC) coating of external cables, wires and cords

 

Mercury and its compounds

 

Nickel on external surfaces

 

Ozone Depleting Substances (ODS)

 

Polycyclic Aromatic Hydrocarbons (PAH)

 

Perfluorooctane sulfonates (PFOS) in parts

 

Perfluorooctane sulfonates (PFOS) in preparations

 

Polychlorinated Biphenyls (PCBs) and Polychlorinated Terphenyls (PCTs)

 

Polychlorinated Naphthalenes

 

Polyvinyl Chloride (PVC) in external case plastic parts

 

Radioactive Substances

 

Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl Tin Oxide (TBTO)

Packaging

HP Workstation product packaging meets the following (refer to the HP General Specification for the

 

Environment at

 

http://www.hp.com/hpinfo/globalcitizenship/environment/supplychain/gen_specifications.html:

 

Does not contain restricted substances listed in HP Standard 011-1 General Specification for the

 

Environment (see link above).

 

Does not contain ozone-depleting substances (ODS).

 

Design packaging materials for ease of disassembly.

 

Does not contain heavy metals (lead, mercury, cadmium or hexavalent chromium) in excess of 100

 

ppm sum total for all heavy metals listed.

 

Maximizes the use of post-consumer recycled content materials in packaging materials.

 

All packaging material is recyclable.

 

Reduces size and weight of packages to improve transportation fuel efficiency.

 

Plastic packaging materials are marked according to ISO 11469 and DIN 6120 standards.

Longevity and UpgradingThis product is designed to be upgraded, possibly extending its useful life by several years. Spare parts

 

are available throughout the warranty period and for up to 5 years after the end of production.

 

Upgradeability features contained in the product include:

 

Intel LGA775 processor socket

 

 

 

 

 

 

DA - 13276 Worldwide QuickSpecs — Version 1 — 3.30.2009

Page 25

Image 25
Contents QuickSpecs Systems Installed** expected available until AugustNovell Suse Sled 11 expected availability May QuickSpecs 300 GB 15K rpm SAS 3.0 Gb/s 3.5 Hard Drive EA330AAEM174AA 450 GB 15K rpm SAS 3.0 Gb/s 3.5 Hard DriveEW222AA GE262AAFM802AA GE258AAFQ138AA NB769AACTO MemoryAMO Creative X-Fi Titanium PCIe Audio CardNK361AA NK360AANK653AA EY703AA EK729AAGW405AA NB896AAEM165AA GM110AANQ099AA QuickSpecs Sata PCIQuickSpecs Femp Standby Power Compliant@115V Wake Energy Star Compliant config dependentSurge Tolerant Full Ranging Power Supply withstands Power surges up toQuickSpecs QuickSpecs QuickSpecs QuickSpecs Repetitive shock events Non-operating 8% to 90% RH, non-condensingQuickSpecs Insight Diagnostics are Power supply diagnosticYesTesting and diagnosing apparent hardware failures Disaster recovery, and maintenanceAtapi SmbiosBBS ASF AcpiATA IDE EDDTPM SPDUhci WWWUpgradeability features contained in the product include Design packaging materials for ease of disassemblyAsbestos Batteries MercuryAdditional Information Warranty2002/95/EC Introduction Synchronous Transfer Rate3.0 Gb/s SASEnabled DA 13276 Worldwide QuickSpecs Version 1 11 ms Technical Specifications Hard Drives LSISAS1064E Internal ConnectorsFor ports 0-3 Maximum Resolution An accessoryAccessory 1600Ramdac Storage ConnectorsDual Internal 400 MHz DAC @ 85HzLinux drivers may be obtained from Site2048 x 1536 @ 85Hz Single Internal 400 MHz DACNovell Suse Linux Enterprise drivers may be obtained from QuickSpecs QuickSpecs Shaders Pixel shadersSupported graphics APIsOpenGL DirectX 64x Fsaa SLI Mode Resolution up to 1920 x2560 x 2560 x 1600 @ 60Hz400MHz QuickSpecs HP Warranty documentation USB power cables for connecting to your PCWindows XP 32-bit or 64-bit version DVD-ROM SATA/ATAPIDVD-RAM DVD-RAM DVD+R DVD+RW DVD+R DL DVD-R DL DVD-RW CD-R CD-RWDVD-ROM DL DVD-RHP Blu-Ray Writer Description CD-ROM DVD+R SL/DLBD-ROM BD-ROM DLSdhc Pentium II 266 or above 128-MB RAM Provided by the operating systemTemperature Storage-22 to 140 F -30 to 60 C Temperature Operating50 to 131 F 10 to 55 CGuide, product warranty statement Operating Temperature32 to 131F 0 to 55 C Operating HumidityNIC Intel Gigabit CT DesktopConnector RJ-45For European Union