HP 8000 manual Technical Specifications Communications, Acbs

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QuickSpecs

HP Compaq 8000 Elite PC

Technical Specifications - Communications

Intel 82567LM Gigabit

Connector

RJ-45

 

Network Connection

Controller

Intel 82567LM Gigabit platform LAN Connect Networking Controller

(integrated)

Memory

24 KB FIFO packet buffer memory

 

 

Data rates supported

10/100/1000 Mbps

 

 

Compliance

IEEE 802.1P, 802.1Q, 802.2, 802.3, 802.3 ab and 802.3u compliant

 

Bus architecture

GLCI, LCI interface. Intel specific MAC to PHY interface

 

Data transfer mode

At gigabit GLCI (Intel proprietary 802.3 series-based interface) is for

 

 

Data, LCI (parallel bus) for MDIO, at 10/100 LCI for both data and

 

 

MDIO, GLCI is idle.

 

 

Hardware

FCC B, CE, TUV- cTUVus Mark Canada and United States, TUV- GS

 

certifications

Mark for European Union

 

 

Power requirement

Requires 3.3V,1.9/1.8V and 1.0V or just 3.3V with integrated regulators

 

 

Power consumption 1.3 Watts for 82567 whole LOM

 

ACBS

Intel Auto Connect Battery Saving feature

 

Boot ROM support

Yes

 

 

Network transfer mode Full-duplex

 

 

 

Half-duplex (not supported for the 1000BASE-T transceiver)

 

Network transfer rate

10BASE-T (half-duplex) 10 Mbps

 

 

10BASE-T (full-duplex) 20 Mbps

 

 

100BASE-TX (half-duplex) 100 Mbps

 

 

100BASE-TX (full-duplex) 200 Mbps

 

 

1000BASE-T (full-duplex) 2000 Mbps

 

Environmental

Operating temperature 32° to 131°F (0° to 55° C)

 

 

 

To 70° C for external regulator

 

 

Operating humidity

85% at 131° F (55° C)

 

Management

WOL, auto MDI crossover, PXE, Muti-port teaming, RSS, Advanced

 

capabilities

cable diagnostic.

 

 

Alerting

ASF 2.0 support, AMT 3.0 support

 

 

 

 

Broadcom NetXtreme

Connector

RJ-45

 

GbE Ethernet Plus NIC

Controller

Broadcom 5761 PCI-Express LAN Controller

 

Memory

8 MB NVRAM serial Flash

 

Data rates supported

10/100/1000 Mbps

 

 

Compliance

IEEE 802.1P, 802.1Q, 802.2, 802.3, 802.3AB, 802.3u, and 802.3x

 

Bus architecture

PCI-Express

 

 

Data path width

Single Channel PCI-Express

 

Data transfer mode

Bus Master DMA

 

 

Hardware

FCC class B, Canada and US NRTL Mark, C-Tick for Australia, BSMI

 

certifications

for Taiwan, VCCI for Japan, MIC for Korea, GOST for Russia, UL listed

 

 

(E212044), European Union Notice (CE 0682)

 

Power requirement

1.8W @ 3.3V

 

 

Boot ROM support

Yes

 

 

Network transfer mode Full-duplex

 

 

 

Half-duplex (not available for the 1000BASE-T transceiver)

DA - 13424 Worldwide QuickSpecs — Version 17 — 6/25/2010

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Contents Ultra-slim Desktop OverviewSmall Form Factor Convertible Minitower At a Glance Operating Systems PreinstalledSupported CertifiedProcessor ChipsetUsdt SFF CMT Intel Celeron Processors dual coreIntel Pentium Processors Intel Core 2 Processor with vPro TechnologyIntel Core 2 Duo Processors Intel Core 2 Quad ProcessorsFlexible implementation Redundant Array of Independent Drives RAIDUltra-slim Desktop DDR3 Synchronous Dram NON-ECC System MemorySmall Form Factor and Convertible Minitower Ultra-slim Desktop Small Form Factor Convertible Minitower Memory ConfigurationsSolid State Drives Hard Disk DrivesInch Optical Drives Storage Drive SupportMedia Card Readers Slimline Optical DrivesSecurity Network Interface ConnectionAudio/Visual GraphicsInput Devices MiscellaneousQuickSpecs After-Market Options availability may vary by region CommunicationsPart Number Usdt SFF CMT Part NumberDDR3 Sdram System Memory Input/Output DevicesHP Monitors Multimedia DevicesStands and Accessories Software SolutionsSecurity Devices Technical Specifications DimensionsPorts SlotsController BaysUnit Environment and Operating Conditions ROM Bios Information Power SupplyUltra Slim Desktop Small Form Factor Convertible Minitower Serviceability Features Other FeaturesAdditional Features DescriptionSipp QuickSpecs Technical Specifications Audio Acbs Technical Specifications CommunicationsIntel Gigabit CT Desktop NIC Connector DimensionsOperating system Driver supportStorage temperature WeightPower consumption Platform/WLAN Mode Output power approximatelySecurity Data transfer rate Data Rate MCS Minimum ThroughputWireless NIC By country Intel WiFi Link Wireless LANOutput Power for Power ConsumptionConfiguration Utility Power ManagementReceiver Sensitivity Antenna ConnectionsEMC Ramdac Technical Specifications GraphicsInput/Output connectors DMS-59 Board display options Board configuration Specification DescriptionMaximum Resolution ConnectorsSupported graphics APIs Nvidia Quadro NVS Form FactorDimensions H x D Core powerOption kit contents Audio SupportATI Radeon HD Bus type Display max resolutionDual Head PCIe Maximum vertical refresh Graphics Card Rate Display supportPCIe Refresh rate Graphics Card Display support 4650 DP 1GB Maximum verticalWindows 7 Home Basic*, Windows 7 Home Premium*, Windows VGA GTFSvga XGAResolution Max refresh rate Technical Specifications Hard Drives Buffer Seek Time typical Single Track 320 GB Capacity250 GB Capacity Dimensions-external Temperature Solid State Drive 64 GB CapacityHost transfer rate Ultra DMA mode Total powerESD Technical Specifications Input/Output DevicesEMI RFI PS/2 Standard Physical Keys Dimensions H x W x DMechanical Languages HP USB Smartcard Physical KeysSmartcard function Support Supported PowerStandard APIs Communication From cardUsafcc part USACE level 4, 15 kV air discharge EMI-RFIMtbf QuickSpecs Technical Specifications Optical Storage DVD-R DL DVD+R DLDVD+RW, DVD-RW DVD+R DL, DVD-R DL DVD-ROM DLDVD-ROM CD-R DVD-R DL, DVD+R DL DVD-RW, DVD+RWDVD+R, DVD-R DVD-ROM DL, DVDDVD+R/-R/+RW Technical Specifications Removable Storage Connectivity Design Guide V Technical Specifications Environmental Data Small Form Factor Convertible Minitower Material Usage RoHS ComplianceManagement Recycling End-of-lifeHewlett-Packard Corporate
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