HP dx5150 manual Compliance Standards EMC Emissions, EMC Immunity

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QuickSpecs

HP dx5150 Business PC

Technical Specifications - Graphics

Compliance Standards

EMC Emissions:

 

a) FCC Part 15, Subpart B - Unintentional Radiators, Class B Computing

 

Devices for Home & Office Use

 

b) CISPR22: 1997/EN 55022:1998 - Class B - Limits and methods of

 

measurement of radio disturbance characteristics of Information Technology

 

Equipment

 

c) Canadian Standard ICES-003 is equivalent to CISPR22

 

d) Taiwanese Standard BSMI - if specified

 

e) Japanese VCCI - if specified

 

f) Australian C-Tick - if specified

EMC Immunity:

CISPR 24:1997/EN 55024:1998 - Information Technology Equipment -

Immunity Characteristics - Limits and Methods of Measurement

Safety:

UL 60950 (USA) & EN 60950 (EU): Safety of Information Technology Equipment, Including Electrical Business Equipment. All boards meet UL PCB flammability requirements.

DA - 12105 Worldwide — Version 7 — August 23, 2005

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Contents
Small Form Factor OverviewMicrotower Worldwide Version 7 August 23At a Glance Standard Features Select Models localized by Regions Model Key Example Pre-Configured ModelsAMD Sempron Processors System Bus Standard L2 Cache Standard Features Custom ComponentsOperating System DrivesOptical Storage Standard MemoryRemovable Storage CardNIC Standard Features Base Unit Details USB Support DimensionsSupported Features Interfaces LegacySystem Board AMD SempronAMD Athlon ArchitectureChassis Passive Power Factor Correction PFC Power SupplyActive Power Factor Correction Apfc InterfacesPower Conservation Energy Saver Client Management SolutionsBoot Support After-Market Options Multimedia Monitors TFTsCRTs Optical Drives DVD-ROM DriveDiskette and Digital Drives AccessoriesRemovable Storage Drive Key Options Zip Drives and MediaMemory DDR Synch Dram Dimm NON-ECC MemoryStandard Memory Diskette Drive StoragePosition Supported Storage BaysTechnical Specifications ROM FeaturesDescription Microtower Operating Conditions Initial Configuration and DeploymentUnit Environment DescriptionSecurity Features of Chassis System Serviceability Features Description Technical Specifications Audio Technical Specifications Communications Hi-Speed 56K PCI Data Transmission Intel Pro 1000 MT NIC ConnectorNetwork transfer rate SoftModemEMC Health Windows Me health compliantRevision Technical Specifications Graphics RamdacVGA + TV Core Power Board Configuration Specification DescriptionOperating Temperature Option Kit ContentsCompliance Standards EMC Emissions EMC ImmunityTechnical Specifications Hard Drives 160-GB Capacity 171,798,691,840 bytes Height 2.54 cm Width Physical size 4 in 10.2 cmTechnical Specifications Input/Output Devices ESDEMI RFI EMC FCC Cispr ACA, BSMI, MIC, Vcci USAEMI-RFI Technical Specifications Optical Storage Velocity Access Times typical RandomReference Scanning Read Only Disc Formats and ModesDVD-ROM CD-ROMWeight max Access TimesDC Power Requirement 16X DVD+/-RWSignal-to-Noise Ratio Access time RandomTotal Drive Power TemperatureTechnical Specifications Removable Storage Storage Capacity HP Drive Key Dimensions HxWxDTemperature Operating System Transfer Rates
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