HP dx5150 manual Emc

Page 26

QuickSpecs

HP dx5150 Business PC

Technical Specifications - Communications

 

speed. FCC limitations allow a maximum of 53 Kbps during download

 

transmissions.

Data Speeds

(Upload only) 33,600/31,200/28,800/26,400/21,600/19,200/16,800/

 

14,400/12,000/9,600/7,200/4,800/2,400/1,200/300

Data Standards

ITU V.90, ITU-T, V.34bis, V.22bis, V.22bis, V.21, V.23, Bell 212A, and Bell

 

103

Fax Speeds

14,400/12,000/9,600/7,200/4,800/2,400/1,200/300 b/s

Fax Mode Capabilities

Group3 FAX, V. 17, V.29, V.27ter, and V.21 Channel 2, Class 1

Error Correction and

V.44 (software upgradeable), 4.2bis, V.42 and MNP2-5

Data Compression

 

Power Management

APM and ACPI states D0, D1, D2, and D3; meets PCI 2.2 requirements and

 

PC'99 requirements

Upgradeability

Software driver upgradeable for high speed 56K modem and future

 

enhancements

Video

ITU-T V.80 video ready interface

Other

TIA/EIA 602 standard AT command set

 

Integrated DTE interface with speeds of up to 115.2 Kbps, parallel 16550a

 

UART-compatible interface

 

Optional ring wakeup signal

Operating Temperature

32° to 158° F (0° to 70° C)

Operating Humidity

20% to 90%, non-condensing

Operating System

Microsoft® Windows® 95 and 98, Microsoft Windows 98 SE, Microsoft

Support

Windows 2000, Microsoft Windows Me, Microsoft Windows NT® 4.0, and

 

Microsoft Windows XP

OS Driver Support

Microsoft Windows 95 and98, Microsoft Windows 98 SE , Microsoft

 

Windows 2000, Microsoft Windows Me, Microsoft Windows NT 4.0,

 

Microsoft Windows XP

Power

Requires a 3.3-V auxiliary power rail on PCI bus

 

Uses only one PCI load (i.e., one grant/request pair), one shared IRQ, one

 

electrical load

Chipset

Agere Systems 1648C (Mars 3.2) - Integrated PCI interface with 5-V tolerant

 

buffers and CardBus support

Dimensions (L X H)

Complies with PCI low profile specifications - 6.7 x 2.3 in (17.0 x 5.8 cm)

 

and supports high-and low-profile brackets

Connection

Dual, parallel RJ-11 support with auxiliary Tip/Ring connector

Other Features

Digital line protection, call progress monitoring via on-board piezo device,

 

transformer-based DAA design, support for high profile and low profile

 

brackets, PnP ID supports via external EEPROM

Safety

UL recognized to UL 1950, 3rd edition (U.S. and Canada); IEC 950 (TUV,

 

NEMKO, DEMKO, SEMKO); CE Mark, EC 950 (TUV, NEMKO, DEMKO,

 

SEMKO, CE mark

EMC

FCC Part 15, IC ES003, EN 55022, 3rd edition, EN 55024, annex A, EN

 

61000-4-6, EN 61000-4-8

Telecom

FCC Part 68, IC-CS-03 (Canada); Worldwide PTT approvals

 

Not available in India, Russia, Slovakia, Slovenia, Belarus, Brunei, Croatia,

 

Ecuador, Latvia, Lithuania, Morocco, Peru, Philippines, Sri Lanka, Ukraine,

 

Malaysia (use DC132B or DC132C instead)

DA - 12105 Worldwide — Version 7 — August 23, 2005

Page 26

Image 26 Contents
Small Form Factor OverviewMicrotower Worldwide Version 7 August 23At a Glance Standard Features Select Models localized by Regions Model Key Example Pre-Configured ModelsAMD Sempron Processors System Bus Standard L2 Cache Standard Features Custom ComponentsOperating System DrivesOptical Storage Standard MemoryRemovable Storage CardNIC Standard Features Base Unit Details USB Support DimensionsSupported Features Interfaces LegacySystem Board AMD SempronAMD Athlon ArchitectureChassis Passive Power Factor Correction PFC Power SupplyActive Power Factor Correction Apfc InterfacesBoot Support Power Conservation Energy SaverClient Management Solutions After-Market Options Multimedia Monitors TFTsCRTs Optical Drives DVD-ROM DriveDiskette and Digital Drives AccessoriesRemovable Storage Drive Key Options Zip Drives and MediaStandard Memory MemoryDDR Synch Dram Dimm NON-ECC Memory Diskette Drive StoragePosition Supported Storage BaysDescription Microtower Technical SpecificationsROM Features Operating Conditions Initial Configuration and DeploymentUnit Environment DescriptionSecurity Features of Chassis System Serviceability Features Description Technical Specifications Audio Technical Specifications Communications Hi-Speed 56K PCI Data Transmission Intel Pro 1000 MT NIC ConnectorNetwork transfer rate SoftModemEMC Revision HealthWindows Me health compliant VGA + TV Technical Specifications GraphicsRamdac Core Power Board Configuration Specification DescriptionOperating Temperature Option Kit ContentsCompliance Standards EMC Emissions EMC ImmunityTechnical Specifications Hard Drives 160-GB Capacity 171,798,691,840 bytes Height 2.54 cm Width Physical size 4 in 10.2 cmEMI RFI Technical Specifications Input/Output DevicesESD EMC FCC Cispr ACA, BSMI, MIC, Vcci USAEMI-RFI Technical Specifications Optical Storage Velocity Access Times typical RandomReference Scanning Read Only Disc Formats and ModesDVD-ROM CD-ROMWeight max Access TimesDC Power Requirement 16X DVD+/-RWSignal-to-Noise Ratio Access time RandomTotal Drive Power TemperatureTechnical Specifications Removable Storage Storage Capacity HP Drive Key Dimensions HxWxDTemperature Operating System Transfer Rates
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