HP dx5150 manual Technical Specifications Input/Output Devices, Esd, Emi Rfi

Page 33

QuickSpecs

HP dx5150 Business PC

Technical Specifications - Input/Output Devices

Standard Keyboard

Physical

Keys

104, 105, 106, 107, 109 layout (depending

(PS/2 or USB)

characteristics

 

upon country)

 

 

Dimensions (L x W x H)

18.0 x 6.4 x 0.98 in (45.8 x 16.3 x 2.5 cm)

 

 

Weight

2 lb (0.9 kg) minimum

 

Electrical

Operating voltage

+ 5VDC ± 5%

 

 

Power consumption

50-mA maximum (with three LEDs ON)

 

 

System interface

USB Type A plug connector

 

 

ESD

CE level 4, 15-kV air discharge

 

 

EMI - RFI

Conforms to FCC rules for a Class B computing

 

 

 

device

 

 

Microsoft PC 99 - 2001

Functionally compliant

 

Mechanical

Languages

38 available

 

 

Keycaps

Low-profile design

 

 

Switch actuation

55-g nominal peak force with tactile feedback

 

 

Switch life

20 million keystrokes (using Hasco modified

 

 

 

tester)

 

 

Switch type

Contamination-resistant switch membrane

 

 

Key-leveling mechanisms

For all double-wide and greater-length keys

 

 

Cable length

6 ft (1.8 m)

 

 

Microsoft PC 99 - 2001

Mechanically compliant

 

 

Acoustics

43-dBA maximum sound pressure level

 

Environmental

Operating temperature

50° to 122° F (10° to 50° C)

 

 

Non-operating

-22° to 140° F (-30° to 60° C)

 

 

temperature

 

 

 

Operating humidity

10% to 90% (non-condensing at ambient)

 

 

Non-operating humidity

20% to 80% (non-condensing at ambient)

 

 

Operating shock

40 g, six surfaces

 

 

Non-operating shock

80 g, six surfaces

 

 

Operating vibration

2-g peak acceleration

 

 

Non-operating vibration

4-g peak acceleration

 

 

Drop (out of box)

26 in (66 cm) on carpet, six-drop sequence

 

 

Drop (in box)

42 in (107 cm) on concrete, 16-drop sequence

 

Operating system support Windows 2000 and Windows XP

 

Approvals

UL, CSA, FCC, CE Mark, TUV, TUV GS, VCCI, BSMI, C-Tick, MIC

 

Ergonomic compliance

ANSI HFS 100, ISO 9241-4, and TUVGS

 

 

 

 

DA - 12105 Worldwide — Version 7 — August 23, 2005

Page 33

Image 33 Contents
Microtower OverviewSmall Form Factor Worldwide Version 7 August 23At a Glance Model Key Example Pre-Configured Models Standard Features Select Models localized by RegionsOperating System Standard Features Custom ComponentsAMD Sempron Processors System Bus Standard L2 Cache DrivesRemovable Storage Standard MemoryOptical Storage CardNIC Standard Features Base Unit Details Supported Features DimensionsUSB Support Interfaces LegacyAMD Athlon AMD SempronSystem Board ArchitectureChassis Active Power Factor Correction Apfc Power SupplyPassive Power Factor Correction PFC InterfacesPower Conservation Energy Saver Client Management SolutionsBoot Support After-Market Options CRTs Monitors TFTsMultimedia Optical Drives DVD-ROM DriveRemovable Storage Drive Key Options AccessoriesDiskette and Digital Drives Zip Drives and MediaMemory DDR Synch Dram Dimm NON-ECC MemoryStandard Memory Position Supported StorageDiskette Drive Storage BaysTechnical Specifications ROM FeaturesDescription Microtower Unit Environment Initial Configuration and DeploymentOperating Conditions DescriptionSecurity Features of Chassis System Serviceability Features Description Technical Specifications Audio Technical Specifications Communications Network transfer rate Intel Pro 1000 MT NIC ConnectorHi-Speed 56K PCI Data Transmission SoftModemEMC Health Windows Me health compliantRevision Technical Specifications Graphics RamdacVGA + TV Operating Temperature Board Configuration Specification DescriptionCore Power Option Kit ContentsEMC Immunity Compliance Standards EMC EmissionsTechnical Specifications Hard Drives Physical size 4 in 10.2 cm 160-GB Capacity 171,798,691,840 bytes Height 2.54 cm WidthTechnical Specifications Input/Output Devices ESDEMI RFI USA EMC FCC Cispr ACA, BSMI, MIC, VcciEMI-RFI Technical Specifications Optical Storage Reference Scanning Access Times typical RandomVelocity Read Only Disc Formats and ModesCD-ROM DVD-ROMDC Power Requirement Access TimesWeight max 16X DVD+/-RWTotal Drive Power Access time RandomSignal-to-Noise Ratio TemperatureTechnical Specifications Removable Storage Temperature Operating System HP Drive Key Dimensions HxWxDStorage Capacity Transfer Rates
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