HP Modular Cooling System manual HP 10642 G2 Rack specifications, Thermal and air flow performance

Page 80

Thermal and air flow performance

Maximum thermal and air flow

Single rack

Dual rack

performance parameters

 

(Specification per rack)

 

 

 

Air temperature—inlet to rack-

25ºC (68ºF)

25ºC (68ºF)

mounted components

 

 

 

 

 

Chilled water temperature

7º–15°C (45º–57°F)

7º–15°C (45º–57°F)

 

 

 

Total rack-mounted component air

2,600 cfm or less at 0 or more

1,300 cfm or less at 0 or more

flow

pressure drop across the rack-

pressure drop across the rack-

 

mounted components

mounted components

 

 

 

Chilled water flow rate

15.5 gal/min (60 l/min)

7.9 gal/min (30 l/min)

 

 

 

Chilled water pressure differential at

1.0 bar delta pressure

1.0 bar delta pressure

flow needed to meet thermal

 

 

specifications

 

 

 

 

 

Heat lost to room

Approximately 10% maximum

Approximately 10% maximum

 

depending on the MCS settings

depending on the MCS settings

 

and room temperature

and room temperature

 

 

 

Server heat load

35 kW maximum

17.5 kW maximum

 

 

 

Environmental specifications

Features

Specifications

 

 

Operating temperature

5ºC to 35ºC (41ºF to 95ºF)

 

 

Non-operating temperature

0ºC to 60ºC (32ºF to 140ºF)

 

 

Transit temperature

-30ºC to 60ºC (-22ºF to 140ºF), up to 72 hours

 

 

Storage temperature

-20ºC to 60ºC (-4ºF to 140ºF)

 

 

Operating humidity

20 to 80% relative humidity (non-condensing)

 

 

Non-operating humidity

5 to 95% relative humidity (non-condensing)

 

 

Operating altitude

-76.2 to 3,048 m (-250 to 10,000 ft)

 

 

Non-operating altitude

-76.2 to 9,144 m (-250 to 30,000 ft)

 

 

HP 10642 G2 Rack specifications

U height

Width

Depth

Dynamic load (gross)

Static load

 

 

 

 

 

42U

600 mm

1,000 mm

907.2 kg (2,000 lb)

1,360.8 kg (3,000

 

(23.8 in)

(39.4 in)

 

lb)

 

 

 

 

 

Specifications 80

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Contents HP Modular Cooling System G2 Maintenance and Service Guide Intended audience Contents Troubleshooting Réparation par le client CSR Parts only warranty serviceCustomer self repair Service de garantie pièces seules Riparazione da parte del clienteServizio di garanzia per i soli componenti Reparaciones del propio cliente Servicio de garantía exclusivo de componentes Garantieservice Parts Only Reparo feito pelo clienteServiço de garantia apenas para peças Customer self repair Customer self repair Customer self repair Customer self repair Illustrated parts catalog Replaceable spare partsDescription Spare part Customer self repair Number Page Illustrated parts catalog Removal and replacement procedures Spare replacement tipsSpare replacement video OverviewComponent location Required tools Callout ComponentSafety considerations Preparation proceduresDisconnecting the power Rack warnings and cautionsTurning off the water Draining water from the MCS G2 unitAC transfer switch Removing the AC transfer switchReplacing the AC transfer switch Air bleeder valve Removing the air bleeder valveBottom fan unit Replacing the air bleeder valveRemoving the bottom fan unit Replacing the bottom fan unitCondensation pump Removing the condensation pumpRemoval and replacement procedures Replacing the condensation pump Removal and replacement procedures Fan controller Removing the fan controllerReplacing the fan controller Fan unit Removing the fan unitReplacing the fan unit Flow meter sensor Removing the flow meter sensorRemoval and replacement procedures Replacing the flow meter sensor Removal and replacement procedures Removal and replacement procedures Removal and replacement procedures Front automatic door release Removing the front automatic door releaseReplacing the front automatic door release Management module Removing the management moduleRemoval and replacement procedures Replacing the management module Operator display Removing the operator displayRemoval and replacement procedures Replacing the operator display Removal and replacement procedures Rear automatic door release Removing the rear automatic door release Replacing the rear automatic door release Removal and replacement procedures Water controller Removing the water controllerRemoval and replacement procedures Replacing the water controller Removal and replacement procedures Water level sensors Removing the water level sensorsReplacing the water level sensors Removal and replacement procedures Removal and replacement procedures Water valve Removing the water valveRemoval and replacement procedures Removal and replacement procedures Removal and replacement procedures Replacing the water valve Removal and replacement procedures Removal and replacement procedures Removal and replacement procedures Reconnecting the power Operation checklistReconnecting the main water hoses Restoring water flow Maintenance Maintenance and serviceWater quality requirements and specifications Air and water heat exchanger maintenanceWater precautions Frost damagePlumbing materials to avoid Diagnostic toolsCondensation management Troubleshooting HP Modular Cooling System troubleshootingSpecifications MCS specificationsThermal and air flow performance HP 10642 G2 Rack specificationsEnvironmental specifications Acronyms and abbreviations Index Index
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Modular Cooling System specifications

The HP Modular Cooling System (MCS) is a state-of-the-art solution designed to efficiently manage the heat generated by high-density IT environments. As data centers face the ever-increasing demand for processing power, traditional cooling methods often fall short, leading to inefficiencies and raised energy costs. The HP MCS addresses this issue with a scalable, flexible design that optimizes cooling performance while minimizing energy consumption.

One of the main features of the HP Modular Cooling System is its modular architecture, which allows for easy expansion and customization based on the specific needs of a data center. This scalability means that as a facility grows or changes, the cooling system can be modified without the need for extensive renovations or replacements. The MCS can be installed in various configurations, further enhancing its versatility.

The technology behind the HP MCS includes advanced cooling methods such as direct evaporative cooling and chilled water cooling. Direct evaporative cooling utilizes the principles of evaporative heat exchange to cool air without excessive energy consumption, making it an eco-friendly choice. In contrast, chilled water cooling uses a network of pipes filled with chilled water to remove heat from the server environment efficiently. This combination allows the MCS to adapt to various heat loads and ambient conditions.

Another notable characteristic of the HP Modular Cooling System is its intelligent controls and sensors. These components continually monitor temperature and humidity levels within the data center, automatically adjusting cooling output to maintain optimal conditions. This proactive approach helps to prevent overheating, reduces energy usage, and ensures the longevity of IT equipment.

Energy efficiency is further enhanced through the MCS's integration with HP's monitoring and management software. This software analyzes cooling performance trends, providing actionable insights for facility managers, enabling them to make informed decisions regarding cooling strategies. Additionally, the system is designed with environmentally sustainable practices in mind, aligning with global initiatives to reduce carbon footprints and promote green technology.

The HP Modular Cooling System stands out for its combination of innovative technologies, flexibility, and a commitment to energy efficiency. As data centers continue to evolve, the MCS remains a crucial asset in the pursuit of optimized performance and sustainability, providing a reliable solution to meet the demanding cooling needs of modern IT infrastructure.