HP Modular Cooling System specification

HP Modular Cooling System manual MCS 5042 weight calculation Qty Component

Warning:

HP cannot assume responsibility for determining the suitability of a particular raised floor system. The customer or local agencies must determine installation requirements. An appropriate structural engineer must verify any floor system under consideration for a server installation.

Raised floor loading is a function of the floor manufacturer’s load specification and the positioning of the equipment relative to the raised floor grid. HP recommends the following guidelines:

•Some raised floor systems do not have grid stringers between floor stands. The lateral support for the floor stands depends on adjacent panels being in place. To avoid compromising this type of floor system while gaining under-floor access, remove only one floor panel at a time.

•Larger floor grids (bigger panels) are generally rated for lighter loads.

Table 3 can be used to calculate the weight load of each MCS 5042 unit, including installed equipment for proper floor planning. The text in blue is included as an example. Weights can vary.

Table 3: MCS 5042 weight calculation

		Qty.
Component	Unit weight	(Multiply by)	Total weight

MCS 5042 (with unpopulated server rack)	450 kg (992 lb)	1	450 kg (992 lb)

Component #1: HP ProLiant S6500 SL230s	91 kg (200 lb)	8	728 kg (1,600 lb)

Component #2:

Component #3:

Component #4:

Rack total:

Note:

The MCS 5042 has not been certified for seismic environments.

Table 4: Common floor loading terms

	Term	Description

	Dead load	The weight of the raised panel floor system, including the understructure.
		Expressed in lb/ft2 (kg/m2).
	Design load	The safe load that a floor panel can support on a 1 inch x 1-inch2(25 mm x 25 mm2) area at the
		panels weakest point (typically the center of the panel). This value is determined by taking the
		lesser value of the maximum load that can be applied without failure divided by a safety factor of
		two (ultimate load) or the load at which permanent damage begins to occur (yield point).

	Rolling load	The load a floor panel can support (without failure) when a wheel of specified diameter and
		width is rolled across the panel.

Note:

If the specific floor being evaluated or considered is a product other than a Tate All Steel 1250 System floor, you must contact the manufacturer of the floor to evaluate if it meets the requirements described in this section.

Modular Cooling System specifications

The HP Modular Cooling System (MCS) is a state-of-the-art solution designed to efficiently manage the heat generated by high-density IT environments. As data centers face the ever-increasing demand for processing power, traditional cooling methods often fall short, leading to inefficiencies and raised energy costs. The HP MCS addresses this issue with a scalable, flexible design that optimizes cooling performance while minimizing energy consumption.

One of the main features of the HP Modular Cooling System is its modular architecture, which allows for easy expansion and customization based on the specific needs of a data center. This scalability means that as a facility grows or changes, the cooling system can be modified without the need for extensive renovations or replacements. The MCS can be installed in various configurations, further enhancing its versatility.

The technology behind the HP MCS includes advanced cooling methods such as direct evaporative cooling and chilled water cooling. Direct evaporative cooling utilizes the principles of evaporative heat exchange to cool air without excessive energy consumption, making it an eco-friendly choice. In contrast, chilled water cooling uses a network of pipes filled with chilled water to remove heat from the server environment efficiently. This combination allows the MCS to adapt to various heat loads and ambient conditions.

Another notable characteristic of the HP Modular Cooling System is its intelligent controls and sensors. These components continually monitor temperature and humidity levels within the data center, automatically adjusting cooling output to maintain optimal conditions. This proactive approach helps to prevent overheating, reduces energy usage, and ensures the longevity of IT equipment.

Energy efficiency is further enhanced through the MCS's integration with HP's monitoring and management software. This software analyzes cooling performance trends, providing actionable insights for facility managers, enabling them to make informed decisions regarding cooling strategies. Additionally, the system is designed with environmentally sustainable practices in mind, aligning with global initiatives to reduce carbon footprints and promote green technology.

The HP Modular Cooling System stands out for its combination of innovative technologies, flexibility, and a commitment to energy efficiency. As data centers continue to evolve, the MCS remains a crucial asset in the pursuit of optimized performance and sustainability, providing a reliable solution to meet the demanding cooling needs of modern IT infrastructure.

Table 3: MCS 5042 weight calculation

Qty.

Component

Modular Cooling System specifications