HP Modular Cooling System manual MCS 5042 specifications, Physical specifications

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MCS 5042 specifications

Physical specifications

Table 1: MCS 5042 physical specifications of a standard single rack and server cabinet configuration

 

Packaged system

Unpackaged system

Unpackaged

Parameter

(as shipped on pallet)

(off pallet, unwrapped)

CTO system

 

 

 

 

Height

2285 mm (90 in)

2007 mm (79 in)

2007 mm (79 in)

 

 

 

 

Width

1219 mm (48 in)

904 mm (35.6 in)

904 mm (35.6 in)

 

 

 

 

Depth

1829 mm (72 in)

1510 mm (59.5 in)

1510 mm (59.5 in)

 

 

 

 

Weight

732 kg (1614 lb) 1

478 kg (1054 lb) 2

1521 kg (3353 lb) 3

1Weight for a completely packaged system with unpopulated server rack

2Weight for an unpackaged system with unpopulated server rack

3Approximate weight for an unpackaged CTO system (Actual weight varies, according to configuration.)

Note:

If the top shipping bracket interferes with deploying the MCS 5042, you can remove it. With the top shipping bracket, the total height of the unpackaged system is 2069 mm (81.5 inches).

Electrical specifications

Table 2: MCS 5042 electrical specifications

Parameter

Value

Comments

 

 

 

Operating voltage

208/230 VAC +/- 10%, 50/60 Hz

 

 

 

 

AC line phase

Single

 

 

 

 

Maximum input current

18 A

Per line cord

 

 

 

Maximum inrush current

200 A

Per line cord

 

 

 

Dropout/hold-up time at minimum line voltage

20 ms

 

 

 

 

Transfer time of AC transfer switch

2 s

 

 

 

 

Circuit breaker rating

LAHJ

Per cord

 

 

 

Power factor

> 0.95

At all loads

 

 

 

Ground leakage current

< 19.4 mA

Per line cord

 

 

 

Rated power consumption

2800W

Steady state

 

 

 

Power cords

208 V, 20 A

NEMA L6-20-to-Procon

(included with the MCS 5042)

 

700105 (Qty 2)

 

 

 

250 V, 16 A

IEC 309-to-Procon 700105

 

 

(Qty 2)

 

 

 

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Contents HP mc-Series 5042 Rack Site Preparation Guide Table of contentsSafety and regulatory information PrefaceNotational conventions Acronyms and abbreviations Japanese notice Safety in material handlingOverview MCS 5042 configuration optionsMCS 5042 air flow Product overviewKey MCS 5042 components MCS 5042 component locations Reference Water module Fan module AC transfer switch Physical specifications MCS 5042 specificationsOverview Facility planning for MCS 5042 implementationSpace and positioning considerations Page Page Page Page Page Page Page Page Page Page MCS 5042 weight calculation Qty Component Page Electrical considerations Central ground stud location inside the IT rack Raised floor grounding MCS 5042 power cords Nema L6-20-to-Procon-A5 Power Cord Single-source AC power connection Coolant source planning Dedicated chiller unit directly supplying the MCS Description Quantity Above the unit 280 cm 110 inches 300 cm 118 inches Shows the recommended facility piping approaches to the MCS MCS 5042 hose openings Page Page Page Page Page Recommended plumbing configuration for the MCS Pressure rating 400 psi WOG, 125psi WSP Page General thermal requirements Coolant requirementsCoolant implementation flow chart for one rack Page Approximate fan step at certain cooling capacity Page Page Page Page Page Before installing and running active components Environmental considerationsControl system Delivery survey form Appendix a Forms and checklistsPre-installation checklists Page Conversion factors for refrigeration Appendix B Conversion factors and formulasMetric equivalents KVA conversionsASL GlossaryTerm Description Typical power consumption Legal notices For more informationRestricted rights legend
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Modular Cooling System specifications

The HP Modular Cooling System (MCS) is a state-of-the-art solution designed to efficiently manage the heat generated by high-density IT environments. As data centers face the ever-increasing demand for processing power, traditional cooling methods often fall short, leading to inefficiencies and raised energy costs. The HP MCS addresses this issue with a scalable, flexible design that optimizes cooling performance while minimizing energy consumption.

One of the main features of the HP Modular Cooling System is its modular architecture, which allows for easy expansion and customization based on the specific needs of a data center. This scalability means that as a facility grows or changes, the cooling system can be modified without the need for extensive renovations or replacements. The MCS can be installed in various configurations, further enhancing its versatility.

The technology behind the HP MCS includes advanced cooling methods such as direct evaporative cooling and chilled water cooling. Direct evaporative cooling utilizes the principles of evaporative heat exchange to cool air without excessive energy consumption, making it an eco-friendly choice. In contrast, chilled water cooling uses a network of pipes filled with chilled water to remove heat from the server environment efficiently. This combination allows the MCS to adapt to various heat loads and ambient conditions.

Another notable characteristic of the HP Modular Cooling System is its intelligent controls and sensors. These components continually monitor temperature and humidity levels within the data center, automatically adjusting cooling output to maintain optimal conditions. This proactive approach helps to prevent overheating, reduces energy usage, and ensures the longevity of IT equipment.

Energy efficiency is further enhanced through the MCS's integration with HP's monitoring and management software. This software analyzes cooling performance trends, providing actionable insights for facility managers, enabling them to make informed decisions regarding cooling strategies. Additionally, the system is designed with environmentally sustainable practices in mind, aligning with global initiatives to reduce carbon footprints and promote green technology.

The HP Modular Cooling System stands out for its combination of innovative technologies, flexibility, and a commitment to energy efficiency. As data centers continue to evolve, the MCS remains a crucial asset in the pursuit of optimized performance and sustainability, providing a reliable solution to meet the demanding cooling needs of modern IT infrastructure.