HP Modular Cooling System manual Central ground stud location inside the IT rack

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Note:

The power requirements discussed in this guide are for the fans and electronics for the MCS 5042 only. Data processing components such as servers, storage, and network devices must be considered separately, based on individual power requirements.

System grounding

HP server systems require two methods of grounding: power distribution grounding for safety, and high-frequency signal grounding for equipment performance. Power distribution grounding involves the main building electrical service entrance, electrical conduit, facility power panels, and equipment cabinets (including the MCS 5042), which must be grounded, using green/yellow insulated wire conductors according to the applicable electrical codes. High-frequency grounding consists of using ground return conductors for intra-cabinet and inter-cabinet signal interconnects, as well as chassis and cabinet grounding.

For MCS 5042 and server systems installed on a raised floor, the floor assembly must be electrically grounded to form a complete ground grid. An optimum raised-floor grounding solution is shown in Figure 15.

Each floor panel must have at least one supporting pedestal grounded to the power panel and another pedestal grounded to the MCS 5042. The central ground connection of the MCS 5042 is located in the bottom rear of the IT rack. This broadband solution provides grounding for maximum safety and performance.

Figure 15: Central ground stud location inside the IT rack

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Contents HP mc-Series 5042 Rack Site Preparation Guide Table of contentsPreface Safety and regulatory informationNotational conventions Acronyms and abbreviations Japanese notice Safety in material handlingOverview MCS 5042 configuration optionsMCS 5042 air flow Product overviewKey MCS 5042 components MCS 5042 component locations Reference Water module Fan module AC transfer switch Physical specifications MCS 5042 specificationsOverview Facility planning for MCS 5042 implementationSpace and positioning considerations Page Page Page Page Page Page Page Page Page Page MCS 5042 weight calculation Qty Component Page Electrical considerations Central ground stud location inside the IT rack Raised floor grounding MCS 5042 power cords Nema L6-20-to-Procon-A5 Power Cord Single-source AC power connection Coolant source planning Dedicated chiller unit directly supplying the MCS Description Quantity Above the unit 280 cm 110 inches 300 cm 118 inches Shows the recommended facility piping approaches to the MCS MCS 5042 hose openings Page Page Page Page Page Recommended plumbing configuration for the MCS Pressure rating 400 psi WOG, 125psi WSP Page General thermal requirements Coolant requirementsCoolant implementation flow chart for one rack Page Approximate fan step at certain cooling capacity Page Page Page Page Page Environmental considerations Before installing and running active componentsControl system Delivery survey form Appendix a Forms and checklistsPre-installation checklists Page Conversion factors for refrigeration Appendix B Conversion factors and formulasMetric equivalents KVA conversionsASL GlossaryTerm Description Typical power consumption For more information Legal noticesRestricted rights legend
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Modular Cooling System specifications

The HP Modular Cooling System (MCS) is a state-of-the-art solution designed to efficiently manage the heat generated by high-density IT environments. As data centers face the ever-increasing demand for processing power, traditional cooling methods often fall short, leading to inefficiencies and raised energy costs. The HP MCS addresses this issue with a scalable, flexible design that optimizes cooling performance while minimizing energy consumption.

One of the main features of the HP Modular Cooling System is its modular architecture, which allows for easy expansion and customization based on the specific needs of a data center. This scalability means that as a facility grows or changes, the cooling system can be modified without the need for extensive renovations or replacements. The MCS can be installed in various configurations, further enhancing its versatility.

The technology behind the HP MCS includes advanced cooling methods such as direct evaporative cooling and chilled water cooling. Direct evaporative cooling utilizes the principles of evaporative heat exchange to cool air without excessive energy consumption, making it an eco-friendly choice. In contrast, chilled water cooling uses a network of pipes filled with chilled water to remove heat from the server environment efficiently. This combination allows the MCS to adapt to various heat loads and ambient conditions.

Another notable characteristic of the HP Modular Cooling System is its intelligent controls and sensors. These components continually monitor temperature and humidity levels within the data center, automatically adjusting cooling output to maintain optimal conditions. This proactive approach helps to prevent overheating, reduces energy usage, and ensures the longevity of IT equipment.

Energy efficiency is further enhanced through the MCS's integration with HP's monitoring and management software. This software analyzes cooling performance trends, providing actionable insights for facility managers, enabling them to make informed decisions regarding cooling strategies. Additionally, the system is designed with environmentally sustainable practices in mind, aligning with global initiatives to reduce carbon footprints and promote green technology.

The HP Modular Cooling System stands out for its combination of innovative technologies, flexibility, and a commitment to energy efficiency. As data centers continue to evolve, the MCS remains a crucial asset in the pursuit of optimized performance and sustainability, providing a reliable solution to meet the demanding cooling needs of modern IT infrastructure.