HP 5103 manual Grounding guidelines, Typical electrostatic voltage levels, Event 10% 40% 55%

Page 41

Grounding guidelines

Electrostatic discharge damage

Electronic components are sensitive to electrostatic discharge (ESD). Circuitry design and structure determine the degree of sensitivity. Networks built into many integrated circuits provide some protection, but in many cases, ESD contains enough power to alter device parameters or melt silicon junctions.

A discharge of static electricity from a finger or other conductor can destroy static-sensitive devices or microcircuitry. Even if the spark is neither felt nor heard, damage may have occurred.

An electronic device exposed to ESD may not be affected at all and can work perfectly throughout a normal cycle. Or the device may function normally for a while, then degrade in the internal layers, reducing its life expectancy.

CAUTION: To prevent damage to the device when you are removing or installing internal components, observe these precautions:

Keep components in their electrostatic-safe containers until you are ready to install them.

Use nonmagnetic tools.

Before touching an electronic component, discharge static electricity by using the guidelines described in this section.

Avoid touching pins, leads, and circuitry. Handle electronic components as little as possible.

If you remove a component, place it in an electrostatic-safe container.

The following table shows how humidity affects the electrostatic voltage levels generated by different activities.

CAUTION: A product can be degraded by as little as 700 V.

Typical electrostatic voltage levels

 

 

Relative humidity

 

 

 

 

 

Event

10%

40%

55%

 

 

 

 

Walking across carpet

35,000 V

15,000 V

7,500 V

 

 

 

 

Walking across vinyl floor

12,000 V

5,000 V

3,000 V

 

 

 

 

Motions of bench worker

6,000 V

800 V

400 V

 

 

 

 

Removing DIPS from plastic tube

2,000 V

700 V

400 V

 

 

 

 

Removing DIPS from vinyl tray

11,500 V

4,000 V

2,000 V

 

 

 

 

Removing DIPS from Styrofoam

14,500 V

5,000 V

3,500 V

 

 

 

 

Removing bubble pack from PCB

26,500 V

20,000 V

7,000 V

 

 

 

 

Packing PCBs in foam-lined box

21,000 V

11,000 V

5,000 V

 

 

 

 

Preliminary replacement requirements 33

Image 41
Contents HP Mini First Edition August Document Part Number Safety warning notice Iv Safety warning notice Table of contents SIM 121 Viii Product description Integrated Wpan Bluetooth module WirelessCategory Description Solid state drive SSDBattery Power requirements AC adapterOperating system Preinstalled Serviceability Customer Self-Replacement CSRExternal component identification Component Description Top componentsTouchPad Lights Buttons Control Panel System and Security Power OptionsFn key KeysFront components Right-side components Left-side components Display components Bottom components Carrying handle Wireless antennas Additional hardware components Illustrated parts catalog Service tagIllustrated parts catalog Device major componentsKeyboard, 25.7 cm 10.1 Device major componentsDescription Spare part number Speaker assembly includes cableWlan module 80-GB, SataBluetooth module Plastics kit with Bluetooth cableRTC battery Power button board includes cableDescription Spare part number Display bezel Display assembly componentsDisplay back cover includes logo Webcam moduleDisplay panel/webcam cable for use Screw kit Power cordMiscellaneous parts Spare part number Description Sequential part number listingSequential part number listing Illustrated parts catalog Webcam and Wwan option, red Illustrated parts catalog Preliminary replacement requirements Removal and replacement proceduresService considerations Tools requiredDrive handling Event 10% 40% 55% Grounding guidelinesTypical electrostatic voltage levels Packaging and transporting guidelines Material Use Voltage protection level Equipment guidelinesService tag Component replacement proceduresDevice feet Battery SIM Memory module Carrying Handle select models only Page Keyboard Page Page Page Page Page Page Mass storage devices Page Page Wlan module Keyboard see Keyboard on SIM module Top cover Page Page Remove the hard drive see Mass storage devices on SpeakerWwan module Page Description Spare part number RTC battery 507707-001 RTC batteryDescription Spare part number Bluetooth module 537921-001 Bluetooth modulePower button board Touch screen LCD panel Display assemblyDescription Spare part number Page Page Page Page Page Page Page FSB System boardPage Fan and heat sink assembly Page Page Computer Setup in Windows Computer SetupStarting Computer Setup Using Computer SetupRestoring factory settings in Computer Setup Select To do this Computer Setup menusUser Tools Security menuSystem Configuration menu Computer Setup Computer Setup in Windows 7 Computer Setup in Windows Vista Restoring factory settings in Computer Setup Computer Setup menus Security menu System Configuration menu Select Computer Setup Computer Setup in Windows Vista Computer Setup in Suse Linux Computer Setup in Suse Linux Security menu System Configuration menu Computer Setup Computer Setup in Suse Linux Device specifications SpecificationsDevice specifications Cm 4.93 Pixel resolutionCm 8.77 Number of colors25.7-cm10.1-in, WSVGA, AntiGlare display specifications Hard drive specifications Solid state drive specifications Select Start Computer System resource specificationsBacking up Backup and recoveryWindows 7 backup and recovery Select Start All Programs Maintenance Backup and Restore RecoveringPage Windows Vista backup and recovery Page Recovering Suse Linux backup and recovery Audio-in microphone Connector pin assignmentsPin Signal Audio-out headphone External monitor RJ-45 network Universal Serial Bus Requirements for all countries and regions Power cord set requirementsCountry/region Accredited agency Applicable note number Requirements for specific countries and regionsDisplay BatteryRecycling Page Page Page Page Page LAN IndexJacks SIM