EMI manual PISTON/ORIFICE Installation Instruction, CAC Cassette Preparation and Positioning

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PISTON/ORIFICE INSTALLATION INSTRUCTION

Evaporator

Importent - Replace the existing

 

piston (before installing the unit)

 

with the piston supplied in the Kit Bag:

 

when a CACA24 evaporator is matched with a

 

T2CA4400, T2CA2400, T2CA8400 or T3CA9240, T3CA2240,

 

T3CA9940 condenser which has a 24,000 Btuh compressor

 

(“4” in the capacity decoding field) the piston will need relacement

only on the 24,000 Btuh zone. *

Your EMI evaporator unit contains the appropriate piston for your model. Refer to this document to determine if a change is required based on your condenser rating. If your match is not listed below no piston change is required. (See chart)

Model #

Condenser

Factory Installed

Field Changeover

Evaporator

Btuh

Piston-Orifice Size

Piston-Orifice Size

 

T2CA4400

 

 

CACA24

T2CA2400

.059”

.063”

 

T2CA8400

 

 

 

T3CA9240

 

 

CACA24

T3CA2240

.059”

.063”

 

T3CA9940

 

 

*“4” in the capacity decoding field = 24,000 Btuh

CAC CASSETTE PREPARATION AND POSITIONING

POSITIONING

The Cassette installation position should be selected with the following points in mind:

1.Pipe work, electrical connections, con- trol box and condensate pump access panels should be readily accessible.

2.The unit should be positioned at least 5 ft. from a wall or similar obstruction. Position the unit as close to the center of the room as possible to insure air is distributed evenly.

3.Position the unit so that the discharge air does not blow directly on the thermostat.

4.The unit should not be positioned di- rectly above any obstructions.

6.There should be a minimum 1” clear- ance above the depth of the Cassette and the false ceiling for proper instal- lation, shown below (see the “CAC Di- mensions” section in the back of this IOM for cabinet sizing):

Figure #1

Dimension A + 1” = minimum space above the false ceiling for installation

A +1”

A

 

5.The condensate drain should have suf- ficient fall (1” per 10’) in any horizontal run between Cassette and drain. Maxi- mum condensate pump lift is 36”.

Small Cabinet Dimension A = 12¾” min. Medium Cabinet Dimension A = 11½” min. Large Cabinet Dimension A = 13½” min.

CAC Cassette Evaporator

6

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Contents INSTALLATION, Operation and Maintenance Manual Nominal Circuit CapacitiesTo the Installer Safety InstructionsCAC Cassette High Efficiency Evaporator Standard Features Product DescriptionSystem Options Preparation for Installation CAC Cassette Controls and ComponentsSmall Unit Shown Medium Unit ShownLarge Unit PISTON/ORIFICE Installation Instruction CAC Cassette Preparation and PositioningMounting the CAC Cassette Ceiling Evaporator Ceiling openingCAC Cassette Chassis Positioning and Installation MAXCorrect Incorrect Condensate PipingPiping DO’S and DON’TS Pipe Installation Notes Refrigeration PipingUse of a larger line can harm Compressor CAC Cassette Evaporator Fascia Installation Instructions Assembly InstructionsCAC Cassette Evaporator Installation Instructions Electrical WiringMake sure power is off High Volt Electrical Wiring Low Volt Interconnect WiringLOW Voltage Interconnect Wiring Start -UP for Wall Thermostat ControlFigure #4 Refrigerant Processing Important Notes CAC Cassette Evaporator Test Unit Performance Data Sheet Test Unit Performance DataMaintenance and Troubleshooting Procedure Troubleshooting Procedure Power Supply CheckLow Volt Controls Cooling Only UnitsElectric Heat Frequently Asked Questions How long will the fan run?Discharge AIR Volume CAC Performance DataCAC Cassette Dimensions Small Cabinet CAC 9,000 12,000Medium Cabinet CAC 18,000 24,000 Large Cabinet CAC 30,000 36,000 CAC Electrical Specifications CAC Cassette System MatchesT2C, T3C & T4C Top Discharge ALL Product Limited Warranty Enviromaster International LLCS1C & S1H Single Zone S2C Dual Zone EMI’S High Efficiency Product LineHigh Wall Evaporator T2C, T3C & T4C 2, 3 & 4 Zone Top Discharge

CAC specifications

EMI CAC, or Electromagnetic Interference Common-mode Current, is a critical concern in electronic device design and operation. It refers to the unwanted electromagnetic energy that can disrupt the normal functioning of electronic circuits, particularly in complex systems. EMI can arise from various sources, including power lines, radio frequency transmitters, and even other components within the same device.

One of the main features of EMI CAC is its dual nature. It can be both a source of interference and a metric to assess the integrity of electronic systems. The impacts of EMI are far-reaching, affecting communication signals, power supply reliability, and overall device performance. As technology progresses and devices become more compact, the likelihood of EMI issues increases, making it essential for engineers to develop effective solutions.

Several technologies are employed to mitigate EMI CAC in electronic systems. Shielding is one of the most common methods, involving the use of conductive materials to block electromagnetic fields. This can take the form of metal enclosures or coatings that prevent the escape of emissions. Another strategy involves the use of filters, such as ferrite beads and capacitors, which can suppress common-mode currents before they enter the sensitive parts of a circuit.

The characteristics of EMI CAC vary depending on several factors, including frequency, amplitude, and the specific environment in which the electronic devices operate. High-frequency EMI is particularly challenging due to its ability to penetrate enclosures and disrupt signals. Additionally, common-mode noise can often appear in differential signals, exacerbating the situation and making detection more difficult.

Achieving EMC (Electromagnetic Compatibility) is a major goal for designers dealing with EMI CAC. This involves not only reducing emissions from devices but also improving their immunity to external sources of interference. Effective grounding techniques and careful layout planning are crucial in minimizing EMI effects.

In summary, EMI CAC represents a significant challenge in modern electronics, with a need for advanced solutions to ensure device performance and reliability. By understanding its features, employing effective technologies for mitigation, and addressing its characteristics, engineers can create robust designs that thrive in the increasingly complex electromagnetic landscape of today’s technological world.