Viking CDMOS200, CVMOS200 service manual Microwave Measurement Procedure USA, Leakage test

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CDMOS200

DMOS200

VMOS200

CVMOS200

MICROWAVE MEASUREMENT PROCEDURE (USA)

A. Requirements:

1)Microwave leakage limit (Power density limit): The power density of microwave radiation emitted by a microwave oven should not exceed 1mW/cm2 at any point 5cm or more from the external surface of the oven, measured prior to acquisition by a purchaser, and thereafter (through the useful life of the oven), 5 mW/cm2 at any point 5cm or more from the external surface of the oven.

2)Safety interlock switches:

Primary interlock relay switch shall prevent microwave radiation emission in excess of the requirement as above mentioned. Secondary interlock relay and door sensing switch shall prevent microwave radiation emission in excess of 5 mW/cm2 at any point 5cm or more from the external surface of the oven.

B. Preparation for testing:

Before beginning the actual measurement of leakage, proceed as follows:

1) Make sure that the actual instrument is operating normally as specified in its instruction booklet.

Important:

Survey instruments that comply with the requirement for instrumentation as prescribed by the performance standard for microwave ovens, 21 CFR 1030.10(c)(3)(i), must be used for testing.

2)Place the oven tray in the oven cavity.

3)Place the load of 275±15 ml (9.8 oz) of tap water initially at 20±5 O C (68OF) in the center of the oven cavity.

The water container shall be a low form of 600 ml (20 oz) beaker with an inside diameter of approx. 8.5 cm (3-1/2 in.) and made of an electrically nonconductive material such as glass or plastic.

The placing of this standard load in the oven is important not only to protect the oven, but also to insure that any leakage is measured accurately.

4)Set the cooking control on Full Power Cooking Mode.

5)Close the door and select a cook cycle of several minutes. If the water begins to boil before the survey is completed, replace it with 275 ml of cool water.

C. Leakage test:

Closed-door leakage test (microwave measurement):

1)Grasp the probe of the survey instrument and hold it perpendicular to the gap between the door and the body of the oven.

2)Move the probe slowly, not faster than 1 in./sec. (2.5 cm/sec.) along the gap, watching for the maximum indication on the meter.

3)Check for leakage at the door screen, sheet metal seams and other accessible positions where the continuity of the metal has been breached (eg., around the switches, indicator, and vents).

While testing for leakage around the door, pull the door away from the front of the oven as far as is permitted by the closed latch assembly.

4)Measure carefully at the point of highest leakage and make sure that the highest leakage is no greater than 4mW/cm2, and that the primary interlock switch/secondary interlock relay does turn the oven OFF before any door movement.

NOTE: After servicing, record data on service invoice and microwave leakage report.

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Contents Table of Contents Models CDMOS200 VMOS200Before Servicing CDMOS200 VMOS200 CVMOS200 When the testing is completed Before ServicingRequirements Microwave Measurement Procedure CanadaLeakage test with enclosure installed Leakage test without enclosureMicrowave Measurement Procedure USA Leakage testIf provided, Vent Hood, Fan assembly, Cooling Fan Motor Viking Range CorporationMicrowave Ovens DMOS200 CDMOS200 VMOS200 CVMOS200 Foreword Description SpecificationGeneral Information Grounding InstructionsOven Diagram Move the Round Grounding Prong from this PlugVMOS200 model shown Description of Operating Sequence Power Level P-0 to P-90 CookingOperation OFF ConditionSensor Cooking Condition Cooking SequenceSchematic Door Closed Clock Appears on Display Imar Y IT C H C O Ndar Y S W IT C HDescription and Function of Components Troubleshooting Guide Problem Test ProceduresTest Procedure Procedure Letter Component Test Magnetron Assembly TestProcedure Letter Component Test Microwave Output PowerPower Transformer Test Magnetron Temperature Fuse Test Procedure Letter Component Test High Voltage Rectifier TestCavity Temperature Fuse Test High Voltage Capacitor TestSecondary Interlock System Test Door Sensing SwitchMonitor Switch Test Secondary Interlock Relay RY2Touch Control Panel Assembly Test Before testingBlown Monitor Fuse Test Test Procedures KEY Unit TestWeight 1ST Stage 2ND Stage Level Time Relay TestCompu Defrost Test Occurrence Cause or Correction Steps Occurrence Cause or CorrectionChecking the initial sensor cooking condition Testing Method for AH Sensor and /OR Control UnitAH Sensor Test Water load cooking testProcedure Letter Component Test Checking Control Unit Procedure Letter Component Test Noise Filter Test Measuring Point Indication of OHM-METERTouch Control Panel Assembly LSIIXA098DR Signal coming from touch key Signal synchronized with commercial power source frequencyKey strobe signal Signal similar to P17Pin No Power source voltage GND0VInternal clock oscillation frequency control input setting AH sensor inputSEG Segment data signalCommon data signal COM10 COM7 OUTAbsolute Humidity Sensor Circuit Structure of Absolute Humidity SensorOther Precautions Touch Control Panel ServicingServicing Tools Component Replacement and Adjustment Procedure Outer Case RemovalHigh Voltage Rectifier and High Voltage Capacitor Removal Power Transformer RemovalRe-install Magnetron RemovalOven Lamp and Lamp Socket Removal Positive Lock Connector NO-CASE Type RemovalControl Panel Assembly Removal Turntable Motor RemovalCooling FAN Motor Removal AH Sensor ReplacementRE-INSTALL RemovalDoor Replacement After adjustment, check the followingAfter any service, make sure of the following InstallationSealer Film Diagram HIG H Voltag E C OmponeFigure S-2 Power Unit Circuit Circuit Figure S-3 CPUUnitFigure S-5 Printed Wiring Board of Power Unit Cabinet Parts Parts ListElectric Parts Control Panel PartsDoor Parts MiscellaneousSCREWS,NUTS and Washers Oven and Cabinet Parts Control Panel Parts Door Parts Miscellaneous Packing and Accessories Copyright 2002 by Viking
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CVMOS200, CDMOS200, DMOS200, VMOS200 specifications

The Viking VMOS200, DMOS200, CDMOS200, and CVMOS200 are advanced products designed for telecommunications and power management applications. Each model showcases unique features and technologies that make them stand out in their respective fields.

The VMOS200 is built on the vertical MOSFET technology, allowing for optimized performance in high-power applications. This device excels in switching capabilities and minimizing conduction losses, leading to improved efficiency. The VMOS200 is ideal for use in power amplifiers and high-frequency applications, where reliable performance and thermal stability are crucial. Its rugged design ensures that it can withstand harsh environments, making it a preferred choice for industrial and aerospace applications.

Next, the DMOS200 employs a double-diffused MOSFET technology, which enhances its thermal performance and power handling capabilities. This model is particularly effective in low-voltage applications where efficiency is paramount. The DMOS200 features a low on-resistance characteristic, allowing for reduced energy loss during operation. Its fast switching speed enables high-frequency operation, making it suitable for RF amplifiers and motor drives.

The CDMOS200 introduces a charge-balanced design, optimizing the allocation of charge carriers within the device to minimize heat generation and improve efficiency. This model is tailored for demanding applications in communications where signal integrity and power efficiency are critical. With its high breakdown voltage and robust construction, the CDMOS200 can handle more demanding operational conditions, making it popular in cellular and satellite communication systems.

Lastly, the CVMOS200 combines the advantages of vertical and charge-balanced technologies, offering a versatile solution for a broad range of applications. This hybrid design provides high efficiency, exceptional reliability, and enhanced thermal management. The CVMOS200 is particularly well-suited for switching power supplies and audio amplification. Its compact footprint allows for integration into space-constrained designs while maintaining high performance.

In summary, the Viking series of devices—VMOS200, DMOS200, CDMOS200, and CVMOS200—offer a range of features, technologies, and characteristics tailored to meet the demands of modern power electronics and telecommunications. With their robust designs, high efficiency, and adaptability to various applications, these devices are integral components for engineers and designers looking to create cutting-edge technological solutions.