Viking VMOS200 Signal synchronized with commercial power source frequency, Key strobe signal

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CDMOS200

DMOS200

VMOS200

CVMOS200

Pin No.

Signal

I/O

Description

 

34

INT0

IN

Signal synchronized with commercial power source frequency.

 

 

 

 

This is the basic timing for time processing of LSI.

 

H : GND

 

 

 

 

 

 

 

 

 

 

L : -5V

 

 

 

 

16.7 msec.

 

 

 

 

 

 

 

35

P07

OUT

Key strobe signal.

 

 

 

 

Signal applied to touch-key section. A pulse signal is input to AIN7, P14, P15, P16 and

 

 

 

P17 terminal while one of G1 line keys on key matrix is touched.

 

 

 

 

 

 

 

36

P06

OUT

Key strobe signal.

 

 

 

 

Signal applied to touch-key section. A pulse signal is input to AIN7, P14, P15, P16 and

 

 

 

P17 terminal while one of G2 line keys on key matrix is touched.

 

 

 

 

 

 

 

37

P05

OUT

Key strobe signal.

 

 

 

 

Signal applied to touch-key section. A pulse signal is input to AIN7, P14, P15, P16 and

 

 

 

P17 terminal while one of G3 line keys on key matrix is touched.

 

 

 

 

 

 

 

38

P04

OUT

Key strobe signal.

 

 

 

 

Signal applied to touch-key section. A pulse signal is input to AIN7, P14, P15, P16 and

 

 

 

P17 terminal while one of G4 line keys on key matrix is touched.

 

 

 

 

 

 

 

39

P03

OUT

Key strobe signal.

 

 

 

 

Signal applied to touch-key section. A pulse signal is input to AIN7, P14, P15, P16 and

 

 

 

P17 terminal while one of G5 line keys on key matrix is touched.

 

 

 

 

 

 

 

40

P02

OUT

Key strobe signal.

 

 

 

 

Signal applied to touch-key section. A pulse signal is input to AIN6, AIN7, P14, P15, P16

 

 

 

and P17 terminal while one of G6 line keys on key matrix is touched.

 

 

 

 

 

 

 

41

P01

OUT

Key strobe signal.

 

 

 

 

Signal applied to touch-key section. A pulse signal is input to AIN7, P14, P15, P16 and

 

 

 

P17 terminal while one of G7 line keys on key matrix is touched.

 

 

 

 

 

 

 

42

P00

OUT

Key strobe signal.

 

 

 

 

Signal applied to touch-key section. A pulse signal is input to AIN7, P14, P15, P16 and

 

 

 

P17 terminal while one of G8 line keys on key matrix is touched.

 

 

 

 

 

 

 

43

P17

OUT

Signal coming from touch key.

 

 

 

 

When either G9 line on key matrix is touched, a corresponding signal out of P00-P07 will

 

 

 

be input into P17. When no key is touched, the signal is held at "H" level.

 

 

 

 

 

 

 

44

P16

IN

Signal similar to P17.

 

 

 

 

When either G10 line on key matrix is touched, a corresponding signal will be input into

 

 

 

P16.

 

 

 

 

 

 

 

45

P15

IN

Signal similar to P17.

 

 

 

 

When either G11 line on key matrix is touched, a corresponding signal will be input into

 

 

 

P15.

 

 

 

 

 

 

 

46

P14

IN

Signal similar to P17.

 

 

 

 

When either G12 line on key matrix is touched, a corresponding signal will be input into

 

 

 

P14.

 

 

 

 

 

 

 

47

AIN7

IN

Signal similar to P17.

 

 

 

 

When either G13 line on key matrix is touched, a corresponding signal will be input into

 

 

 

AIN7.

 

 

 

 

 

 

 

48

AIN6

IN

Input terminal to judge the model.

 

 

 

 

The signal out of P02 will be input into AIN6 through G6 line on key matrix. The LSI will

 

 

 

judge the model by this signal.

 

 

 

 

 

 

 

26

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Contents Table of Contents Models CDMOS200 VMOS200Before Servicing CDMOS200 VMOS200 CVMOS200 When the testing is completed Before ServicingMicrowave Measurement Procedure Canada Leakage test with enclosure installedRequirements Leakage test without enclosureMicrowave Measurement Procedure USA Leakage testViking Range Corporation If provided, Vent Hood, Fan assembly, Cooling Fan MotorMicrowave Ovens DMOS200 CDMOS200 VMOS200 CVMOS200 Foreword Specification General InformationDescription Grounding InstructionsMove the Round Grounding Prong from this Plug Oven DiagramVMOS200 model shown Power Level P-0 to P-90 Cooking OperationDescription of Operating Sequence OFF ConditionSensor Cooking Condition Cooking SequenceSchematic Door Closed Clock Appears on Display Imar Y IT C H C O Ndar Y S W IT C HDescription and Function of Components Troubleshooting Guide Test Procedures Test ProcedureProblem Procedure Letter Component Test Magnetron Assembly TestMicrowave Output Power Procedure Letter Component TestPower Transformer Test Procedure Letter Component Test High Voltage Rectifier Test Cavity Temperature Fuse TestMagnetron Temperature Fuse Test High Voltage Capacitor TestDoor Sensing Switch Monitor Switch TestSecondary Interlock System Test Secondary Interlock Relay RY2Before testing Touch Control Panel Assembly TestBlown Monitor Fuse Test Test Procedures KEY Unit TestRelay Test Weight 1ST Stage 2ND Stage Level TimeCompu Defrost Test Occurrence Cause or Correction Steps Occurrence Cause or CorrectionTesting Method for AH Sensor and /OR Control Unit AH Sensor TestChecking the initial sensor cooking condition Water load cooking testProcedure Letter Component Test Checking Control Unit Procedure Letter Component Test Noise Filter Test Measuring Point Indication of OHM-METERTouch Control Panel Assembly LSIIXA098DR Signal synchronized with commercial power source frequency Key strobe signalSignal coming from touch key Signal similar to P17Power source voltage GND0V Internal clock oscillation frequency control input settingPin No AH sensor inputSegment data signal Common data signal COM10SEG COM7 OUTAbsolute Humidity Sensor Circuit Structure of Absolute Humidity SensorTouch Control Panel Servicing Other PrecautionsServicing Tools Component Replacement and Adjustment Procedure Outer Case RemovalPower Transformer Removal Re-installHigh Voltage Rectifier and High Voltage Capacitor Removal Magnetron RemovalPositive Lock Connector NO-CASE Type Removal Control Panel Assembly RemovalOven Lamp and Lamp Socket Removal Turntable Motor RemovalAH Sensor Replacement RE-INSTALLCooling FAN Motor Removal RemovalDoor Replacement After adjustment, check the followingInstallation After any service, make sure of the followingSealer Film Diagram HIG H Voltag E C OmponeFigure S-2 Power Unit Circuit Circuit Figure S-3 CPUUnitFigure S-5 Printed Wiring Board of Power Unit Parts List Electric PartsCabinet Parts Control Panel PartsMiscellaneous Door PartsSCREWS,NUTS and Washers Oven and Cabinet Parts Control Panel Parts Door Parts Miscellaneous Packing and Accessories Copyright 2002 by Viking
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Manual 45 pages 12.01 Kb

CVMOS200, CDMOS200, DMOS200, VMOS200 specifications

The Viking VMOS200, DMOS200, CDMOS200, and CVMOS200 are advanced products designed for telecommunications and power management applications. Each model showcases unique features and technologies that make them stand out in their respective fields.

The VMOS200 is built on the vertical MOSFET technology, allowing for optimized performance in high-power applications. This device excels in switching capabilities and minimizing conduction losses, leading to improved efficiency. The VMOS200 is ideal for use in power amplifiers and high-frequency applications, where reliable performance and thermal stability are crucial. Its rugged design ensures that it can withstand harsh environments, making it a preferred choice for industrial and aerospace applications.

Next, the DMOS200 employs a double-diffused MOSFET technology, which enhances its thermal performance and power handling capabilities. This model is particularly effective in low-voltage applications where efficiency is paramount. The DMOS200 features a low on-resistance characteristic, allowing for reduced energy loss during operation. Its fast switching speed enables high-frequency operation, making it suitable for RF amplifiers and motor drives.

The CDMOS200 introduces a charge-balanced design, optimizing the allocation of charge carriers within the device to minimize heat generation and improve efficiency. This model is tailored for demanding applications in communications where signal integrity and power efficiency are critical. With its high breakdown voltage and robust construction, the CDMOS200 can handle more demanding operational conditions, making it popular in cellular and satellite communication systems.

Lastly, the CVMOS200 combines the advantages of vertical and charge-balanced technologies, offering a versatile solution for a broad range of applications. This hybrid design provides high efficiency, exceptional reliability, and enhanced thermal management. The CVMOS200 is particularly well-suited for switching power supplies and audio amplification. Its compact footprint allows for integration into space-constrained designs while maintaining high performance.

In summary, the Viking series of devices—VMOS200, DMOS200, CDMOS200, and CVMOS200—offer a range of features, technologies, and characteristics tailored to meet the demands of modern power electronics and telecommunications. With their robust designs, high efficiency, and adaptability to various applications, these devices are integral components for engineers and designers looking to create cutting-edge technological solutions.
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