Philips TFA9843AJ manuals
Home Audio > Stereo Amplifier
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Very often issues with Philips TFA9843AJ begin only after the warranty period ends and you may want to find how to repair it or just do some service work.
Even oftener it is hard to remember what does each function in Stereo Amplifier Philips TFA9843AJ is responsible for and what options to choose for expected result.
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19 pages 121.65 Kb
1. General description 2. Features 3. Applications TFA9843AJRev. 01 28 April 2006 Preliminary data sheet 20 W stereo power amplier with volume control20 W stereo power amplier with volume control 2 4. Quick reference data5. Ordering information =18V; T = 0 V; measured in test circuit of Figure 11; Philips Semiconductors TFA9843AJ 3 6. Block diagramTFA9843AJ Fig 2. Pin conguration Fig 1. Block diagram 7.1 Pinning 7. Pinning informationPhilips Semiconductors TFA9843AJ 7.2 Pin description 4 8. Functional description8.1 Input conguration 8.2 Power amplier8.2.1 Output power measurement 8.2.2 Headroom 5 8.3 Mode selection8.4 Supply voltage ripple rejection 8.5 Built-in protection circuits 6 9. Limiting values10. Thermal characteristics 7 11. Static characteristics12. Dynamic characteristics =18V; T = 0 V; measured in test circuit of Figure 11; =18V; T ; f = 1 kHz; V ; measured in test circuit of Figure 11;Preliminary data sheet Rev. 01 28 April 2006 8 of 19 8 Philips Semiconductors TFA9843AJ4 function of frequency supply voltage for various loads 60 20 012 28 VCC (V) P (W) RL = 1 8 3 2 VCC = 18 V; f = 1 kHz; RL = 4 VCC = 18 V; Po = 1 W; RL = 4 Preliminary data sheet Rev. 01 28 April 2006 9 of 19 9 Philips Semiconductors TFA9843AJTHD = 10 %; RL = 4 ; f = 1 kHz VCC = 18 V; RL = 4 frequency 10 13. Application information14 14. Test informationFig 16. Junction temperature as a function of supply voltage 14.1 Quality information is applicable. General Quality Specication for Integrated Circuits, SNW-FQ-611 15 15. Package outlineFig 17. Package outline SOT523-1 (DBS9P) DBS9P: plastic DIL-bent-SIL power package; 9 leads (lead length 12/11 mm); exposed die pad SOT523-1 16 16. Soldering16.1 Introduction to soldering through-hole mount packagesData Handbook IC26; Integrated Circuit Packages 16.2 Soldering by dipping or by solder wave 16.3 Manual soldering 16.4 Package related soldering information 18 18. Legal information18.1 Data sheet status 18.2 Denitions 18.3 Disclaimers 18.4 Trademarks 19. Contact information 19 20. Contents
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