3Com Router 5000 and Router 6000 v2.41

Chapter 3

Module Guide

Multifunctional Interface Modules (Router 5000)

In addition, a 75-ohm to 120-ohm adapter is provided. For the pinouts of cables, see Low-End and Mid-Range Series Routers Cable Manual.

3.8.5 Internal DIP Switches

Router 2 and 4-Port CE1/PRI MIM and modules provide internal DIP switches, and the setting of DIP switches decides the interface impedance and grounding mode.

Table 3-21Correlation between DIP switches of Router 2 and 4-Port CE1/PRI MIM and modules and E1 interface

Module

DIP

S1

 

switch

 

 

 

 

 

 

E1

Interface

 

interface

0

 

 

 

 

2-port

4-port

 

 

 

 

S1

S3

S4

S5

 

 

 

 

Interface

Interface

Interface

Interface

0

1

2

3

 

 

 

 

By default, all the DIP switches for Router 2 and 4-Port CE1/PRI MIM and modules are set to ON, as illustrated in the following figure:

on 1

2

3

4

5

6

7

8

Figure 3-44Default setting of DIP switches for Router 2 and 4-Port CE1/PRI MIM and modules

Description of DIP switch settings is given in the following table for Router 2 and 4-Port CE1/PRI MIM and modules:

Table 3-22Description of DIP switch settings of Router 2 and 4-Port CE1/PRI MIM and modules

 

DIP

 

 

Description

 

 

Configuration of

 

 

Configuration of

 

 

 

 

 

 

75-ohm impedance

 

 

120-ohm impedance

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

1BIT

 

75-ohm/120-ohm

 

ON

 

OFF

 

 

 

 

selection switch

 

 

 

 

 

 

 

2BIT

 

 

ON

 

OFF

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

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3Com 3C13701 3C13751 3C13755 3C13759 3C13840 3C13880 manual Internal DIP Switches

3C13751, 3C13701, 3C13840, 3C13759, 3C13880 specifications

The 3Com 3C13880 and 3C13840 are notable components within the realm of networking technology, primarily designed for enterprise-grade solutions. These devices belong to the 3Com family, which has long been recognized for its commitment to developing robust networking products tailored to facilitate efficient data transfers and improve connectivity across various platforms.

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