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30 CHAPTER 2: I/O AND APPLICATION MODULES
Table 26 3C17511 module specifications
| Item | Specification |
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| SDRAM | 128 MB/256 MB |
| Physical dimensions (W x D) | 366.7 x 340 mm(14.4 x 13.4 in.) |
| Max power consumption | 45 W |
| Number of ports | One |
| Connector | XENPAK/SC |
| Rate | 10 Gbps |
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Panel and LEDs Figure 12 3C17511 module panel |
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The 3C17511 module has two port LEDs for the 10GE port on its panel.
Table 27 Port LEDs on the 3C17511 module
LED | Status | Meaning |
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LINK | OFF | No link is present. |
| Green ON | A link is present. |
ACT | OFF | No packets are transmitted/received on the port. |
| Orange blinking | Packets are being transmitted/received on the port. |
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Matching Cable See Table 64 on page 45 for the XENPAK optical modules available to the 10GE XENPAK/SC optical/electrical port on the 3C17511 module and their matching cable types, which you can select as required.
3C17512 2-port 10GBASE-X (XFP) Module
This section provides specifications for the
Specifications The 3C17512 modules provide two
Table 28 3C17512 module specifications
Item | Specification |
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CPU | MPC8245 |
Boot ROM | 512 KB |
SDRAM | 128 MB/256MB |
Physical dimensions (W x D) | 366.7 x 340 mm (14.4 x 13.4 in.) |
Max power consumption | 87 W |
Number of ports | Two |
Connector | XFP |
Rate | 10 Gbps |
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