Acer 4553 Wireless Module Specification, LAN Module Specification, Bluetooth Specification, Hgst

Wireless Module

	Item				Specification
Manufacturer			• Atheros HB93, Broadcomm 43225, Atheros HB97,
				Atheros HB95BG
Specifications			• IEEE 802.11b/g and Draft-N1 compliant
			• Advanced security via 802.11i
			• Industry-leading power consumption
			• Includes Wi-Fi PAN – Intel® My WiFi Technology
			• Easy to use Intel® PROSet v12.5 WLAN Software
			• Advanced IT capabilities with Intel® PROSet
				Software4
			• Support for Cisco Compatible Extensions* v4
			• Connect with Intel® Centrino® program eligible
LAN Module
	Item				Specification
Chipset			• Atheros AR8151 GbE LAN Controller with Integrated
				Transceiver
Specifications			• Integrated PHY for 10/100/1000 Mbps
			• Supports automatic MDI/MDIX functions
			• PCI Express base 1.1 compliant
			• Wake on LAN support
			• 256 byte memory (using eFuse) embedded on chip
			• Supports up to 25% over-clocking without requiring
				BIOS support
			• Supports Energy Star 5.0
			• Small footprint 40-pin QFN (5 x 5 mm) package
				with dramatically improved thermal and electrical
				characteristics over LQFP packaging
Bluetooth
	Item				Specification
Chipset			T60H928.33 miniUSB module
Data throughput
Protocol			2.1
Interface			USB 2.0
Connector type			8 pin narrow pitch connector
Hard Disk Drive Interface
Item					Specification
Capacity (MB)				160
Vendor &	Seagate	HGST			Toshiba	WD	Samsung
Model Name
Bytes per				512
sector
Data heads	2				1
Drive Format
Disks	1				1

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