AG Neovo TSC-40/IC 6-4. Small group packaging

TSC-40/IC Product Specification

6-3-3. Diagram for packaging box sizes

6-4. Small group packaging

6-4-1. Packaging type

General packaging (No damp-proof processing)

6-4-2. Packaging quantity specification

Quantity per tray Number of trays Quantity per packages

250 1 to 8 +1(cover) 1 - 1999

Desiccant

Number of trays: 1 to 8

(Additionally, one dummy tray pl

aced at the top for reinforcing)

ir cap

Product name label

ntistatic bag

L: 330 W: 152 D: 75 (mm)

* No sizes specified for packaging box (Cardboard

box) used for transportation.

Contents

Main Page 1. PRODUCTS OUTLINE 1-1. Scope of Application 1-2. Outline 1-3. Features 1-4. General specification 2. Pin layout and representation INDEX Marking specification TSC-40x xxx #### 3. Pin functions Page 4. Initial setting 4-1. EEPROM setting 4-2. Touch screen mode setting 4-3. Power supply voltage setting 5. Data sheet 5-1. Absolute maximum rating Document No. DER-S0026A 9 Version 1.2 2008 DMC Co., Ltd. TSC-40/IC Product Specification 5-2. Recommended operational conditions (Vcc=3.3 to 5.5V, Vss=0V, Ta=-20 to 85C, unless otherwise noted) 5-3. Timing requirement Document No. DER-S0026A 11 Version 1.2 2008 DMC Co., Ltd. TSC-40/IC Product Specification 5-4. DC standards (Vcc=3.3 to 5.5V, Vss=0V, Ta=-20 to 85C, unless otherwise noted) 6. Packaging Specification 6-1. Outline 6-2. Notes on storage/handling 6-3. Basic packaging 6-4. Small group packaging 6-5. Tray specification 6-6. Product name label specification 7. Storage Specification 7-1. Storage Conditions 7-2. Baking 8. Implementation Temperature Specification 1. Reflow method (Infrared reflow, air reflow) 2. Wave soldering method (Flow soldering, solder dip method) 3. Soldering iron (Manual soldering) 9. Terminal Pin Specification 10. Cleaning 11. Changes and improvements 11-1. Version history 12. Warranty 12-1. Warranty Period 12-2. Warranty Target 12-3. Warranty Exceptions 13. Notes on use 13-1. Overall handling 13-2. Others