AG Neovo TSC-40/IC TSC-40x xxx ####

TSC-40/IC Product Specification

2. Pin layout and representation

Marking specification

TSC-40x Product number x: version number

xxx ROM number

#### Lot number

INDEX

SEL4/EEP-CS 16

SEL3/EEP-CLK 15

SEL2/EEP-DI 14

LED1 13

P30 12

VSS 11

XOUT 10

XIN 9

18 SYD/LL

19 SYU/UL

20 SXL/UR

21 SXR/LR

22 THO

23 THI

24 RxD_I 1AN2

2AN3

3SEL1

4EEP-DO

5VREF

6RST

7CNVSS

8VCC

SEL0 25

RxD 26

TxD 27

SW1 28

SW0 29

BEEP 30

AN0 31

AN1 32

TSC-40xxxx####

Contents

Main Page 1. PRODUCTS OUTLINE 1-1. Scope of Application 1-2. Outline 1-3. Features 1-4. General specification 2. Pin layout and representation INDEX Marking specification TSC-40x xxx #### 3. Pin functions Page 4. Initial setting 4-1. EEPROM setting 4-2. Touch screen mode setting 4-3. Power supply voltage setting 5. Data sheet 5-1. Absolute maximum rating Document No. DER-S0026A 9 Version 1.2 2008 DMC Co., Ltd. TSC-40/IC Product Specification 5-2. Recommended operational conditions (Vcc=3.3 to 5.5V, Vss=0V, Ta=-20 to 85C, unless otherwise noted) 5-3. Timing requirement Document No. DER-S0026A 11 Version 1.2 2008 DMC Co., Ltd. TSC-40/IC Product Specification 5-4. DC standards (Vcc=3.3 to 5.5V, Vss=0V, Ta=-20 to 85C, unless otherwise noted) 6. Packaging Specification 6-1. Outline 6-2. Notes on storage/handling 6-3. Basic packaging 6-4. Small group packaging 6-5. Tray specification 6-6. Product name label specification 7. Storage Specification 7-1. Storage Conditions 7-2. Baking 8. Implementation Temperature Specification 1. Reflow method (Infrared reflow, air reflow) 2. Wave soldering method (Flow soldering, solder dip method) 3. Soldering iron (Manual soldering) 9. Terminal Pin Specification 10. Cleaning 11. Changes and improvements 11-1. Version history 12. Warranty 12-1. Warranty Period 12-2. Warranty Target 12-3. Warranty Exceptions 13. Notes on use 13-1. Overall handling 13-2. Others