AG Neovo TSC-40/IC Implementation Temperature Specification, Soldering iron Manual soldering

TSC-40/IC Product Specification

8. Implementation Temperature Specification

1. Reflow method (Infrared reflow, air reflow)

Frequency:	Three times or less
Temperature:	The following device surface temperature profile is recommended.

Package’s surface temperature

175±15 °C

260 °C max.

255 °C or above, 10-16s max.

220 °C or above, 60s max.

1 to 4 °C/s

110±30s

Time

	Figure 1: Infrared reflow, air reflow temperature profile
2. Wave soldering method (Flow soldering, solder dip method)
Frequency:	One time or less
Temperature:	Following temperature profile is recommended (Set the optimal preheat temperature
	according to the flux type)

Temperature

10s max. (Primary + Secondary flow

passage duration) 260 °C max.

80 to 150 °C (Package surface temperature)

Time

Figure 2: Wave soldering temperature profile

3. Soldering iron (Manual soldering)

Soldering bit’s temperature:		370 °C or lower
Soldering time:	Five seconds or less/terminal

Document No. DER-S0026A 16 Version 1.2 ©2008 DMC Co., Ltd.