Builder’s Guide for AMD Opteron™ | 30925 Rev. 3.04 February 2004 |
Servers and Workstations |
|
•Cables inside the enclosure can cause airflow disruptions. Using cable ties, tie and route the cables out of the path of the cooling airflow.
•For tower chassis, choose a chassis with power supplies that have both
•When the system is in a tower chassis, there must be clear space in front of the chassis to allow cool airflow in and space behind the chassis for the heated air to flow out.
•Rear fans should exhaust air in the same
•Front intake fans may not be of significant benefit to cooling a tower chassis, and should not be relied upon as the sole fan in a system.
•Testing done by the AMD thermal engineers has shown that the airflow pattern in Figure 21 is more desirable than the airflow pattern seen in Figure 22 on page 31.
•When the bottom inlet power supply is used, nearly all the air flows near or through the area of the processor. As a result, the processor remains cooler.
5.1.3Power Supply Considerations
Because heatsinks are heat radiators, like the radiator in an automobile, they need airflow to function properly. Figure 21 shows desirable airflow through a chassis. Both desirable configurations use a
Figure 21. Desirable Airflow—Power Supply with Bottom Inlet
30 | Hardware Considerations | Chapter 5 |
